Inventor · disambiguated record
Hiroji Aga
Also filed as: AGA HIROJI
45 granted patents·12 pending applications·1,080 citations·filing 1996–2023
98Inventor score
Files withSHINETSU HANDOTAI KK44AGA HIROJI4KOBAYASHI NORIHIRO2SHIN ETSU HANDOTAI CO LTD2SOITEC SILICON ON INSULATOR2
Top patents by PatentIndex Score
57 records- 0199US6372609B1Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the methodSHINETSU HANDOTAI KK·Filed 1999·Granted Apr 16, 2002·512 cites·16 claims
- 0291US7288418B2Process for treating substrates for the microelectronics industry, and substrates obtained by this processSOITEC SILICON ON INSULATOR·Filed 2006·Granted Oct 30, 2007·20 cites·20 claims
- 0391US6140210AMethod of fabricating an SOI wafer and SOI wafer fabricated therebySHINETSU HANDOTAI KK·Filed 1998·Granted Oct 31, 2000·111 cites·8 claims
- 0488US6846718B1Method for producing SOI wafer and SOI waferSHINETSU HANDOTAI KK·Filed 2000·Granted Jan 25, 2005·42 cites·3 claims
- 0586US6284628B1Method of recycling a delaminated wafer and a silicon wafer used for the recyclingSHINETSU HANDOTAI KK·Filed 1999·Granted Sep 4, 2001·100 cites·14 claims
- 0683US7029993B1Method for treating substrates for microelectronics and substrates obtained according to said methodSOITEC SILICON ON INSULATOR·Filed 2000·Granted Apr 18, 2006·31 cites·22 claims
- 0782US6884696B2Method for producing bonding waferSHINETSU HANDOTAI KK·Filed 2002·Granted Apr 26, 2005·36 cites·17 claims
- 0880US6380551B2Optical function device with photonic band gap and/or filtering characteristicsSHINETSU HANDOTAI KK·Filed 1999·Granted Apr 30, 2002·49 cites·32 claims
- 0979US6362076B1Method of fabricating an SOI wafer by hydrogen ion delamination without independent bonding heat treatmentSHINETSU HANDOTAI KK·Filed 1999·Granted Mar 26, 2002·54 cites·5 claims
- 1075US9793154B2Method for manufacturing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2015·Granted Oct 17, 2017·2 cites·8 claims
- 1168US6998329B2SOI wafer producing method, and wafer separating jigSHINETSU HANDOTAI KK·Filed 2002·Granted Feb 14, 2006·15 cites·10 claims
- 1267US7320929B2Method of fabricating SOI waferSHINETSU HANDOTAI KK·Filed 2003·Granted Jan 22, 2008·14 cites·11 claims
- 1365US8691665B2Method for producing bonded waferOKA SATOSHI·Filed 2010·Granted Apr 8, 2014·2 cites·8 claims
- 1465US8173521B2Method for manufacturing bonded waferKOBAYASHI NORIHIRO·Filed 2008·Granted May 8, 2012·3 cites·16 claims
- 1565US6239004B1Method of forming oxide film on an SOI layer and method of fabricating a bonded waferSHINETSU HANDOTAI KK·Filed 1998·Granted May 29, 2001·30 cites·10 claims
- 1664US9337080B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2013·Granted May 10, 2016·1 cites·15 claims
- 1764US8097523B2Method for manufacturing bonded waferKOBAYASHI NORIHIRO·Filed 2009·Granted Jan 17, 2012·3 cites·6 claims
- 1864US7902042B2Method of manufacturing SOI wafer and thus-manufactured SOI waferSHINETSU HANDOTAI KK·Filed 2005·Granted Mar 8, 2011·2 cites·15 claims
- 1963US9076840B2Method for manufacturing a bonded SOI waferSHINETSU HANDOTAI KK·Filed 2012·Granted Jul 7, 2015·1 cites·4 claims
- 2059US8728912B2Method for manufacturing SOI waferAGA HIROJI·Filed 2011·Granted May 20, 2014·1 cites·2 claims
- 2159US7176102B2Method for producing SOI wafer and SOI waferSHINETSU HANDOTAI KK·Filed 2004·Granted Feb 13, 2007·8 cites·3 claims
- 2255US6238990B1Method for heat treatment of SOI wafer and SOI wafer heat-treated by the methodSHINETSU HANDOTAI KK·Filed 1998·Granted May 29, 2001·19 cites·4 claims
- 2354US2025273587A1Substrate for electronic device and method for producing the sameSHIN ETSU HANDOTAI CO LTD·Filed 2023·Application pending·0 cites
- 2453US7560313B2SOI wafer and method for producing the sameSHINETSU HANDOTAI KK·Filed 2002·Granted Jul 14, 2009·4 cites·1 claims
- 2553US2025031421A1Substrate for electronic device and method for producing the sameSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 2652US6897124B2Method of manufacturing a bonded wafers using a Bernoulli chuckSHINETSU HANDOTAI KK·Filed 2002·Granted May 24, 2005·5 cites·12 claims
- 2749US2007054459A1SOI wafer and method for producing the sameSHINETSU HANDOTAI KK·Filed 2006·Application pending·0 cites
- 2848US9679800B2Method for manufacturing bonded waferSHINETSU HANDOTAI KK·Filed 2014·Granted Jun 13, 2017·0 cites·10 claims
- 2947US9865497B2Method for manufacturing bonded waferSHINETSU HANDOTAI KK·Filed 2014·Granted Jan 9, 2018·0 cites·6 claims
- 3047US9859149B2Method of producing bonded wafer with uniform thickness distributionSHINETSU HANDOTAI KK·Filed 2014·Granted Jan 2, 2018·0 cites·4 claims
- 3147US9378999B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2013·Granted Jun 28, 2016·0 cites·18 claims
- 3247US8202787B2Method for manufacturing SOI waferISHIZUKA TOHRU·Filed 2009·Granted Jun 19, 2012·0 cites·16 claims
- 3347US5998281ASOI wafer and method for the preparation thereofSHINETSU HANDOTAI KK·Filed 1996·Granted Dec 7, 1999·14 cites·4 claims
- 3447US2011151643A1Method for manufacturing bonded waferSHINETSU HANDOTAI KK·Filed 2009·Application pending·0 cites
- 3546US2006185581A1Method for producing a semiconductor waferSHINETSU HANDOTAI KK·Filed 2006·Application pending·0 cites
- 3645US9673085B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2013·Granted Jun 6, 2017·0 cites·11 claims
- 3745US7524744B2Method of producing SOI wafer and SOI waferSHINETSU HANDOTAI KK·Filed 2004·Granted Apr 28, 2009·1 cites·5 claims
- 3844US9240344B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2012·Granted Jan 19, 2016·0 cites·20 claims
- 3944US9093497B2Method for manufacturing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2012·Granted Jul 28, 2015·0 cites·16 claims
- 4044US9029240B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2013·Granted May 12, 2015·0 cites·19 claims
- 4144US7959731B2Method for producing semiconductor waferSHINETSU HANDOTAI KK·Filed 2005·Granted Jun 14, 2011·0 cites·13 claims
- 4244US2015340279A1Method for manufacturing soi wafer and soi waferSHINETSU HANDOTAI KK·Filed 2013·Application pending·0 cites
- 4343US11244851B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2018·Granted Feb 8, 2022·0 cites·5 claims
- 4443US10490440B2Method for manufacturing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2017·Granted Nov 26, 2019·0 cites·2 claims
- 4542US10115580B2Method for manufacturing an SOI waferSHINETSU HANDOTAI KK·Filed 2015·Granted Oct 30, 2018·0 cites·22 claims
- 4642US8962352B2Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI waferYOKOKAWA ISAO·Filed 2012·Granted Feb 24, 2015·0 cites·8 claims
- 4742US2004063298A1Method for producing SOI wafer and SOI waferSHINETSU HANDOTAI KK·Filed 2003·Application pending·0 cites
- 4841US7521334B2Method for producing direct bonded wafer and direct bonded waferSHINETSU HANDOTAI KK·Filed 2005·Granted Apr 21, 2009·0 cites·22 claims
- 4939US10204824B2Method for producing SOI waferSHINETSU HANDOTAI KK·Filed 2016·Granted Feb 12, 2019·0 cites·3 claims
- 5039US9773694B2Method for manufacturing bonded waferSHINETSU HANDOTAI KK·Filed 2015·Granted Sep 26, 2017·0 cites·8 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →