Inventor · disambiguated record
Hu Kang
Also filed as: KANG HU
53 granted patents·10 pending applications·3,988 citations·filing 2006–2024
99Inventor score
Top patents by PatentIndex Score
63 records- 0199US9786570B2Methods for depositing films on sensitive substratesNOVELLUS SYSTEMS INC·Filed 2016·Granted Oct 10, 2017·362 cites·6 claims
- 0299US9745658B2Chamber undercoat preparation method for low temperature ALD filmsLAM RES CORP·Filed 2013·Granted Aug 29, 2017·375 cites·16 claims
- 0398US10008428B2Methods for depositing films on sensitive substratesNOVELLUS SYSTEMS INC·Filed 2017·Granted Jun 26, 2018·27 cites·13 claims
- 0498US9966299B2Inhibitor plasma mediated atomic layer deposition for seamless feature fillLAM RES CORP·Filed 2016·Granted May 8, 2018·365 cites·19 claims
- 0598US9793110B2Gapfill of variable aspect ratio features with a composite PEALD and PECVD methodLAM RES CORP·Filed 2016·Granted Oct 17, 2017·25 cites·16 claims
- 0698US9685320B2Methods for depositing silicon oxideLAM RES CORP·Filed 2014·Granted Jun 20, 2017·495 cites·23 claims
- 0798US9425078B2Inhibitor plasma mediated atomic layer deposition for seamless feature fillLAM RES CORP·Filed 2015·Granted Aug 23, 2016·454 cites·22 claims
- 0898US9355839B2Sub-saturated atomic layer deposition and conformal film depositionLAM RES CORP·Filed 2013·Granted May 31, 2016·55 cites·22 claims
- 0998US9287113B2Methods for depositing films on sensitive substratesNOVELLUS SYSTEMS INC·Filed 2013·Granted Mar 15, 2016·74 cites·19 claims
- 1098US9257274B2Gapfill of variable aspect ratio features with a composite PEALD and PECVD methodLAM RES CORP·Filed 2013·Granted Feb 9, 2016·523 cites·23 claims
- 1198US8524612B2Plasma-activated deposition of conformal filmsLI MING·Filed 2011·Granted Sep 3, 2013·397 cites·18 claims
- 1298US8101531B1Plasma-activated deposition of conformal filmsLI MING·Filed 2010·Granted Jan 24, 2012·96 cites·18 claims
- 1397US10361076B2Gapfill of variable aspect ratio features with a composite PEALD and PECVD methodLAM RES CORP·Filed 2017·Granted Jul 23, 2019·17 cites·4 claims
- 1497US8728956B2Plasma activated conformal film depositionLAVOIE ADRIEN·Filed 2011·Granted May 20, 2014·541 cites·39 claims
- 1596US10741458B2Methods for depositing films on sensitive substratesNOVELLUS SYSTEMS INC·Filed 2018·Granted Aug 11, 2020·9 cites·16 claims
- 1696US10665429B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2017·Granted May 26, 2020·6 cites·20 claims
- 1796US9793096B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2015·Granted Oct 17, 2017·16 cites·18 claims
- 1896US9230800B2Plasma activated conformal film depositionNOVELLUS SYSTEMS INC·Filed 2014·Granted Jan 5, 2016·41 cites·22 claims
- 1995US12354871B2Ultrathin atomic layer deposition film accuracy thickness controlLAM RES CORP·Filed 2023·Granted Jul 8, 2025·1 cites·17 claims
- 2095US10566187B2Ultrathin atomic layer deposition film accuracy thickness controlLAM RES CORP·Filed 2015·Granted Feb 18, 2020·9 cites·19 claims
- 2195US10526701B2Multi-cycle ALD process for film uniformity and thickness profile modulationLAM RES CORP·Filed 2015·Granted Jan 7, 2020·6 cites·9 claims
- 2295US10378107B2Low volume showerhead with faceplate holes for improved flow uniformityLAM RES CORP·Filed 2015·Granted Aug 13, 2019·11 cites·26 claims
- 2394US11133180B2Gapfill of variable aspect ratio features with a composite PEALD and PECVD methodLAM RES CORP·Filed 2019·Granted Sep 28, 2021·6 cites·14 claims
- 2494US9870917B2Variable temperature hardware and methods for reduction of wafer backside depositionLAM RES CORP·Filed 2016·Granted Jan 16, 2018·10 cites·11 claims
- 2592US10094018B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2015·Granted Oct 9, 2018·7 cites·17 claims
- 2692US9797042B2Single ALD cycle thickness control in multi-station substrate deposition systemsLAM RES CORP·Filed 2014·Granted Oct 24, 2017·11 cites·12 claims
- 2791US10577691B2Single ALD cycle thickness control in multi-station substrate deposition systemsLAM RES CORP·Filed 2017·Granted Mar 3, 2020·6 cites·17 claims
- 2891US10407773B2Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD systemLAM RES CORP·Filed 2017·Granted Sep 10, 2019·6 cites·17 claims
- 2991US9617638B2Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD systemLAM RES CORP·Filed 2014·Granted Apr 11, 2017·9 cites·24 claims
- 3090US12261038B2Gapfill of variable aspect ratio features with a composite PEALD and PECVD methodLAM RES CORP·Filed 2021·Granted Mar 25, 2025·1 cites·20 claims
- 3190US11101129B2Ultrathin atomic layer deposition film accuracy thickness controlLAM RES CORP·Filed 2019·Granted Aug 24, 2021·3 cites·11 claims
- 3290US10741365B2Low volume showerhead with porous baffleLAM RES CORP·Filed 2015·Granted Aug 11, 2020·7 cites·20 claims
- 3389US11970772B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2021·Granted Apr 30, 2024·1 cites·10 claims
- 3489US11646198B2Ultrathin atomic layer deposition film accuracy thickness controlLAM RES CORP·Filed 2021·Granted May 9, 2023·1 cites·8 claims
- 3589US9478408B2Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purgingLAM RES CORP·Filed 2014·Granted Oct 25, 2016·7 cites·10 claims
- 3685US11180850B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2018·Granted Nov 23, 2021·3 cites·4 claims
- 3781US10100407B2Hardware and process for film uniformity improvementLAM RES CORP·Filed 2014·Granted Oct 16, 2018·1 cites·29 claims
- 3881US9624578B2Method for RF compensation in plasma assisted atomic layer depositionLAM RES CORP·Filed 2014·Granted Apr 18, 2017·2 cites·13 claims
- 3976US12448687B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2024·Granted Oct 21, 2025·0 cites·12 claims
- 4076US11479856B2Multi-cycle ALD process for film uniformity and thickness profile modulationLAM RES CORP·Filed 2019·Granted Oct 25, 2022·0 cites·22 claims
- 4175US11434567B2Substrate processing system with tandem source activation for CVDLAM RES CORP·Filed 2020·Granted Sep 6, 2022·0 cites·19 claims
- 4274US10577688B2Tandem source activation for CVD of filmsLAM RES CORP·Filed 2017·Granted Mar 3, 2020·0 cites·13 claims
- 4374US7968016B2Twisted π-electron system chromophore compounds with very large molecular hyperpolarizabilities and related compositions and devicesUNIV NORTHWESTERN·Filed 2010·Granted Jun 28, 2011·1 cites·6 claims
- 4472US11670503B2Method of atomic layer depositionLAM RES CORP·Filed 2020·Granted Jun 6, 2023·0 cites·15 claims
- 4572US10526700B2Hardware and process for film uniformity improvementLAM RES CORP·Filed 2018·Granted Jan 7, 2020·0 cites·28 claims
- 4672US9145607B2Tandem source activation for cyclical deposition of filmsLAM RES CORP·Filed 2013·Granted Sep 29, 2015·0 cites·7 claims
- 4771US9899195B2Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purgingLAM RES CORP·Filed 2016·Granted Feb 20, 2018·1 cites·17 claims
- 4870US2015107513A1Systems for modulating step coverage during conformal film depositionNOVELLUS SYSTEMS INC·Filed 2014·Application pending·0 cites
- 4969US11127567B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2020·Granted Sep 21, 2021·0 cites·24 claims
- 5069US8956704B2Methods for modulating step coverage during conformal film depositionNOVELLUS SYSTEMS INC·Filed 2013·Granted Feb 17, 2015·0 cites·17 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →