Inventor · disambiguated record
Jae Min Bae
Also filed as: BAE JAE-MIN
30 granted patents·7 pending applications·46 citations·filing 2011–2025
95Inventor score
Files withAMKOR TECH SINGAPORE HOLDING PTE LTD20AMKOR TECHNOLOGY INC13BAE JAE MIN2SAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
37 records- 0195US9631481B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Apr 25, 2017·4 cites·20 claims
- 0293US9966652B2Packaged electronic device having integrated antenna and locking structureAMKOR TECHNOLOGY INC·Filed 2015·Granted May 8, 2018·8 cites·22 claims
- 0392US11694946B2Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 4, 2023·2 cites·27 claims
- 0490US11887916B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 30, 2024·2 cites·14 claims
- 0586US12300584B2Semiconductor device including heat sink with exposed side from encapsulant and a method of manufacturing thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 0685US11018079B2Land structure for semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2017·Granted May 25, 2021·3 cites·13 claims
- 0785US9978695B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2017·Granted May 22, 2018·1 cites·20 claims
- 0884US12476171B2Land structure for semiconductor package and method thereforAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Nov 18, 2025·0 cites·15 claims
- 0982US12062833B2Packaged electronic device having integrated antenna and locking structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 1081US2025309070A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1180US9275939B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Mar 1, 2016·4 cites·20 claims
- 1279US12334420B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1379US11915998B2Semiconductor device and a method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
- 1479US8866278B1Semiconductor device with increased I/O configurationBAE JAE MIN·Filed 2011·Granted Oct 21, 2014·10 cites·20 claims
- 1579US2025192008A1Semiconductor device and a method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1677US9508631B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Nov 29, 2016·2 cites·20 claims
- 1777US9184148B2Semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2014·Granted Nov 10, 2015·3 cites·20 claims
- 1877US8648450B1Semiconductor device including leadframe with a combination of leads and landsBAE JAE MIN·Filed 2011·Granted Feb 11, 2014·4 cites·20 claims
- 1975US9431334B2Semiconductor device having single layer substrate and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 30, 2016·2 cites·20 claims
- 2074US12087676B2Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 2174US2025155105A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 2273US11417589B2Semiconductor device and a method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 2372US12237239B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 2472US11908779B2Land structure for semiconductor package and method thereforAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 2571US11677135B2Packaged electronic device having integrated antenna and locking structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 2669US9911685B2Land structure for semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 6, 2018·1 cites·17 claims
- 2762US10840169B2Semiconductor device and a method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Nov 17, 2020·0 cites·17 claims
- 2862US2025343160A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2958US11205602B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 21, 2021·0 cites·20 claims
- 3054US10062626B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Aug 28, 2018·0 cites·25 claims
- 3151US9543235B2Semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·0 cites·20 claims
- 3250US12424524B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Sep 23, 2025·0 cites·13 claims
- 3350US11521918B2Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Dec 6, 2022·0 cites·18 claims
- 3450US2022115301A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Application pending·0 cites
- 3546US9293398B2Land structure for semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2013·Granted Mar 22, 2016·0 cites·18 claims
- 3644US2014068511A1Information storage medium having interactive graphic data for using a pointer to control a menu of audio/video data and method and apparatus for reproducing stored dataSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3739US2014112642A1Blu-ray disc, blu-ray disc player, and method of displaying subtitles in the blu-ray disc playerSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jae Min Bae files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →