Inventor · disambiguated record
Jean Wang
Also filed as: WANG JEAN · WANG JEAN YUE PHILLIP · WANG JEAN-SHYAN
28 granted patents·10 pending applications·236 citations·filing 2003–2023
96Inventor score
Top patents by PatentIndex Score
38 records- 0195US7974728B2System for extraction of key process parameters from fault detection classification to enable wafer predictionTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jul 5, 2011·51 cites·14 claims
- 0293US7829815B2Adjustable electrodes and coils for plasma density distribution controlTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 9, 2010·25 cites·38 claims
- 0391US8172641B2CMP by controlling polish temperatureHO MING-CHE·Filed 2008·Granted May 8, 2012·29 cites·13 claims
- 0489US7891536B2PVD target with end of service life detection capabilityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 22, 2011·9 cites·12 claims
- 0588US8827695B2Wafer's ambiance controlHSIAO YI-LI·Filed 2009·Granted Sep 9, 2014·14 cites·20 claims
- 0688US8109407B2Apparatus for storing substratesHSIAO YI-LI·Filed 2007·Granted Feb 7, 2012·14 cites·21 claims
- 0787US7634325B2Prediction of uniformity of a waferTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 15, 2009·12 cites·18 claims
- 0884US7332449B2Method for forming dual damascenes with supercritical fluid treatmentsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 19, 2008·10 cites·15 claims
- 0982US8682466B2Automatic virtual metrology for semiconductor wafer result predictionKO FRANCIS·Filed 2008·Granted Mar 25, 2014·13 cites·17 claims
- 1081US7758338B2Substrate carrier, port apparatus and facility interface and apparatus including sameTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 20, 2010·7 cites·23 claims
- 1180US8133097B2Polishing apparatusLIN YU-LIANG·Filed 2009·Granted Mar 13, 2012·7 cites·18 claims
- 1279US8433434B2Near non-adaptive virtual metrology and chamber controlWANG AMY·Filed 2010·Granted Apr 30, 2013·6 cites·20 claims
- 1379US8145337B2Methodology to enable wafer result prediction of semiconductor wafer batch processing equipmentLIN CHUN-HSIEN·Filed 2007·Granted Mar 27, 2012·11 cites·20 claims
- 1478US8276648B2PVD target with end of service life detection capabilityHSIAO YI-LI·Filed 2012·Granted Oct 2, 2012·1 cites·6 claims
- 1577US12384569B2UAV having multifunctional leg assembly and its charging systemZOU JIE TONG·Filed 2023·Granted Aug 12, 2025·1 cites·18 claims
- 1676US7956448B2Stacked structures and methods of fabricating stacked structuresTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jun 7, 2011·7 cites·20 claims
- 1772US8387674B2Chip on wafer bonderYU CHEN-HUA·Filed 2008·Granted Mar 5, 2013·4 cites·20 claims
- 1871US7851234B2System and method for enhanced control of copper trench sheet resistance uniformityTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 14, 2010·4 cites·14 claims
- 1969US7767471B2Auto routing for optimal uniformity controlTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Aug 3, 2010·3 cites·15 claims
- 2065US9037279B2Clustering for prediction models in process control and for optimal dispatchingKO FRANCIS·Filed 2010·Granted May 19, 2015·1 cites·20 claims
- 2165US7544606B2Method to implement stress free polishingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 9, 2009·2 cites·19 claims
- 2264US8409993B2Method and system for controlling copper chemical mechanical polish uniformityKO FRANCIS·Filed 2007·Granted Apr 2, 2013·2 cites·9 claims
- 2362US7951723B2Integrated etch and supercritical CO2 process and chamber designTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted May 31, 2011·1 cites·20 claims
- 2461US2011126397A1Pvd target with end of service life detection capabilityTAIWAN SEMICONDUCTOR MFG·Filed 2011·Application pending·0 cites
- 2559US9177843B2Preventing contamination in integrated circuit manufacturing linesSUNG CHIEN-MING·Filed 2007·Granted Nov 3, 2015·2 cites·20 claims
- 2658US2022063145A1Thermoplastic fusible inner mold material, inner mold, method for manufacturing a hollow partTAIWAN CHEMWELL IND CO LTD·Filed 2021·Application pending·0 cites
- 2755US8101052B2Adjustable anode assembly for a substrate wet processing apparatusHSIAO YI-LI·Filed 2006·Granted Jan 24, 2012·0 cites·18 claims
- 2851US9093447B2Chip on wafer bonderTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·0 cites·3 claims
- 2951US8795486B2PVD target with end of service life detection capabilityHSIAO YI-LI·Filed 2006·Granted Aug 5, 2014·0 cites·20 claims
- 3051US2007068796A1Method of using a target having end of service life detection capabilityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 3150US2007163716A1Gas distribution apparatuses and methods for controlling gas distribution apparatusesTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 3247US2008047578A1Method for preventing clogging of reaction chamber exhaust linesTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 3344US2008161996A1Method for dealing with traffic accident and apparatus thereofINVENTEC APPLIANCES CORP·Filed 2007·Application pending·0 cites
- 3444US2005151848A1Image transmitterFiled 2004·Application pending·0 cites
- 3541US2007032180A1Slurry residence time enhancement systemTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 3639US2006023395A1Systems and methods for temperature control of semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 3738US2004222082A1Oblique ion milling of via metallizationAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 3836US7879711B2Stacked structures and methods of fabricating stacked structuresTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 1, 2011·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →