Inventor · disambiguated record
Jin-Yuan Lee
Also filed as: LEE JIN · LEE JIN-YUAN
283 granted patents·48 pending applications·7,148 citations·filing 1991–2025
99Inventor score
Top patents by PatentIndex Score
331 records- 0199US11887930B2Vertical interconnect elevator based on through silicon viasICOMETRUE CO LTD·Filed 2020·Granted Jan 30, 2024·10 cites·27 claims
- 0299US11159166B2Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cellsICOMETRUE CO LTD·Filed 2020·Granted Oct 26, 2021·11 cites·43 claims
- 0399US10447274B2Logic drive based on standard commodity FPGA IC chips using non-volatile memory cellsICOMETRUE CO LTD·Filed 2018·Granted Oct 15, 2019·61 cites·20 claims
- 0499US8503186B2System-in packagesLIN MOU-SHIUNG·Filed 2010·Granted Aug 6, 2013·143 cites·20 claims
- 0599US7969006B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Jun 28, 2011·96 cites·46 claims
- 0699US6818545B2Low fabrication cost, fine pitch and high reliability solder bumpMEGIC CORP·Filed 2001·Granted Nov 16, 2004·271 cites·35 claims
- 0799US6495442B1Post passivation interconnection schemes on top of the IC chipsMEGIC CORP·Filed 2000·Granted Dec 17, 2002·207 cites·23 claims
- 0898US12327790B2Vertical interconnect elevator based on through silicon viasICOMETRUE CO LTD·Filed 2024·Granted Jun 10, 2025·4 cites·29 claims
- 0998US12327816B2Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chipICOMETRUE CO LTD·Filed 2023·Granted Jun 10, 2025·4 cites·34 claims
- 1098US11227838B2Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuitsICOMETRUE CO LTD·Filed 2020·Granted Jan 18, 2022·4 cites·38 claims
- 1198US11211334B2Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chipICOMETRUE CO LTD·Filed 2019·Granted Dec 28, 2021·35 cites·36 claims
- 1298US10892011B2Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cellsICOMETRUE CO LTD·Filed 2019·Granted Jan 12, 2021·42 cites·35 claims
- 1398US8456856B2Integrated circuit chip using top post-passivation technology and bottom structure technologyLIN MOU-SHIUNG·Filed 2010·Granted Jun 4, 2013·138 cites·20 claims
- 1498US8164171B2System-in packagesLIN MOU-SHIUNG·Filed 2010·Granted Apr 24, 2012·95 cites·20 claims
- 1598US6759275B1Method for making high-performance RF integrated circuitsMEGIC CORP·Filed 2001·Granted Jul 6, 2004·175 cites·11 claims
- 1698US6649509B1Post passivation metal scheme for high-performance integrated circuit devicesMEGIC CORP·Filed 2001·Granted Nov 18, 2003·156 cites·110 claims
- 1798US6605528B1Post passivation metal scheme for high-performance integrated circuit devicesMEGIC CORP·Filed 2001·Granted Aug 12, 2003·151 cites·69 claims
- 1897US12278192B2Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuitsICOMETRUE CO LTD·Filed 2023·Granted Apr 15, 2025·2 cites·22 claims
- 1997US11394386B2Logic drive using standard commodity programmable logic IC chipsICOMETRUE CO LTD·Filed 2020·Granted Jul 19, 2022·3 cites·20 claims
- 2097US10957679B2Logic drive based on standardized commodity programmable logic semiconductor IC chipsICOMETRUE CO LTD·Filed 2018·Granted Mar 23, 2021·14 cites·20 claims
- 2197US10489544B2Logic drive based on standard commodity FPGA IC chipsICOMETRUE CO LTD·Filed 2017·Granted Nov 26, 2019·11 cites·22 claims
- 2297US8021918B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Sep 20, 2011·45 cites·34 claims
- 2397US6917119B2Low fabrication cost, high performance, high reliability chip scale packageMEGIC CORP·Filed 2003·Granted Jul 12, 2005·106 cites·10 claims
- 2497US6756295B2Chip structure and process for forming the sameMEGIC CORP·Filed 2002·Granted Jun 29, 2004·141 cites·35 claims
- 2597US6734563B2Post passivation interconnection schemes on top of the IC chipsMEGIC CORP·Filed 2002·Granted May 11, 2004·79 cites·23 claims
- 2697US6673698B1Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layersMEGIC CORP·Filed 2002·Granted Jan 6, 2004·100 cites·15 claims
- 2797US6642136B1Method of making a low fabrication cost, high performance, high reliability chip scale packageMEGIC CORP·Filed 2001·Granted Nov 4, 2003·123 cites·36 claims
- 2897US6071783APseudo silicon on insulator MOSFET deviceTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Jun 6, 2000·175 cites·27 claims
- 2996US12368438B2Logic drive based on standard commodity FPGA IC chips using non-volatile memory cellsICOMETRUE CO LTD·Filed 2023·Granted Jul 22, 2025·1 cites·27 claims
- 3096US11637056B23D chip package based on through-silicon-via interconnection elevatorICOMETRUE CO LTD·Filed 2020·Granted Apr 25, 2023·3 cites·28 claims
- 3196US10630296B2Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cellsICOMETRUE CO LTD·Filed 2018·Granted Apr 21, 2020·13 cites·26 claims
- 3296US8809951B2Chip packages having dual DMOS devices with power management integrated circuitsMEGICA CORP·Filed 2013·Granted Aug 19, 2014·22 cites·24 claims
- 3396US8193555B2Image and light sensor chip packagesLIN MOU-SHIUNG·Filed 2010·Granted Jun 5, 2012·29 cites·6 claims
- 3496US8072070B2Low fabrication cost, fine pitch and high reliability solder bumpLEE JIN-YUAN·Filed 2009·Granted Dec 6, 2011·32 cites·23 claims
- 3596US7863739B2Low fabrication cost, fine pitch and high reliability solder bumpMEGICA CORP·Filed 2007·Granted Jan 4, 2011·28 cites·48 claims
- 3696US7521812B2Method of wire bonding over active area of a semiconductor circuitMEGICA CORP·Filed 2007·Granted Apr 21, 2009·37 cites·13 claims
- 3796US7382052B2Post passivation interconnection schemes on top of IC chipLIN MOU-SHIUNG·Filed 2007·Granted Jun 3, 2008·20 cites·20 claims
- 3896US6746898B2Integrated chip package structure using silicon substrate and method of manufacturing the sameMEGIC CORP·Filed 2002·Granted Jun 8, 2004·99 cites·60 claims
- 3996US6346729B1Pseudo silicon on insulator MOSFET deviceTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Feb 12, 2002·110 cites·4 claims
- 4095US11749610B2Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chipICOMETRUE CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·28 claims
- 4195US11616046B2Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chipICOMETRUE CO LTD·Filed 2019·Granted Mar 28, 2023·8 cites·25 claims
- 4295US11101801B2Logic drive using standard commodity programmable logic IC chipsICOMETRUE CO LTD·Filed 2020·Granted Aug 24, 2021·4 cites·25 claims
- 4395US7479450B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2007·Granted Jan 20, 2009·18 cites·20 claims
- 4495US7470927B2Semiconductor chip with coil element over passivation layerMEGICA CORP·Filed 2006·Granted Dec 30, 2008·30 cites·20 claims
- 4595US7446035B2Post passivation interconnection schemes on top of IC chipsMEGICA CORP·Filed 2007·Granted Nov 4, 2008·16 cites·20 claims
- 4695US7427560B2Top layers of metal for high performance IC'sMEGICA CORP·Filed 2007·Granted Sep 23, 2008·25 cites·18 claims
- 4795US7405149B1Post passivation method for semiconductor chip or waferMEGICA CORP·Filed 2002·Granted Jul 29, 2008·67 cites·31 claims
- 4895US7265047B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2005·Granted Sep 4, 2007·19 cites·19 claims
- 4995US6117722ASRAM layout for relaxing mechanical stress in shallow trench isolation technology and method of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Sep 12, 2000·243 cites·12 claims
- 5094US10608642B2Logic drive using standard commodity programmable logic IC chips comprising non-volatile radom access memory cellsICOMETRUE CO LTD·Filed 2019·Granted Mar 31, 2020·8 cites·27 claims
Showing the top 50 of 331 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →