Inventor · disambiguated record
Ji Zhu
Also filed as: ZHU JI · ZHU JI GUANG
39 granted patents·15 pending applications·364 citations·filing 1996–2024
97Inventor score
Top patents by PatentIndex Score
54 records- 0195US6379622B1Sensor incorporating a quantum dot as a referenceMOTOROLA INC·Filed 2001·Granted Apr 30, 2002·101 cites·30 claims
- 0290US8617993B2Method of reducing pattern collapse in high aspect ratio nanostructuresYASSERI AMIR A·Filed 2010·Granted Dec 31, 2013·22 cites·11 claims
- 0387US11072812B2Substrates for covalent tethering of proteins to functional groups or solid surfacesPROMEGA CORP·Filed 2014·Granted Jul 27, 2021·3 cites·16 claims
- 0487US9551705B2Compositions and methods for capture of cellular targets of bioactive agentsPROMEGA CORP·Filed 2013·Granted Jan 24, 2017·6 cites·16 claims
- 0587US8227394B2Composition of a cleaning material for particle removalZHU JI·Filed 2008·Granted Jul 24, 2012·12 cites·20 claims
- 0687US7096034B2System and method for reducing power consumption for wireless communications by mobile devicesMICROSOFT CORP·Filed 2001·Granted Aug 22, 2006·50 cites·18 claims
- 0785US11488831B2Efficient cleaning and etching of high aspect ratio structuresLAM RES CORP·Filed 2019·Granted Nov 1, 2022·3 cites·16 claims
- 0882US7913703B1Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrateLAM RES CORP·Filed 2006·Granted Mar 29, 2011·6 cites·14 claims
- 0982US7294580B2Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon additionLAM RES CORP·Filed 2004·Granted Nov 13, 2007·29 cites·20 claims
- 1081US11469079B2Ultrahigh selective nitride etch to form FinFET devicesLAM RES CORP·Filed 2017·Granted Oct 11, 2022·3 cites·13 claims
- 1179US7597765B2Post etch wafer surface cleaning with liquid meniscusLAM RES CORP·Filed 2006·Granted Oct 6, 2009·7 cites·15 claims
- 1277US12040193B2Efficient cleaning and etching of high aspect ratio structuresLAM RES CORP·Filed 2022·Granted Jul 16, 2024·0 cites·16 claims
- 1377US6200599B1Ortho ester lipidsUNIV CALIFORNIA·Filed 1999·Granted Mar 13, 2001·45 cites·28 claims
- 1476US2024363355A1Efficient cleaning and etching of high aspect ratio structuresLAM RES CORP·Filed 2024·Application pending·0 cites
- 1574US12221648B2Substrates for covalent tethering of proteins to functional groups or solid surfacesPROMEGA CORP·Filed 2021·Granted Feb 11, 2025·0 cites·14 claims
- 1673US11011410B2Substrate having two semiconductor materials on insulatorSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2019·Granted May 18, 2021·1 cites·17 claims
- 1773US8211846B2Materials for particle removal by single-phase and two-phase mediaMUI DAVID S L·Filed 2008·Granted Jul 3, 2012·3 cites·19 claims
- 1873US8084406B2Apparatus for particle removal by single-phase and two-phase mediaMUI DAVID S L·Filed 2008·Granted Dec 27, 2011·3 cites·11 claims
- 1973US7758404B1Apparatus for cleaning edge of substrate and method for using the sameLAM RES CORP·Filed 2005·Granted Jul 20, 2010·6 cites·12 claims
- 2072US9570320B2Method to etch copper barrier filmLAM RES CORP·Filed 2014·Granted Feb 14, 2017·3 cites·22 claims
- 2172US8486287B2Methods for fabrication of positional and compositionally controlled nanostructures on substrateZHU JI·Filed 2004·Granted Jul 16, 2013·17 cites·31 claims
- 2272US7967019B2Method and apparatus for removing contaminants from substrateLAM RES CORP·Filed 2008·Granted Jun 28, 2011·2 cites·10 claims
- 2369US11823892B2Gas mixture including hydrogen fluoride, alcohol and an additive for preventing stiction of and/or repairing high aspect ratio structuresLAM RES AG·Filed 2019·Granted Nov 21, 2023·1 cites·24 claims
- 2469US8758522B2Method and apparatus for removing contaminants from substrateZHU JI·Filed 2011·Granted Jun 24, 2014·1 cites·18 claims
- 2566US2023084901A1Ultrahigh selective nitride etch to form finfet devicesLAM RES CORP·Filed 2022·Application pending·0 cites
- 2666US2024038526A1Gas mixture including hydrogen fluoride, alcohol and an additive for preventing stiction of and/or repairing high aspect ratio structuresLAM RES AG·Filed 2023·Application pending·0 cites
- 2763US11072811B2Substrates for covalent tethering of proteins to functional groups or solid surfacesPROMEGA CORP·Filed 2014·Granted Jul 27, 2021·0 cites·9 claims
- 2863US8105997B2Composition and application of a two-phase contaminant removal mediumZHU JI·Filed 2008·Granted Jan 31, 2012·1 cites·16 claims
- 2962US10976312B2Compositions and methods for capture of cellular targets of bioactive agentsPROMEGA CORP·Filed 2017·Granted Apr 13, 2021·0 cites·8 claims
- 3060US11373949B2Interconnect structure having metal layers enclosing a dielectricSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2020·Granted Jun 28, 2022·0 cites·10 claims
- 3158US9236279B2Method of dielectric film treatmentYUN SEOKMIN·Filed 2008·Granted Jan 12, 2016·1 cites·17 claims
- 3258US5974576AOn-line memory monitoring system and methodsSUN MICROSYSTEMS INC·Filed 1996·Granted Oct 26, 1999·38 cites·26 claims
- 3357US8726919B2Method and system for uniformly applying a multi-phase cleaning solution to a substrateLAM RES CORP·Filed 2013·Granted May 20, 2014·0 cites·17 claims
- 3457US2008248511A1Methods to quench light from optical reactionsPROMEGA CORP·Filed 2008·Application pending·0 cites
- 3557US2014202503A1Method and system for uniformly applying a multi-phase cleaning solution to a substrateLAM RES CORP·Filed 2014·Application pending·0 cites
- 3655US2025308918A1Selective oxide etch using liquid precursorLAM RES CORP·Filed 2023·Application pending·0 cites
- 3754US8226775B2Methods for particle removal by single-phase and two-phase mediaMUI DAVID S L·Filed 2008·Granted Jul 24, 2012·0 cites·24 claims
- 3851US8601639B2Apparatus for application of two-phase contaminant removal mediumZHU JI·Filed 2012·Granted Dec 10, 2013·0 cites·10 claims
- 3951US8480809B2Methods for application of two-phase contaminant removal mediumZHU JI·Filed 2012·Granted Jul 9, 2013·0 cites·10 claims
- 4051US2012132234A1Apparatus for particle removal by single-phase and two-phase mediaMUI DAVID S L·Filed 2011·Application pending·0 cites
- 4150US10553536B2Method of manufacturing an interconnect structure by forming metal layers in mask openingsSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2017·Granted Feb 4, 2020·0 cites·16 claims
- 4249US10262891B2Substrate having two semiconductor materials on insulatorSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2016·Granted Apr 16, 2019·0 cites·20 claims
- 4349US2009211596A1Method of post etch polymer residue removalLAM RES CORP·Filed 2007·Application pending·0 cites
- 4446US8567421B2Method and system for uniformly applying a multi-phase cleaning solution to a substrateFARBER JEFFREY J·Filed 2011·Granted Oct 29, 2013·0 cites·14 claims
- 4546US8314055B2Materials and systems for advanced substrate cleaningMUI DAVID S L·Filed 2009·Granted Nov 20, 2012·0 cites·15 claims
- 4646US2025226233A1In situ declogging in plasma etchingLAM RES CORP·Filed 2021·Application pending·0 cites
- 4746US2023131233A1Rapid and precise temperature control for thermal etchingLAM RES CORP·Filed 2021·Application pending·0 cites
- 4845US10347530B2Method of forming interconnect structure with partial copper platingSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2017·Granted Jul 9, 2019·0 cites·14 claims
- 4945US2023207328A1Selective precision etching of semiconductor materialsLAM RES CORP·Filed 2021·Application pending·0 cites
- 5043US2012115332A1Method of Post Etch Polymer Residue RemovalYUN SEOKMIN·Filed 2012·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →