Inventor · disambiguated record
Hoonjoo Na
Also filed as: NA HOONJOO
43 granted patents·6 pending applications·78 citations·filing 2009–2025
97Inventor score
Top patents by PatentIndex Score
49 records- 0197US11380607B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 5, 2022·4 cites·20 claims
- 0296US11749587B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 5, 2023·3 cites·20 claims
- 0396US11721628B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·10 cites·20 claims
- 0494US11749586B2Semiconductor device including through via structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·3 cites·20 claims
- 0594US10461167B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 29, 2019·18 cites·20 claims
- 0693US10475898B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·8 cites·20 claims
- 0792US12142588B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 12, 2024·1 cites·19 claims
- 0890US11362067B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·3 cites·20 claims
- 0988US10892342B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 12, 2021·2 cites·20 claims
- 1086US12136602B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 5, 2024·1 cites·16 claims
- 1183US2025038141A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1282US10615264B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 7, 2020·2 cites·20 claims
- 1382US9991357B2Semiconductor devices with gate electrodes on separate sets of high-k dielectric layersSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 5, 2018·4 cites·19 claims
- 1481US12334477B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1581US8309411B2Semiconductor device and method of fabricating the sameNA HOONJOO·Filed 2011·Granted Nov 13, 2012·7 cites·16 claims
- 1681US2025293212A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1780US11152317B2Semiconductor device including interconnection structure including copper and tin and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·17 claims
- 1879US11348892B2Semiconductor devices including bonding layer and adsorption layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·1 cites·19 claims
- 1979US2025022823A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2078US11594443B2Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 28, 2023·1 cites·19 claims
- 2176US12021080B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 2276US9786759B2Semiconductor device having multiwork function gate patternsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 10, 2017·3 cites·20 claims
- 2374US12167596B2Three-dimensional semiconductor devices and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 2474US11616036B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 28, 2023·0 cites·20 claims
- 2573US11121131B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·1 cites·20 claims
- 2671US11887966B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·20 claims
- 2770US12300671B2Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 2869US12046538B2Semiconductor device including through via structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 2969US11742351B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 3068US11296045B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 5, 2022·0 cites·18 claims
- 3168US2025062262A1Semiconductor device and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3267USRE49538ESemiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 30, 2023·0 cites·25 claims
- 3365US11824035B2Method of manufacturing a semiconductor device including bonding layer and adsorption layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·18 claims
- 3464US8044469B2Semiconductor device and associated methodsSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 25, 2011·2 cites·9 claims
- 3562US11552096B2Three-dimensional semiconductor devices and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 3659US11810900B2Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·18 claims
- 3758US12166000B2Semiconductor device including a lower chip including a peripheral circuit and first and second memory chips vertically stacked thereon and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 3857US8633546B2Semiconductor devicePARK HONGBAE·Filed 2012·Granted Jan 21, 2014·1 cites·20 claims
- 3957US8183141B2Methods of forming semiconductor devicesHYUN SANGJIN·Filed 2009·Granted May 22, 2012·1 cites·16 claims
- 4052US12347768B2Semiconductor device including via structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·22 claims
- 4152US12317572B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 4251US8766366B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Jul 1, 2014·0 cites·5 claims
- 4350US11658139B2Semiconductor package for improving bonding reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 4450US10950470B2Substrate bonding apparatus and bonding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·12 claims
- 4548US11887841B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·12 claims
- 4647US11728197B2Wafer to wafer bonding apparatus and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·19 claims
- 4746US2018026112A1Semiconductor device having multiwork function gate patternsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 4845US8278168B2Methods of forming a semiconductor devicePARK HONGBAE·Filed 2011·Granted Oct 2, 2012·0 cites·9 claims
- 4942US2012214296A1Methods of Forming Semiconductor DevicesHYUN SANGJIN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →