Inventor · disambiguated record
Hidekazu Nakayama
Also filed as: NAKAYAMA HIDEKAZU
16 granted patents·6 pending applications·2 citations·filing 2013–2023
84Inventor score
Top patents by PatentIndex Score
22 records- 0169US10266734B2Curable composition, cured product, method for using curable composition, and optical deviceLINTEC CORP·Filed 2015·Granted Apr 23, 2019·2 cites·14 claims
- 0254US2023018086A1Film-shaped firing material, film-shaped firing material with support sheet, multilayer body, and method for producing deviceLINTEC CORP·Filed 2020·Application pending·0 cites
- 0354US2015240133A1Adhesive agent composition and adhesive sheetLINTEC CORP·Filed 2013·Application pending·0 cites
- 0453US12288768B2Method of manufacturing laminateLINTEC CORP·Filed 2020·Granted Apr 29, 2025·0 cites·14 claims
- 0553US11389927B2Processing apparatusDISCO CORP·Filed 2019·Granted Jul 19, 2022·0 cites·14 claims
- 0652US10745559B2Curable composition, method for producing curable composition, cured product, and use of curable compositionLINTEC CORP·Filed 2016·Granted Aug 18, 2020·0 cites·13 claims
- 0750US12406960B2Method of manufacturing laminate by sinter- bonding semiconductor chip and substrateLINTEC CORP·Filed 2020·Granted Sep 2, 2025·0 cites·10 claims
- 0850US11948865B2Film-shaped firing material and film-shaped firing material with a support sheetLINTEC CORP·Filed 2019·Granted Apr 2, 2024·0 cites·4 claims
- 0950US11267992B2Film-shaped firing material and film-shaped firing material with support sheetLINTEC CORP·Filed 2018·Granted Mar 8, 2022·0 cites·8 claims
- 1048US10920117B2Curable composition, method for producing curable composition, cured product, use of curable composition, and optical deviceLINTEC CORP·Filed 2016·Granted Feb 16, 2021·0 cites·14 claims
- 1147US2022066625A1Processing apparatusDISCO CORP·Filed 2021·Application pending·0 cites
- 1247US2022134504A1Wafer grinding methodDISCO CORP·Filed 2021·Application pending·0 cites
- 1346US10308850B2Curable composition, method for manufacturing curable composition, cured product, method for using curable composition, and optical deviceLINTEC CORP·Filed 2015·Granted Jun 4, 2019·0 cites·14 claims
- 1445US11420255B2Film-shaped firing material and film-shaped firing material with a support sheetLINTEC CORP·Filed 2018·Granted Aug 23, 2022·0 cites·5 claims
- 1545US2025206989A1Film-shaped sintering material for heating and pressurization, and method for producing semiconductor deviceLINTEC CORP·Filed 2023·Application pending·0 cites
- 1642US11285536B2Film-shaped fired material, and film-shaped fired material with support sheetLINTEC CORP·Filed 2018·Granted Mar 29, 2022·0 cites·11 claims
- 1740US10294398B2Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical deviceLINTEC CORP·Filed 2015·Granted May 21, 2019·0 cites·14 claims
- 1840US9963624B2Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical deviceLINTEC CORP·Filed 2015·Granted May 8, 2018·0 cites·14 claims
- 1939US11315899B2Die bonding material, light-emitting device, and method for producing light-emitting deviceLINTEC CORP·Filed 2020·Granted Apr 26, 2022·0 cites·15 claims
- 2037US11219946B2Firing material composition, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material with support sheetLINTEC CORP·Filed 2018·Granted Jan 11, 2022·0 cites·6 claims
- 2137US10774249B2Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical deviceLINTEC CORP·Filed 2015·Granted Sep 15, 2020·0 cites·15 claims
- 2237US2020262029A1Grinding apparatusDISCO CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →