Inventor · disambiguated record
Janak G. Patel
Also filed as: PATEL JANAK · PATEL JANAK G · PATEL JANAK GHANSHYAMBHAI
41 granted patents·6 pending applications·664 citations·filing 1992–2024
98Inventor score
Top patents by PatentIndex Score
47 records- 0196US6163073AIntegrated heatsink and heatpipeIBM·Filed 1998·Granted Dec 19, 2000·109 cites·20 claims
- 0295US9859262B1Thermally enhanced package to reduce thermal interaction between diesGLOBALFOUNDRIES INC·Filed 2016·Granted Jan 2, 2018·11 cites·10 claims
- 0395US9209141B2Shielded package assemblies with integrated capacitorIBM·Filed 2014·Granted Dec 8, 2015·13 cites·17 claims
- 0494US9059127B1Packages for three-dimensional die stacksIBM·Filed 2014·Granted Jun 16, 2015·15 cites·13 claims
- 0593US9252101B2Packages for three-dimensional die stacksIBM·Filed 2015·Granted Feb 2, 2016·9 cites·7 claims
- 0693US9190399B2Thermally enhanced three-dimensional integrated circuit packageIBM·Filed 2014·Granted Nov 17, 2015·16 cites·20 claims
- 0791US11049819B2Shielded package assemblies with integrated capacitorIBM·Filed 2019·Granted Jun 29, 2021·4 cites·17 claims
- 0889US9935058B2Shielded package assemblies with integrated capacitorIBM·Filed 2016·Granted Apr 3, 2018·4 cites·17 claims
- 0988US9531209B2Shielded package assemblies with integrated capacitorIBM·Filed 2015·Granted Dec 27, 2016·4 cites·13 claims
- 1087US9883612B2Heat sink attachment on existing heat sinksIBM·Filed 2015·Granted Jan 30, 2018·5 cites·17 claims
- 1187US6341062B1Thermal transfer hinge for hinged mobile computing device and method of heat transferIBM·Filed 2000·Granted Jan 22, 2002·50 cites·22 claims
- 1286US8444043B1Uniform solder reflow fixtureBERNIER WILLIAM E·Filed 2012·Granted May 21, 2013·11 cites·18 claims
- 1386US5902044AIntegrated hot spot detector for design, analysis, and controlIBM·Filed 1997·Granted May 11, 1999·76 cites·21 claims
- 1485US6167524AApparatus and method for efficient battery utilization in portable personal computersIBM·Filed 1998·Granted Dec 26, 2000·123 cites·30 claims
- 1584US11682646B2IC chip package with dummy solder structure under corner, and related methodMARVELL ASIA PTE LTD·Filed 2021·Granted Jun 20, 2023·1 cites·7 claims
- 1684US11171104B2IC chip package with dummy solder structure under corner, and related methodMARVELL INT LTD·Filed 2019·Granted Nov 9, 2021·4 cites·18 claims
- 1782US10553544B2Shielded package assemblies with integrated capacitorIBM·Filed 2017·Granted Feb 4, 2020·2 cites·10 claims
- 1882US9543255B2Reduced-warpage laminate structureIBM·Filed 2016·Granted Jan 10, 2017·3 cites·1 claims
- 1981US11810832B2Heat sink configuration for multi-chip moduleMARVELL ASIA PTE LTD·Filed 2021·Granted Nov 7, 2023·1 cites·12 claims
- 2081US9018040B2Power distribution for 3D semiconductor packageIBM·Filed 2013·Granted Apr 28, 2015·5 cites·13 claims
- 2181US6850411B1Method and structure to support heat sink arrangement on chip carrier packagesIBM·Filed 2003·Granted Feb 1, 2005·26 cites·20 claims
- 2280US6665194B1Chip package having connectors on at least two sidesIBM·Filed 2000·Granted Dec 16, 2003·28 cites·10 claims
- 2379US10342160B2Heat sink attachment on existing heat sinksIBM·Filed 2017·Granted Jul 2, 2019·2 cites·20 claims
- 2479US8952503B2Organic module EMI shielding structures and methodsIBM·Filed 2013·Granted Feb 10, 2015·4 cites·8 claims
- 2577US8653662B2Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuitsLACROIX LUKE D·Filed 2012·Granted Feb 18, 2014·5 cites·19 claims
- 2676US5377197AMethod for automatically generating test vectors for digital integrated circuitsUNIV ILLINOIS·Filed 1992·Granted Dec 27, 1994·43 cites·13 claims
- 2775US9078373B1Integrated circuit structures having off-axis in-hole capacitor and methods of formingIBM·Filed 2014·Granted Jul 7, 2015·2 cites·9 claims
- 2873US9613915B2Reduced-warpage laminate structureIBM·Filed 2014·Granted Apr 4, 2017·2 cites·16 claims
- 2973US8759977B2Elongated via structuresLACROIX LUKE D·Filed 2012·Granted Jun 24, 2014·3 cites·12 claims
- 3071US10461067B2Thermally enhanced package to reduce thermal interaction between diesGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 29, 2019·1 cites·7 claims
- 3171US6246583B1Method and apparatus for removing heat from a semiconductor deviceIBM·Filed 1999·Granted Jun 12, 2001·39 cites·25 claims
- 3268US5929646AInterposer and module test card assemblyIBM·Filed 1996·Granted Jul 27, 1999·30 cites·18 claims
- 3366US9599664B2Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structuresIBM·Filed 2015·Granted Mar 21, 2017·1 cites·19 claims
- 3464US9245854B2Organic module EMI shielding structures and methodsIBM·Filed 2014·Granted Jan 26, 2016·1 cites·18 claims
- 3564US2025118618A1Packaging electronic device with liquid thermal interface materialMARVELL ASIA PTE LTD·Filed 2024·Application pending·0 cites
- 3662US9057760B2Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structuresLACROIX LUKE D·Filed 2011·Granted Jun 16, 2015·1 cites·18 claims
- 3762US8586982B2Semiconductor test chip device to mimic field thermal mini-cycles to assess reliabilityLACROIX LUKE D·Filed 2010·Granted Nov 19, 2013·1 cites·20 claims
- 3860US6816374B2High efficiency heat sink/air cooler system for heat-generating componentsIBM·Filed 2003·Granted Nov 9, 2004·9 cites·20 claims
- 3959US2023233396A1Stretching device and method of usePATEL JANAK·Filed 2022·Application pending·0 cites
- 4057US2019378829A1Thermally enhanced package to reduce thermal interaction between diesGLOBALFOUNDRIES INC·Filed 2019·Application pending·0 cites
- 4155US10685919B2Reduced-warpage laminate structureIBM·Filed 2017·Granted Jun 16, 2020·0 cites·9 claims
- 4254US9185807B2Integrated circuit structures having off-axis in-hole capacitorIBM·Filed 2015·Granted Nov 10, 2015·0 cites·11 claims
- 4352US8999846B2Elongated via structuresIBM·Filed 2014·Granted Apr 7, 2015·0 cites·18 claims
- 4452US2023260871A1Three-Dimensional Device Package with Vertical Heat PipesMARVELL ASIA PTE LTD·Filed 2023·Application pending·0 cites
- 4552US2023197635A1Stiffener ring for packages with micro-cable/optical connectorsMARVELL ASIA PTE LTD·Filed 2022·Application pending·0 cites
- 4651US2023035100A1heat dissipation and electrical robustness in a three-dimensional package of stacked integrated circuitsMARVELL ASIA PTE LTD·Filed 2022·Application pending·0 cites
- 4741US10224262B2Flexible heat spreader lidGLOBALFOUNDRIES INC·Filed 2017·Granted Mar 5, 2019·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Janak G. Patel files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →