Inventor · disambiguated record
Jae Doo Kwon
Also filed as: KWON JAE DOO
6 granted patents·1 pending application·13 citations·filing 2013–2024
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0192US10049954B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Aug 14, 2018·7 cites·14 claims
- 0290US11508635B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 22, 2022·2 cites·19 claims
- 0386US2024404902A1Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0482US10685897B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 16, 2020·2 cites·20 claims
- 0580US12062588B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 0670US9054089B2Lead frame package having discharge holes and method of manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 9, 2015·2 cites·20 claims
- 0746US9633932B2Lead frame package having discharge hole and method of manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2015·Granted Apr 25, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →