Inventor · disambiguated record
Hsin-Yu Chen
Also filed as: CHEN HSIN · CHEN HSIN Y · CHEN HSIN-YU
156 granted patents·60 pending applications·848 citations·filing 1996–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD58UNITED MICROELECTRONICS CORP49CHEN HSIN-YU18ADVANCED RISC MACH LTD10GOOGLE LLC9
Top patents by PatentIndex Score
216 records- 0198US8803316B2TSV structures and methods for forming the sameLIN YUNG-CHI·Filed 2011·Granted Aug 12, 2014·381 cites·20 claims
- 0297US11581422B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Feb 14, 2023·3 cites·1 claims
- 0397US11527638B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 13, 2022·3 cites·9 claims
- 0497US10008578B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 26, 2018·17 cites·8 claims
- 0597US9953880B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 24, 2018·20 cites·12 claims
- 0697US9748190B2Low cost and ultra-thin chip on wafer on substrate (CoWoS) formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·25 cites·21 claims
- 0797US9502519B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·19 cites·19 claims
- 0896US11789360B2Photomask assembly and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·2 cites·20 claims
- 0995US12094870B2Electrostatic discharge circuits and methods for operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·2 cites·20 claims
- 1095US11798936B2Electrostatic discharge circuits and methods for operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·3 cites·20 claims
- 1195US10943993B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Mar 9, 2021·7 cites·9 claims
- 1294US11782284B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·2 cites·20 claims
- 1394US9972623B1Semiconductor device including barrier layer and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 15, 2018·10 cites·3 claims
- 1494US9554059B1Exposure control system and associated exposure control methodQUANTA COMP INC·Filed 2015·Granted Jan 24, 2017·14 cites·12 claims
- 1593US8956966B2TSV structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 17, 2015·11 cites·20 claims
- 1692US11854452B2Seamless transition for multiple display refresh ratesGOOGLE LLC·Filed 2019·Granted Dec 26, 2023·7 cites·20 claims
- 1792US11726342B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·1 cites·20 claims
- 1892US11392024B2Photomask assembly and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·2 cites·20 claims
- 1991US11861928B2Optical sensor and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 2, 2024·1 cites·20 claims
- 2089US11454820B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 27, 2022·5 cites·20 claims
- 2189US11017142B1Methods and apparatuses of configurable integrated circuitsADVANCED RISC MACH LTD·Filed 2020·Granted May 25, 2021·3 cites·20 claims
- 2289US10153210B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·5 cites·12 claims
- 2389US10141228B1FinFET device having single diffusion break structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 27, 2018·4 cites·6 claims
- 2489US9627268B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 18, 2017·5 cites·5 claims
- 2589US8673775B2Methods of forming semiconductor structuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 18, 2014·8 cites·17 claims
- 2689US2024413225A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2789US2025015165A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2888US9449898B2Semiconductor device having backside interconnect structure through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·6 cites·20 claims
- 2987US12237329B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Feb 25, 2025·0 cites·19 claims
- 3087US9871102B2Method of forming a single-crystal nanowire finFETUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 16, 2018·4 cites·11 claims
- 3187US9786580B2Self-alignment for redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 10, 2017·8 cites·17 claims
- 3287US9252110B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 2, 2016·6 cites·20 claims
- 3387US8922004B2Copper bump structures having sidewall protection layersLIN JING-CHENG·Filed 2010·Granted Dec 30, 2014·9 cites·20 claims
- 3487US8518823B2Through silicon via and method of forming the sameHUANG KUO-HSIUNG·Filed 2011·Granted Aug 27, 2013·14 cites·5 claims
- 3586US12453186B2Electrostatic discharge circuits and methods for operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
- 3686US12068597B2Power clamp deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 20, 2024·1 cites·20 claims
- 3786US10290604B2Substrateless integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·4 cites·20 claims
- 3886US8830783B2Improving read stability of a semiconductor memoryIDGUNJI SACHIN SATISH·Filed 2011·Granted Sep 9, 2014·13 cites·16 claims
- 3986US8748066B2Method for forming photomasksUNITED MICROELECTRONICS CORP·Filed 2012·Granted Jun 10, 2014·4 cites·19 claims
- 4085US12242181B2Photomask assembly and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 4185US11448891B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·3 cites·20 claims
- 4285US11415878B2Pellicle frame with stress relief trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·1 cites·20 claims
- 4385US10510641B2Semiconductor device having backside interconnect structure on through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·3 cites·18 claims
- 4485US2025353736A1Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4585US2025266325A1Semiconductor Device Having Backside Interconnect Structure on Through Substrate ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4684US12322680B2Semiconductor device having backside interconnect structure on through substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 4784US12130551B2Pellicle frame with stress relief trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 4884US8567837B2Reconfigurable guide pin design for centering wafers having different sizesCHANG HSIN·Filed 2010·Granted Oct 29, 2013·6 cites·13 claims
- 4984US5803282AVacuum indicator for a bottleFiled 1996·Granted Sep 8, 1998·74 cites·4 claims
- 5084US2024361609A1Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 216 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →