Inventor · disambiguated record
James S. Sims
Also filed as: SIMS JAMES S · SIMS JAMES SAMUEL
23 granted patents·3,042 citations·filing 2004–2021
97Inventor score
Top patents by PatentIndex Score
23 records- 0198US10347547B2Suppressing interfacial reactions by varying the wafer temperature throughout depositionLAM RES CORP·Filed 2016·Granted Jul 9, 2019·401 cites·20 claims
- 0298US9865455B1Nitride film formed by plasma-enhanced and thermal atomic layer deposition processLAM RES CORP·Filed 2016·Granted Jan 9, 2018·434 cites·20 claims
- 0398US9824884B1Method for depositing metals free ald silicon nitride films using halide-based precursorsLAM RES CORP·Filed 2016·Granted Nov 21, 2017·348 cites·16 claims
- 0498US9214333B1Methods and apparatuses for uniform reduction of the in-feature wet etch rate of a silicon nitride film formed by ALDLAM RES CORP·Filed 2014·Granted Dec 15, 2015·539 cites·21 claims
- 0598US7214630B1PMOS transistor with compressive dielectric capping layerNOVELLUS SYSTEMS INC·Filed 2005·Granted May 8, 2007·511 cites·34 claims
- 0696US7906817B1High compressive stress carbon liners for MOS devicesNOVELLUS SYSTEMS INC·Filed 2008·Granted Mar 15, 2011·40 cites·8 claims
- 0796US7745346B2Method for improving process control and film conformality of PECVD filmNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 29, 2010·538 cites·23 claims
- 0895US9589790B2Method of depositing ammonia free and chlorine free conformal silicon nitride filmLAM RES CORP·Filed 2014·Granted Mar 7, 2017·22 cites·21 claims
- 0995US9076646B2Plasma enhanced atomic layer deposition with pulsed plasma exposureLAM RES CORP·Filed 2013·Granted Jul 7, 2015·81 cites·19 claims
- 1094US8512818B1Cascaded cure approach to fabricate highly tensile silicon nitride filmsVARADARAJAN BHADRI·Filed 2012·Granted Aug 20, 2013·21 cites·18 claims
- 1194US8211510B1Cascaded cure approach to fabricate highly tensile silicon nitride filmsVARADARAJAN BHADRI·Filed 2007·Granted Jul 3, 2012·33 cites·25 claims
- 1290US7327001B1PMOS transistor with compressive dielectric capping layerNOVELLUS SYSTEMS INC·Filed 2007·Granted Feb 5, 2008·16 cites·24 claims
- 1386US7998881B1Method for making high stress boron-doped carbon filmsNOVELLUS SYSTEMS INC·Filed 2008·Granted Aug 16, 2011·11 cites·17 claims
- 1484US8362571B1High compressive stress carbon liners for MOS devicesNOVELLUS SYSTEMS INC·Filed 2011·Granted Jan 29, 2013·5 cites·17 claims
- 1583US7041543B1Strained transistor architecture and methodNOVELLUS SYSTEMS INC·Filed 2004·Granted May 9, 2006·32 cites·17 claims
- 1672US11239420B2Conformal damage-free encapsulation of chalcogenide materialsLAM RES CORP·Filed 2018·Granted Feb 1, 2022·1 cites·17 claims
- 1766US11832533B2Conformal damage-free encapsulation of chalcogenide materialsLAM RES CORP·Filed 2021·Granted Nov 28, 2023·0 cites·15 claims
- 1863US9659769B1Tensile dielectric films using UV curingVARADARAJAN BHADRI·Filed 2004·Granted May 23, 2017·9 cites·35 claims
- 1961US11075127B2Suppressing interfacial reactions by varying the wafer temperature throughout depositionLAM RES CORP·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 2055US10020188B2Method for depositing ALD films using halide-based precursorsLAM RES CORP·Filed 2017·Granted Jul 10, 2018·0 cites·18 claims
- 2151US9598770B2Contoured showerhead for improved plasma shaping and controlNOVELLUS SYSTEMS INC·Filed 2016·Granted Mar 21, 2017·0 cites·35 claims
- 2250US9315899B2Contoured showerhead for improved plasma shaping and controlLEESER KARL F·Filed 2012·Granted Apr 19, 2016·0 cites·20 claims
- 2348US12230495B2Method of depositing silicon nitride filmsLAM RES CORP·Filed 2019·Granted Feb 18, 2025·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →