Inventor · disambiguated record
Jen-Chuan Chen
Also filed as: CHEN JEN-CHUAN
15 granted patents·11 pending applications·402 citations·filing 2008–2025
93Inventor score
Top patents by PatentIndex Score
26 records- 0198US8012797B2Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometriesADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 6, 2011·146 cites·20 claims
- 0297US8158888B2Circuit substrate and method of fabricating the same and chip package structureSHEN CHI-CHIH·Filed 2009·Granted Apr 17, 2012·81 cites·27 claims
- 0395US7791211B2Flip chip package structure and carrier thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Sep 7, 2010·75 cites·8 claims
- 0493US8076765B2Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductorsCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 13, 2011·52 cites·25 claims
- 0591US10573579B2Semiconductor package with improved heat dissipationMEDIATEK INC·Filed 2018·Granted Feb 25, 2020·10 cites·17 claims
- 0690US8446000B2Package structure and package processSHEN CHI-CHIH·Filed 2010·Granted May 21, 2013·19 cites·23 claims
- 0788US8258007B2Package processSHEN CHI-CHIH·Filed 2010·Granted Sep 4, 2012·10 cites·7 claims
- 0882US2025259967A1Package process and package structureADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0981US9698120B2Package process and package structureADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Jul 4, 2017·4 cites·17 claims
- 1075US12266632B2Package process and package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Apr 1, 2025·0 cites·7 claims
- 1164US8618645B2Package process and package structureSHEN CHI-CHIH·Filed 2010·Granted Dec 31, 2013·1 cites·10 claims
- 1260US8105877B2Method of fabricating a stacked type chip package structureSHEN CHI-CHIH·Filed 2008·Granted Jan 31, 2012·2 cites·14 claims
- 1359US8643167B2Semiconductor package with through silicon vias and method for making the sameHUNG CHIA-LIN·Filed 2011·Granted Feb 4, 2014·2 cites·20 claims
- 1458US2024405042A1Optical detection module and related manufacturing methodPIXART IMAGING INC·Filed 2023·Application pending·0 cites
- 1557US11222866B2Package process and package structureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 11, 2022·0 cites·20 claims
- 1652US2025267349A1Cubic camera and manufacturing method thereofPIXART IMAGING INC·Filed 2024·Application pending·0 cites
- 1750US2010327465A1Package process and package structureADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 1847US2010219524A1Chip scale package and method of fabricating the sameSHEN CHI-CHIH·Filed 2009·Application pending·0 cites
- 1947US2012205800A1Packaging structureSHEN CHI-CHIH·Filed 2012·Application pending·0 cites
- 2045US10978406B2Semiconductor package including EMI shielding structure and method for forming the sameMEDIATEK INC·Filed 2018·Granted Apr 13, 2021·0 cites·13 claims
- 2145US2009127706A1Chip structure, substrate structure, chip package structure and process thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 2244US2012049338A1Stackable semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Application pending·0 cites
- 2338US2012049332A1Semiconductor package and method for manufacturing the sameCHEN JEN-CHUAN·Filed 2011·Application pending·0 cites
- 2437US8390129B2Semiconductor device with a plurality of mark through substrate viasSHEN CHI-CHIH·Filed 2010·Granted Mar 5, 2013·0 cites·18 claims
- 2535US2012086120A1Stacked semiconductor package having conductive vias and method for making the sameCHEN JEN-CHUAN·Filed 2011·Application pending·0 cites
- 2634US2011300669A1Method for Making Die AssembliesSHEN CHI-CHIH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →