Inventor · disambiguated record
Hubert Benzel
Also filed as: BENZEL HUBERT
73 granted patents·17 pending applications·524 citations·filing 1994–2015
99Inventor score
Top patents by PatentIndex Score
90 records- 0192US7354786B2Sensor element with trenched cavityBOSCH GMBH ROBERT·Filed 2005·Granted Apr 8, 2008·27 cites·11 claims
- 0289US9926188B2Sensor unit including a decoupling structure and manufacturing method thereforBOSCH GMBH ROBERT·Filed 2015·Granted Mar 27, 2018·7 cites·29 claims
- 0388US8470631B2Method for manufacturing capped MEMS componentsKRAMER TORSTEN·Filed 2010·Granted Jun 25, 2013·10 cites·5 claims
- 0487US7555956B2Micromechanical device having two sensor patternsBOSCH GMBH ROBERT·Filed 2006·Granted Jul 7, 2009·18 cites·6 claims
- 0587US5792957ACapacitive pressure sensors with high linearity by optimizing electrode boundariesENDRESS HAUSER GMBH CO·Filed 1994·Granted Aug 11, 1998·62 cites·1 claims
- 0686US7479232B2Method for producing a semiconductor component and a semiconductor component produced according to the methodBOSCH GMBH ROBERT·Filed 2005·Granted Jan 20, 2009·8 cites·29 claims
- 0785US6803637B2Micromechanical component with different doping types so that one type is anodized into porous siliconBOSCH GMBH ROBERT·Filed 2001·Granted Oct 12, 2004·37 cites·17 claims
- 0883US7563634B2Method for mounting semiconductor chips, and corresponding semiconductor chip systemBOSCH GMBH ROBERT·Filed 2005·Granted Jul 21, 2009·11 cites·19 claims
- 0981US8429977B2Micromechanical pressure-sensor element and method for its productionAHLES MARCUS·Filed 2011·Granted Apr 30, 2013·6 cites·11 claims
- 1081US8123963B2Method for producing a semiconductor component and a semiconductor component produced according to the methodBENZEL HUBERT·Filed 2008·Granted Feb 28, 2012·5 cites·23 claims
- 1181US7093493B2Pressure sensor having a silicon chip on a steel diaphragmBOSCH GMBH ROBERT·Filed 2005·Granted Aug 22, 2006·15 cites·19 claims
- 1281US7037438B2Method for production of a semiconductor component and a semiconductor component produced by said methodBOSCH GMBH ROBERT·Filed 2001·Granted May 2, 2006·18 cites·24 claims
- 1377US7918136B2Micromechanical sensor elementBOSCH GMBH ROBERT·Filed 2006·Granted Apr 5, 2011·10 cites·31 claims
- 1473US9632104B2Sensor, method for producing a sensor and method for mounting a sensorBOSCH GMBH ROBERT·Filed 2013·Granted Apr 25, 2017·3 cites·8 claims
- 1572US7493819B2Micromechanical pressure sensor systemBOSCH GMBH ROBERT·Filed 2006·Granted Feb 24, 2009·6 cites·7 claims
- 1672US7213465B2Micromechanical sensorBOSCH GMBH ROBERT·Filed 2004·Granted May 8, 2007·18 cites·8 claims
- 1772US7193290B2Semiconductor component and a method for producing the sameBOSCH GMBH ROBERT·Filed 2002·Granted Mar 20, 2007·10 cites·17 claims
- 1872US7045382B2Method for producing micromechanic sensors and sensors produced by said methodBOSCH GMBH ROBERT·Filed 2002·Granted May 16, 2006·17 cites·9 claims
- 1971US7843025B2Micromechanical semiconductor sensorBOSCH GMBH ROBERT·Filed 2009·Granted Nov 30, 2010·5 cites·2 claims
- 2071US7647832B2Micromechanical device and method for producing a micromechanical deviceBOSCH GMBH ROBERT·Filed 2006·Granted Jan 19, 2010·6 cites·8 claims
- 2171US6906392B2Micromechanical componentPARAGON AG·Filed 2002·Granted Jun 14, 2005·17 cites·16 claims
- 2270US8492855B2Micromechanical capacitive pressure transducer and production methodLAMMEL GERHARD·Filed 2006·Granted Jul 23, 2013·4 cites·6 claims
- 2370US7368313B2Method of making a differential pressure sensorBOSCH GMBH ROBERT·Filed 2005·Granted May 6, 2008·5 cites·7 claims
- 2469US7300854B2Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this methodBOSCH GMBH ROBERT·Filed 2001·Granted Nov 27, 2007·14 cites·23 claims
- 2567US8250925B2Workpiece composite having a preform and a gelBENZEL HUBERT·Filed 2009·Granted Aug 28, 2012·5 cites·16 claims
- 2665US8485041B2Sensor system, method for operating a sensor system, and method for manufacturing a sensor systemAHLES MARCUS·Filed 2009·Granted Jul 16, 2013·6 cites·15 claims
- 2764US9885626B2Micromechanical sensor system and corresponding manufacturing methodBENZEL TIMO·Filed 2014·Granted Feb 6, 2018·2 cites·17 claims
- 2863US8146439B2Sensor system and method for manufacturing a sensor systemAHLES MARCUS·Filed 2010·Granted Apr 3, 2012·3 cites·11 claims
- 2963US7252008B2Micromechanical piezoresistive pressure sensor deviceBOSCH GMBH ROBERT·Filed 2005·Granted Aug 7, 2007·5 cites·13 claims
- 3063US7055392B2Micromechanical pressure sensorBOSCH GMBH ROBERT·Filed 2004·Granted Jun 6, 2006·11 cites·9 claims
- 3163US6062088APressure sensorBOSCH GMBH ROBERT·Filed 1997·Granted May 16, 2000·24 cites·7 claims
- 3262US7858424B2Method for manufacturing a sensor array including a monolithically integrated circuitBOSCH GMBH ROBERT·Filed 2006·Granted Dec 28, 2010·1 cites·6 claims
- 3362US7160750B2Method of producing a semiconductor sensor componentBOSCH GMBH ROBERT·Filed 2002·Granted Jan 9, 2007·10 cites·18 claims
- 3462US6840111B2Micromechanical component and pressure sensor having a component of this typeBOSCH GMBH ROBERT·Filed 2002·Granted Jan 11, 2005·10 cites·17 claims
- 3562US6832523B2Micromechanical component and manufacturing methodBOSCH GMBH ROBERT·Filed 2001·Granted Dec 21, 2004·10 cites·29 claims
- 3661US6395574B2Micromechanical component and appropriate manufacturing methodBOSCH GMBH ROBERT·Filed 2001·Granted May 28, 2002·13 cites·15 claims
- 3760US8530261B2Method for producing a component, and sensor elementKRAMER TORSTEN·Filed 2007·Granted Sep 10, 2013·1 cites·9 claims
- 3860US7740459B2Micropump having a pump diaphragm and a polysilicon layerBOSCH GMBH ROBERT·Filed 2004·Granted Jun 22, 2010·6 cites·3 claims
- 3960US7585662B2Container for an analysis chipBOSCH GMBH ROBERT·Filed 2002·Granted Sep 8, 2009·3 cites·11 claims
- 4060US7494839B2Method for manufacturing a membrane sensorBOSCH GMBH ROBERT·Filed 2004·Granted Feb 24, 2009·9 cites·15 claims
- 4159US6649989B2Micromechanical diaphragmBOSCH GMBH ROBERT·Filed 2001·Granted Nov 18, 2003·8 cites·20 claims
- 4258US9082831B2Component having a viaAHLES MARCUS·Filed 2011·Granted Jul 14, 2015·1 cites·6 claims
- 4358US8847336B2Micromechanical component having an inclined structure and corresponding manufacturing methodPIRK TJALF·Filed 2008·Granted Sep 30, 2014·2 cites·15 claims
- 4458USRE44995EMethod for producing a semiconductor component and a semiconductor component produced according to the methodBOSCH GMBH ROBERT·Filed 2013·Granted Jul 8, 2014·0 cites·23 claims
- 4558US7572660B2Electrical through-plating of semiconductor chipsBOSCH GMBH ROBERT·Filed 2004·Granted Aug 11, 2009·6 cites·12 claims
- 4657US8749013B2Sensor and method for its productionBENZEL HUBERT·Filed 2007·Granted Jun 10, 2014·2 cites·19 claims
- 4757US7872487B2Semiconductor wafer having a multitude of sensor elements and method for measuring sensor elements on a semiconductor waferBOSCH GMBH ROBERT·Filed 2008·Granted Jan 18, 2011·1 cites·9 claims
- 4856US8405210B2Method for producing a plurality of chips and a chip produced accordinglyKRAMER TORSTEN·Filed 2008·Granted Mar 26, 2013·1 cites·10 claims
- 4955US7833405B2Micromechanical component and corresponding production methodBOSCH GMBH ROBERT·Filed 2001·Granted Nov 16, 2010·7 cites·10 claims
- 5055US7755152B2Semiconductor component configured as a diaphragm sensorBOSCH GMBH ROBERT·Filed 2009·Granted Jul 13, 2010·0 cites·25 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
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