Inventor · disambiguated record
Hsien-Pin Hu
Also filed as: HU HSIEN-PIN
83 granted patents·19 pending applications·3,490 citations·filing 2004–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD77TAIWAN SEMICONDUCTOR MFG12HU HSIEN-PIN4YEN HSIAO-TSUNG2CHIU TZU WEI1
Top patents by PatentIndex Score
102 records- 0199US11417580B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·9 cites·20 claims
- 0299US10153222B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·79 cites·20 claims
- 0399US9818720B2Structure and formation method for chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 14, 2017·53 cites·20 claims
- 0499US9806058B2Chip package having die structures of different heights and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·60 cites·20 claims
- 0599US9372206B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·1.8k cites·20 claims
- 0698US11728254B2Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·11 cites·20 claims
- 0798US10663512B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·8 cites·14 claims
- 0898US10175294B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·14 cites·20 claims
- 0998US10163856B2Stacked integrated circuit structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·22 cites·19 claims
- 1098US9299649B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 29, 2016·902 cites·22 claims
- 1198US9128123B2Interposer test structures and methodsLIU TZUAN-HORNG·Filed 2011·Granted Sep 8, 2015·31 cites·20 claims
- 1298US8105875B1Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2010·Granted Jan 31, 2012·192 cites·13 claims
- 1397US12266612B2Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·2 cites·20 claims
- 1497US11456287B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·5 cites·20 claims
- 1597US10319699B2Chip package having die structures of different heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·21 cites·20 claims
- 1697US9618572B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 11, 2017·9 cites·20 claims
- 1797US9589857B2Interposer test structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 7, 2017·8 cites·20 claims
- 1897US9116203B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 25, 2015·13 cites·20 claims
- 1997US8797057B2Testing of semiconductor chips with microbumpsWU WEI-CHENG·Filed 2011·Granted Aug 5, 2014·17 cites·20 claims
- 2096US11810833B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·3 cites·20 claims
- 2196US11569172B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·3 cites·20 claims
- 2296US11169207B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 9, 2021·3 cites·20 claims
- 2396US11069539B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·3 cites·20 claims
- 2496US10535633B2Chip package having die structures of different heights and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·14 cites·20 claims
- 2596US8896094B2Methods and apparatus for inductors and transformers in packagesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 25, 2014·28 cites·17 claims
- 2695US11062971B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·12 cites·20 claims
- 2795US8362591B2Integrated circuits and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·23 cites·14 claims
- 2894US11923310B2Package structure including through via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
- 2994US8471358B23D inductor and transformerYEN HSIAO-TSUNG·Filed 2010·Granted Jun 25, 2013·16 cites·17 claims
- 3093US11854990B2Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 3193US10770365B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 8, 2020·6 cites·20 claims
- 3293US10269584B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·7 cites·19 claims
- 3393US8759150B2Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2012·Granted Jun 24, 2014·13 cites·13 claims
- 3493US8319349B2Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2012·Granted Nov 27, 2012·13 cites·16 claims
- 3592US11967546B2Giga interposer integration through Chip-On-Wafer-On-SubstrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 23, 2024·1 cites·20 claims
- 3691US10090213B2Interposer test structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 2, 2018·3 cites·20 claims
- 3790US10297550B23D IC architecture with interposer and interconnect structure for bonding diesHU HSIEN PIN·Filed 2010·Granted May 21, 2019·10 cites·20 claims
- 3890US9385079B2Methods for forming stacked capacitors with fuse protectionTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·14 cites·20 claims
- 3989US8872345B2Forming grounded through-silicon vias in a semiconductor substrateHSIEH CHI-CHUN·Filed 2011·Granted Oct 28, 2014·14 cites·35 claims
- 4088US11101260B2Method of forming a dummy die of an integrated circuit having an embedded annular structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·4 cites·20 claims
- 4188US10665474B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 26, 2020·3 cites·20 claims
- 4288US8502338B2Through-substrate via waveguidesYEN HSIAO-TSUNG·Filed 2010·Granted Aug 6, 2013·10 cites·11 claims
- 4387US11088079B2Package structure having line connected via portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·4 cites·20 claims
- 4487US2025054879A1Forming large chips through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4586US2025349747A1Chiplet interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4686US2024387393A1Method for Forming a Semiconductor Device Having TSV Formed Through a Silicon Interposer and a Second Silicon Substrate with Cavity Covering a Second DieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4785US12294002B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 6, 2025·0 cites·20 claims
- 4885US9741669B2Forming large chips through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·3 cites·20 claims
- 4984US2024387385A1Semiconductor Devices and Methods of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5083US12243824B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
Showing the top 50 of 102 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →