Inventor · disambiguated record
Huanfeng Zhu
Also filed as: ZHU HUANFENG
3 granted patents·4 pending applications·26 citations·filing 2011–2020
66Inventor score
Top patents by PatentIndex Score
7 records- 0193US8703615B1Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafersPONNUSWAMY THOMAS A·Filed 2012·Granted Apr 22, 2014·21 cites·24 claims
- 0280US8575028B2Method and apparatus for filling interconnect structuresREID JONATHAN D·Filed 2011·Granted Nov 5, 2013·5 cites·25 claims
- 0351US10006144B2Method and apparatus for filling interconnect structuresNOVELLUS SYSTEMS INC·Filed 2013·Granted Jun 26, 2018·0 cites·23 claims
- 0451US2015053565A1Bottom-up fill in damascene featuresLAM RES CORP·Filed 2013·Application pending·0 cites
- 0545US2022208604A1Protection of seed layers during electrodeposition of metals in semiconductor device manufacturingLAM RES CORP·Filed 2020·Application pending·0 cites
- 0641US2014124361A1Method and apparatus for filling interconnect structuresLAM RES CORP·Filed 2014·Application pending·0 cites
- 0739US2014199497A1Methods for reducing metal oxide surfaces to modified metal surfacesSPURLIN TIGHE A·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →