Inventor · disambiguated record
John Drewery
Also filed as: DREWERY JOHN · DREWERY JOHN S · DREWERY JOHN STEPHEN
73 granted patents·19 pending applications·1,715 citations·filing 1998–2025
99Inventor score
Top patents by PatentIndex Score
92 records- 0198US9761459B2Systems and methods for reverse pulsingLAM RES CORP·Filed 2015·Granted Sep 12, 2017·93 cites·17 claims
- 0298US9583357B1Systems and methods for reverse pulsingLAM RES CORP·Filed 2016·Granted Feb 28, 2017·98 cites·18 claims
- 0398US7682498B1Rotationally asymmetric variable electrode correctionNOVELLUS SYSTEMS INC·Filed 2005·Granted Mar 23, 2010·39 cites·41 claims
- 0496US10784083B2RF voltage sensor incorporating multiple voltage dividers for detecting RF voltages at a pickup device of a substrate supportLAM RES CORP·Filed 2018·Granted Sep 22, 2020·8 cites·20 claims
- 0596US6790773B1Process for forming barrier/seed structures for integrated circuitsNOVELLUS SYSTEMS INC·Filed 2002·Granted Sep 14, 2004·132 cites·18 claims
- 0695US10121641B2Large dynamic range RF voltage sensor and method for voltage mode RF bias application of plasma processing systemsLAM RES CORP·Filed 2015·Granted Nov 6, 2018·8 cites·20 claims
- 0795US7449098B1Method for planar electroplatingNOVELLUS SYSTEMS INC·Filed 2003·Granted Nov 11, 2008·110 cites·39 claims
- 0895US6417626B1Immersed inductively—coupled plasma sourceTOKYO ELECTRON LTD·Filed 2001·Granted Jul 9, 2002·64 cites·46 claims
- 0995US6287435B1Method and apparatus for ionized physical vapor depositionTOKYO ELECTRON LTD·Filed 1999·Granted Sep 11, 2001·156 cites·12 claims
- 1094US8728958B2Gap fill integrationASHTIANI KAIHAN·Filed 2010·Granted May 20, 2014·26 cites·23 claims
- 1194US7799200B1Selective electrochemical accelerator removalNOVELLUS SYSTEMS INC·Filed 2006·Granted Sep 21, 2010·21 cites·27 claims
- 1294US7531079B1Method and apparatus for uniform electropolishing of damascene IC structures by selective agitationNOVELLUS SYSTEMS INC·Filed 2005·Granted May 12, 2009·25 cites·17 claims
- 1394US7211509B1Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compoundsNOVELLUS SYSTEMS INC·Filed 2004·Granted May 1, 2007·82 cites·24 claims
- 1494US6719886B2Method and apparatus for ionized physical vapor depositionTOKYO ELECTRON LTD·Filed 2001·Granted Apr 13, 2004·54 cites·28 claims
- 1594US6080287AMethod and apparatus for ionized physical vapor depositionTOKYO ELECTRON LTD·Filed 1998·Granted Jun 27, 2000·121 cites·27 claims
- 1692US6525407B1Integrated circuit packageNOVELLUS SYSTEMS INC·Filed 2001·Granted Feb 25, 2003·69 cites·11 claims
- 1792US6197165B1Method and apparatus for ionized physical vapor depositionTOKYO ELECTRON LTD·Filed 1999·Granted Mar 6, 2001·101 cites·17 claims
- 1890US7947163B2Photoresist-free metal depositionNOVELLUS SYSTEMS INC·Filed 2007·Granted May 24, 2011·9 cites·21 claims
- 1990US6537421B2RF bias control in plasma deposition and etch systems with multiple RF power sourcesTOKYO ELECTRON LTD·Filed 2001·Granted Mar 25, 2003·33 cites·18 claims
- 2089US8500985B2Photoresist-free metal depositionMAYER STEVEN T·Filed 2007·Granted Aug 6, 2013·8 cites·40 claims
- 2188US9824896B2Methods and systems for advanced ion control for etching processesLAM RES CORP·Filed 2015·Granted Nov 21, 2017·4 cites·23 claims
- 2288US6709565B2Method and apparatus for uniform electropolishing of damascene ic structures by selective agitationNOVELLUS SYSTEMS INC·Filed 2001·Granted Mar 23, 2004·42 cites·59 claims
- 2388US6652711B2Inductively-coupled plasma processing systemTOKYO ELECTRON LTD·Filed 2001·Granted Nov 25, 2003·31 cites·29 claims
- 2487US9293353B2Faraday shield having plasma density decoupling structure between TCP coil zonesLONG MAOLIN·Filed 2012·Granted Mar 22, 2016·8 cites·10 claims
- 2587US7695597B1Conductive planarization assembly for electrochemical mechanical planarization of a work pieceNOVELLUS SYSTEMS INC·Filed 2006·Granted Apr 13, 2010·8 cites·21 claims
- 2687US6756307B1Apparatus for electrically planarizing semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2002·Granted Jun 29, 2004·40 cites·64 claims
- 2787US6620736B2Electrostatic control of deposition of, and etching by, ionized materials in semiconductor processingTOKYO ELECTRON LTD·Filed 2001·Granted Sep 16, 2003·39 cites·13 claims
- 2886US11031215B2Vacuum pump protection against deposition byproduct buildupLAM RES CORP·Filed 2019·Granted Jun 8, 2021·3 cites·7 claims
- 2986US7449099B1Selectively accelerated plating of metal featuresNOVELLUS SYSTEMS INC·Filed 2004·Granted Nov 11, 2008·31 cites·31 claims
- 3086US6743661B1Method of fabricating an integrated circuit package utilizing an interposer surrounded by a flexible dielectric material with conductive postsNOVELLUS SYSTEMS INC·Filed 2002·Granted Jun 1, 2004·39 cites·11 claims
- 3185US12437966B2Systems and methods for reverse pulsingLAM RES CORP·Filed 2023·Granted Oct 7, 2025·0 cites·7 claims
- 3285US11710623B2Vacuum pump protection against deposition byproduct buildupLAM RES CORP·Filed 2021·Granted Jul 25, 2023·1 cites·11 claims
- 3384US10679825B2Systems and methods for applying frequency and match tuning in a non-overlapping manner for processing substrateLAM RES CORP·Filed 2017·Granted Jun 9, 2020·3 cites·15 claims
- 3484US8268154B1Selective electrochemical accelerator removalMAYER STEVEN T·Filed 2010·Granted Sep 18, 2012·5 cites·15 claims
- 3583US12002653B2Systems and methods for compensating for RF power lossLAM RES CORP·Filed 2020·Granted Jun 4, 2024·2 cites·20 claims
- 3683US9885493B2Air cooled faraday shield and methods for using the sameLAM RES CORP·Filed 2013·Granted Feb 6, 2018·4 cites·21 claims
- 3783US7405163B1Selectively accelerated plating of metal featuresNOVELLUS SYSTEMS INC·Filed 2004·Granted Jul 29, 2008·34 cites·46 claims
- 3882US10943789B2Methods and systems for advanced ion control for etching processesLAM RES CORP·Filed 2017·Granted Mar 9, 2021·2 cites·16 claims
- 3982US7560016B1Selectively accelerated plating of metal featuresNOVELLUS SYSTEMS INC·Filed 2008·Granted Jul 14, 2009·8 cites·32 claims
- 4082US6764168B1Sensor for detecting droplet characteristicsNOVELLUS SYSTEMS INC·Filed 2002·Granted Jul 20, 2004·26 cites·21 claims
- 4181US10957561B2Gas delivery systemLAM RES CORP·Filed 2015·Granted Mar 23, 2021·5 cites·55 claims
- 4281US7041596B1Surface treatment using iodine plasma to improve metal depositionNOVELLUS SYSTEMS INC·Filed 2004·Granted May 9, 2006·25 cites·41 claims
- 4381US6699396B1Methods for electroplating large copper interconnectsNOVELLUS SYSTEMS INC·Filed 2001·Granted Mar 2, 2004·27 cites·7 claims
- 4481US2025232957A1Systems and methods for multi-level pulsing in rf plasma toolsLAM RES CORP·Filed 2025·Application pending·0 cites
- 4580US2025226182A1Systems and methods for multi-level pulsing in rf plasma toolsLAM RES CORP·Filed 2025·Application pending·0 cites
- 4679US12087561B2Vacuum pump protection against deposition byproduct buildupLAM RES CORP·Filed 2023·Granted Sep 10, 2024·0 cites·6 claims
- 4779US9490106B2Internal Faraday shield having distributed chevron patterns and correlated positioning relative to external inner and outer TCP coilDREWERY JOHN·Filed 2011·Granted Nov 8, 2016·5 cites·9 claims
- 4879US6774039B1Process scheme for improving electroplating performance in integrated circuit manufactureNOVELLUS SYSTEMS INC·Filed 2002·Granted Aug 10, 2004·26 cites·27 claims
- 4978US10950454B2Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP methodLAM RES CORP·Filed 2017·Granted Mar 16, 2021·2 cites·16 claims
- 5077US7341946B2Methods for the electrochemical deposition of copper onto a barrier layer of a work pieceNOVELLUS SYSTEMS INC·Filed 2003·Granted Mar 11, 2008·20 cites·19 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →