Inventor · disambiguated record
Ilyas Mohammed
Also filed as: MOHAMMED ILYAS
280 granted patents·48 pending applications·4,518 citations·filing 2001–2025
99Inventor score
Top patents by PatentIndex Score
328 records- 0199US11817409B2Directly bonded structures without intervening adhesive and methods for forming the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Nov 14, 2023·13 cites·30 claims
- 0299US11557516B23D chip with shared clock distribution networkADEIA SEMICONDUCTOR INC·Filed 2020·Granted Jan 17, 2023·7 cites·22 claims
- 0399US11476213B2Bonded structures without intervening adhesiveINVENSAS BONDING TECH INC·Filed 2020·Granted Oct 18, 2022·50 cites·22 claims
- 0499US11387202B2Nanowire bonding interconnect for fine-pitch microelectronicsINVENSAS LLC·Filed 2020·Granted Jul 12, 2022·57 cites·15 claims
- 0599US11348898B2Systems and methods for releveled bump planes for chipletsXCELSIS CORP·Filed 2020·Granted May 31, 2022·144 cites·17 claims
- 0699US11256004B2Direct-bonded lamination for improved image clarity in optical devicesINVENSAS BONDING TECH INC·Filed 2018·Granted Feb 22, 2022·157 cites·19 claims
- 0799US10950547B2Stacked IC structure with system level wiring on multiple sides of the IC dieXCELSIS CORP·Filed 2020·Granted Mar 16, 2021·145 cites·19 claims
- 0899US10886177B23D chip with shared clock distribution networkXCELSIS CORP·Filed 2020·Granted Jan 5, 2021·148 cites·20 claims
- 0999US10672663B23D chip sharing power circuitXCELSIS CORP·Filed 2018·Granted Jun 2, 2020·25 cites·24 claims
- 1099US10580757B2Face-to-face mounted IC dies with orthogonal top interconnect layersXCELSIS CORP·Filed 2018·Granted Mar 3, 2020·25 cites·20 claims
- 1199US8878353B2Structure for microelectronic packaging with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2012·Granted Nov 4, 2014·137 cites·71 claims
- 1299US8728865B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2011·Granted May 20, 2014·88 cites·16 claims
- 1399US8093697B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2010·Granted Jan 10, 2012·117 cites·16 claims
- 1499US8076788B2Off-chip vias in stacked chipsHABA BELGACEM·Filed 2010·Granted Dec 13, 2011·74 cites·17 claims
- 1599US8058101B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2005·Granted Nov 15, 2011·87 cites·16 claims
- 1699US7901989B2Reconstituted wafer level stackingTESSERA INC·Filed 2008·Granted Mar 8, 2011·128 cites·16 claims
- 1798US11515291B2Integrated voltage regulator and passive componentsADEIA SEMICONDUCTOR INC·Filed 2019·Granted Nov 29, 2022·38 cites·18 claims
- 1898US11011494B2Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronicsINVENSAS BONDING TECH INC·Filed 2018·Granted May 18, 2021·133 cites·36 claims
- 1998US10672744B23D compute circuit with high density Z-axis interconnectsXCELSIS CORP·Filed 2018·Granted Jun 2, 2020·27 cites·20 claims
- 2098US10672745B23D processorXCELSIS CORP·Filed 2018·Granted Jun 2, 2020·25 cites·20 claims
- 2198US10672743B23D Compute circuit with high density z-axis interconnectsXCELSIS CORP·Filed 2018·Granted Jun 2, 2020·23 cites·23 claims
- 2298US10600691B23D chip sharing power interconnect layerXCELSIS CORP·Filed 2018·Granted Mar 24, 2020·24 cites·24 claims
- 2398US10600735B23D chip sharing data busXCELSIS CORP·Filed 2018·Granted Mar 24, 2020·21 cites·21 claims
- 2498US10586786B23D chip sharing clock interconnect layerXCELSIS CORP·Filed 2018·Granted Mar 10, 2020·22 cites·24 claims
- 2598US10580735B2Stacked IC structure with system level wiring on multiple sides of the IC dieXCELSIS CORP·Filed 2018·Granted Mar 3, 2020·21 cites·20 claims
- 2698US10508030B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2018·Granted Dec 17, 2019·124 cites·14 claims
- 2798US9502390B2BVA interposerINVENSAS CORP·Filed 2013·Granted Nov 22, 2016·59 cites·27 claims
- 2898US9263413B2Substrate-less stackable package with wire-bond interconnectINVENSAS CORP·Filed 2014·Granted Feb 16, 2016·43 cites·20 claims
- 2998US9224717B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2014·Granted Dec 29, 2015·76 cites·20 claims
- 3098US9093435B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2013·Granted Jul 28, 2015·68 cites·23 claims
- 3198US9095074B2Structure for microelectronic packaging with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2014·Granted Jul 28, 2015·66 cites·20 claims
- 3298US8988895B2Interconnection elements with encased interconnectsMOHAMMED ILYAS·Filed 2011·Granted Mar 24, 2015·52 cites·23 claims
- 3398US8916781B2Cavities containing multi-wiring structures and devicesHABA BELGACEM·Filed 2011·Granted Dec 23, 2014·43 cites·36 claims
- 3498US8883563B1Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulationINVENSAS CORP·Filed 2014·Granted Nov 11, 2014·39 cites·17 claims
- 3598US8847376B2Microelectronic elements with post-assembly planarizationOGANESIAN VAGE·Filed 2010·Granted Sep 30, 2014·49 cites·28 claims
- 3698US8841765B2Multi-chip module with stacked face-down connected diesHABA BELGACEM·Filed 2011·Granted Sep 23, 2014·64 cites·26 claims
- 3798US8835228B2Substrate-less stackable package with wire-bond interconnectMOHAMMED ILYAS·Filed 2012·Granted Sep 16, 2014·54 cites·21 claims
- 3898US8823165B2Memory module in a packageHABA BELGACEM·Filed 2012·Granted Sep 2, 2014·34 cites·54 claims
- 3998US8791575B2Microelectronic elements having metallic pads overlying viasOGANESIAN VAGE·Filed 2010·Granted Jul 29, 2014·87 cites·29 claims
- 4098US8618659B2Package-on-package assembly with wire bonds to encapsulation surfaceSATO HIROAKI·Filed 2012·Granted Dec 31, 2013·147 cites·38 claims
- 4198US8598695B2Active chip on carrier or laminated chip having microelectronic element embedded thereinOGANESIAN VAGE·Filed 2010·Granted Dec 3, 2013·39 cites·29 claims
- 4298US8513817B2Memory module in a packageHABA BELGACEM·Filed 2012·Granted Aug 20, 2013·65 cites·50 claims
- 4398US8338963B2Multiple die face-down stacking for two or more dieHABA BELGACEM·Filed 2011·Granted Dec 25, 2012·51 cites·30 claims
- 4498US8329581B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2011·Granted Dec 11, 2012·45 cites·17 claims
- 4598US7453157B2Microelectronic packages and methods thereforTESSERA INC·Filed 2005·Granted Nov 18, 2008·101 cites·36 claims
- 4697US12142528B23D chip with shared clock distribution networkADEIA SEMICONDUCTOR INC·Filed 2022·Granted Nov 12, 2024·2 cites·26 claims
- 4797US11830845B2Package-on-package assembly with wire bonds to encapsulation surfaceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2022·Granted Nov 28, 2023·4 cites·19 claims
- 4897US11626363B2Bonded structures with integrated passive componentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2017·Granted Apr 11, 2023·16 cites·25 claims
- 4997US11152336B23D processor having stacked integrated circuit dieXCELSIS CORP·Filed 2020·Granted Oct 19, 2021·4 cites·21 claims
- 5097US10910344B2Systems and methods for releveled bump planes for chipletsXCELSIS CORP·Filed 2018·Granted Feb 2, 2021·17 cites·5 claims
Showing the top 50 of 328 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →