Inventor · disambiguated record
Hichem M'Saad
Also filed as: LEE PETER WAI MAN · M'SAAD HICHEM
77 granted patents·48 pending applications·5,018 citations·filing 1997–2024
99Inventor score
Files withAPPLIED MATERIALS INC94ASM IP HOLDING BV5PADHI DEENESH5BALSEANU MIHAELA4JANAKIRAMAN KARTHIK2
Top patents by PatentIndex Score
125 records- 0198US10774423B2Tunable ground planes in plasma chambersAPPLIED MATERIALS INC·Filed 2014·Granted Sep 15, 2020·41 cites·20 claims
- 0298US8445075B2Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectricsXU HUIWEN·Filed 2010·Granted May 21, 2013·517 cites·10 claims
- 0398US8138104B2Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cureBALSEANU MIHAELA·Filed 2007·Granted Mar 20, 2012·479 cites·18 claims
- 0498US8129290B2Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cureBALSEANU MIHAELA·Filed 2006·Granted Mar 6, 2012·492 cites·16 claims
- 0598US7501355B2Decreasing the etch rate of silicon nitride by carbon additionAPPLIED MATERIALS INC·Filed 2006·Granted Mar 10, 2009·492 cites·6 claims
- 0698US7018941B2Post treatment of low k dielectric filmsAPPLIED MATERIALS INC·Filed 2004·Granted Mar 28, 2006·674 cites·20 claims
- 0797US7871926B2Methods and systems for forming at least one dielectric layerAPPLIED MATERIALS INC·Filed 2007·Granted Jan 18, 2011·77 cites·17 claims
- 0897US7692171B2Apparatus and method for exposing a substrate to UV radiation using asymmetric reflectorsKASZUBA ANDRZEI·Filed 2007·Granted Apr 6, 2010·471 cites·26 claims
- 0997US7572337B2Blocker plate bypass to distribute gases in a chemical vapor deposition systemAPPLIED MATERIALS INC·Filed 2005·Granted Aug 11, 2009·43 cites·15 claims
- 1097US6013584AMethods and apparatus for forming HDP-CVD PSG film used for advanced pre-metal dielectric layer applicationsAPPLIED MATERIALS INC·Filed 1997·Granted Jan 11, 2000·360 cites·22 claims
- 1196US7663121B2High efficiency UV curing systemAPPLIED MATERIALS INC·Filed 2006·Granted Feb 16, 2010·38 cites·12 claims
- 1296US7049200B2Method for forming a low thermal budget spacerAPPLIED MATERIALS INC·Filed 2004·Granted May 23, 2006·233 cites·20 claims
- 1395US7112541B2In-situ oxide capping after CVD low k depositionAPPLIED MATERIALS INC·Filed 2004·Granted Sep 26, 2006·64 cites·20 claims
- 1495US7064078B2Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemeAPPLIED MATERIALS INC·Filed 2004·Granted Jun 20, 2006·114 cites·23 claims
- 1594US6121161AReduction of mobile ion and metal contamination in HDP-CVD chambers using chamber seasoning film depositionsAPPLIED MATERIALS INC·Filed 1999·Granted Sep 19, 2000·119 cites·8 claims
- 1693US7407893B2Liquid precursors for the CVD deposition of amorphous carbon filmsAPPLIED MATERIALS INC·Filed 2005·Granted Aug 5, 2008·33 cites·20 claims
- 1792US8043870B2CMP pad thickness and profile monitoring systemAPPLIED MATERIALS INC·Filed 2009·Granted Oct 25, 2011·18 cites·20 claims
- 1892US7718081B2Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemesAPPLIED MATERIALS INC·Filed 2006·Granted May 18, 2010·17 cites·20 claims
- 1992US7678662B2Memory cell having stressed layersAPPLIED MATERIALS INC·Filed 2006·Granted Mar 16, 2010·22 cites·6 claims
- 2092US7425716B2Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to a large area electron beamAPPLIED MATERIALS INC·Filed 2006·Granted Sep 16, 2008·14 cites·27 claims
- 2192US7030041B2Adhesion improvement for low k dielectricsAPPLIED MATERIALS INC·Filed 2004·Granted Apr 18, 2006·45 cites·20 claims
- 2292US6713390B2Barrier layer deposition using HDP-CVDAPPLIED MATERIALS INC·Filed 2002·Granted Mar 30, 2004·62 cites·21 claims
- 2392US6399489B1Barrier layer deposition using HDP-CVDAPPLIED MATERIALS INC·Filed 1999·Granted Jun 4, 2002·110 cites·25 claims
- 2491US7566655B2Integration process for fabricating stressed transistor structureAPPLIED MATERIALS INC·Filed 2006·Granted Jul 28, 2009·20 cites·12 claims
- 2589US7867578B2Method for depositing an amorphous carbon film with improved density and step coverageAPPLIED MATERIALS INC·Filed 2006·Granted Jan 11, 2011·12 cites·14 claims
- 2687US7780865B2Method to improve the step coverage and pattern loading for dielectric filmsAPPLIED MATERIALS INC·Filed 2007·Granted Aug 24, 2010·12 cites·19 claims
- 2787US7259111B2Interface engineering to improve adhesion between low k stacksAPPLIED MATERIALS INC·Filed 2005·Granted Aug 21, 2007·14 cites·17 claims
- 2886US8084105B2Method of depositing boron nitride and boron nitride-derived materialsHUH JEONG-UK·Filed 2007·Granted Dec 27, 2011·8 cites·17 claims
- 2986US7670924B2Air gap integration schemeAPPLIED MATERIALS INC·Filed 2008·Granted Mar 2, 2010·22 cites·18 claims
- 3086US6927178B2Nitrogen-free dielectric anti-reflective coating and hardmaskAPPLIED MATERIALS INC·Filed 2003·Granted Aug 9, 2005·32 cites·20 claims
- 3186US6853043B2Nitrogen-free antireflective coating for use with photolithographic patterningAPPLIED MATERIALS INC·Filed 2002·Granted Feb 8, 2005·41 cites·32 claims
- 3285US8389376B2Air gap integration schemeDEMOS ALEXANDROS T·Filed 2010·Granted Mar 5, 2013·4 cites·20 claims
- 3385US7501354B2Formation of low K material utilizing process having readily cleaned by-productsAPPLIED MATERIALS INC·Filed 2005·Granted Mar 10, 2009·6 cites·10 claims
- 3484US8753989B2Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cureBALSEANU MIHAELA·Filed 2012·Granted Jun 17, 2014·5 cites·14 claims
- 3584US8282734B2Methods to improve the in-film defectivity of PECVD amorphous carbon filmsPADHI DEENESH·Filed 2008·Granted Oct 9, 2012·6 cites·8 claims
- 3684US7699935B2Method and system for supplying a cleaning gas into a process chamberAPPLIED MATERIALS INC·Filed 2008·Granted Apr 20, 2010·3 cites·6 claims
- 3784US7166544B2Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursorsAPPLIED MATERIALS INC·Filed 2004·Granted Jan 23, 2007·20 cites·22 claims
- 3883US7790635B2Method to increase the compressive stress of PECVD dielectric filmsAPPLIED MATERIALS INC·Filed 2006·Granted Sep 7, 2010·8 cites·24 claims
- 3983US7732342B2Method to increase the compressive stress of PECVD silicon nitride filmsAPPLIED MATERIALS INC·Filed 2006·Granted Jun 8, 2010·10 cites·13 claims
- 4083US7704816B2Boron derived materials deposition methodAPPLIED MATERIALS INC·Filed 2008·Granted Apr 27, 2010·8 cites·12 claims
- 4182US7638440B2Method of depositing an amorphous carbon film for etch hardmask applicationAPPLIED MATERIALS INC·Filed 2004·Granted Dec 29, 2009·27 cites·28 claims
- 4282US7611996B2Multi-stage curing of low K nano-porous filmsAPPLIED MATERIALS INC·Filed 2005·Granted Nov 3, 2009·10 cites·7 claims
- 4381US7718548B2Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interfaceAPPLIED MATERIALS INC·Filed 2007·Granted May 18, 2010·11 cites·16 claims
- 4480US10094486B2Method and system for supplying a cleaning gas into a process chamberAPPLIED MATERIALS INC·Filed 2015·Granted Oct 9, 2018·1 cites·14 claims
- 4580US7777197B2Vacuum reaction chamber with x-lamp heaterAPPLIED MATERIALS INC·Filed 2006·Granted Aug 17, 2010·7 cites·20 claims
- 4679US12006572B2Reactor system including a gas distribution assembly for use with activated species and method of using sameASM IP HOLDING BV·Filed 2020·Granted Jun 11, 2024·1 cites·25 claims
- 4779US7514125B2Methods to improve the in-film defectivity of PECVD amorphous carbon filmsAPPLIED MATERIALS INC·Filed 2007·Granted Apr 7, 2009·2 cites·7 claims
- 4879US6926926B2Silicon carbide deposited by high density plasma chemical-vapor deposition with biasAPPLIED MATERIALS INC·Filed 2001·Granted Aug 9, 2005·21 cites·18 claims
- 4977US6413871B2Nitrogen treatment of polished halogen-doped silicon glassAPPLIED MATERIALS INC·Filed 1999·Granted Jul 2, 2002·40 cites·18 claims
- 5076US7951730B2Decreasing the etch rate of silicon nitride by carbon additionAPPLIED MATERIALS INC·Filed 2009·Granted May 31, 2011·4 cites·14 claims
Showing the top 50 of 125 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →