Inventor · disambiguated record
Jeffrey B. Miller
Also filed as: MILLER JEFFREY B · MILLER JEFFREY BORCHERDT
19 granted patents·5 pending applications·73 citations·filing 2011–2023
91Inventor score
Files withADVANCED SILICON GROUP INC9ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC9AMBRI INC2CANTRELL BRIAN T2MCHUGH KATHLEEN1
Top patents by PatentIndex Score
24 records- 0192US8709114B2Method of manufacturing chemical mechanical polishing layersCANTRELL BRIAN T·Filed 2012·Granted Apr 29, 2014·28 cites·10 claims
- 0291US11929466B2Electrochemical energy storage devicesAMBRI INC·Filed 2023·Granted Mar 12, 2024·3 cites·20 claims
- 0391US8986585B2Method of manufacturing chemical mechanical polishing layers having a windowCANTRELL BRIAN T·Filed 2012·Granted Mar 24, 2015·26 cites·10 claims
- 0481US9449855B2Double-etch nanowire processADVANCED SILICON GROUP INC·Filed 2014·Granted Sep 20, 2016·4 cites·20 claims
- 0575US10079322B2Necklaces of silicon nanowiresADVANCED SILICON GROUP INC·Filed 2017·Granted Sep 18, 2018·2 cites·15 claims
- 0674US10269995B2Screen printing electrical contacts to nanostructured areasADVANCED SILICON GROUP INC·Filed 2017·Granted Apr 23, 2019·1 cites·20 claims
- 0772US10629759B2Metal-assisted etch combined with regularizing etchADVANCED SILICON GROUP INC·Filed 2017·Granted Apr 21, 2020·1 cites·17 claims
- 0872US9630293B2Chemical mechanical polishing pad composite polishing layer formulationROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2015·Granted Apr 25, 2017·2 cites·11 claims
- 0969US9783895B2Double-etch nanowire processADVANCED SILICON GROUP INC·Filed 2016·Granted Oct 10, 2017·1 cites·19 claims
- 1068US8444727B2Method of manufacturing chemical mechanical polishing layersMCHUGH KATHLEEN·Filed 2011·Granted May 21, 2013·4 cites·20 claims
- 1167US9768331B2Screen printing electrical contacts to nanowire areasADVANCED SILICON GROUP INC·Filed 2014·Granted Sep 19, 2017·1 cites·10 claims
- 1261US2015340526A1Nanowire device with alumina passivation layer and methods of making sameADVANCED SILICON GROUP INC·Filed 2015·Application pending·0 cites
- 1359US2020220033A1Metal-assisted etch combined with regularizing etchADVANCED SILICON GROUP INC·Filed 2020·Application pending·0 cites
- 1455US2019221683A1Screen printing electrical contacts to nanostructured areasADVANCED SILICON GROUP INC·Filed 2019·Application pending·0 cites
- 1544US10144115B2Method of making polishing layer for chemical mechanical polishing padROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2016·Granted Dec 4, 2018·0 cites·9 claims
- 1644US10005172B2Controlled-porosity method for forming polishing padROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2015·Granted Jun 26, 2018·0 cites·8 claims
- 1743US2019296276A1Seals for high temperature reactive material devicesAMBRI INC·Filed 2019·Application pending·0 cites
- 1842US10105825B2Method of making polishing layer for chemical mechanical polishing padROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2015·Granted Oct 23, 2018·0 cites·9 claims
- 1942US10092998B2Method of making composite polishing layer for chemical mechanical polishing padROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2016·Granted Oct 9, 2018·0 cites·10 claims
- 2042US2018169827A1Methods for making chemical mechanical planarization (cmp) polishing pads having integral windowsROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2016·Application pending·0 cites
- 2141US9034063B2Method of manufacturing grooved chemical mechanical polishing layersROHM & HAAS ELECT MAT·Filed 2012·Granted May 19, 2015·0 cites·1 claims
- 2240US10011002B2Method of making composite polishing layer for chemical mechanical polishing padROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2015·Granted Jul 3, 2018·0 cites·10 claims
- 2339US9776300B2Chemical mechanical polishing pad and method of making sameROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2016·Granted Oct 3, 2017·0 cites·10 claims
- 2437US9586305B2Chemical mechanical polishing pad and method of making sameROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2015·Granted Mar 7, 2017·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →