Inventor · disambiguated record
Jong-Kuk Hong
Also filed as: HONG JONG K · HONG JONG-KUK
10 granted patents·13 pending applications·84 citations·filing 2002–2013
87Inventor score
Top patents by PatentIndex Score
23 records- 0194US7277005B2Printed circuit board including embedded resistor and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Oct 2, 2007·34 cites·12 claims
- 0283US7351915B2Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Apr 1, 2008·31 cites·8 claims
- 0376US8445790B2Coreless substrate having filled via pad and method of manufacturing the sameLEE SEOK KYU·Filed 2009·Granted May 21, 2013·8 cites·4 claims
- 0470US7971352B2Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 5, 2011·5 cites·11 claims
- 0560US8051559B2Method of manufacturing a multi-layer boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Nov 8, 2011·1 cites·6 claims
- 0657US9338887B2Core substrate, manufacturing method thereof, and structure for metal viaSAMSUNG ELECTRO MECH·Filed 2013·Granted May 10, 2016·0 cites·12 claims
- 0757US8499444B2Method of manufacturing a package substrateAN JIN-YONG·Filed 2008·Granted Aug 6, 2013·1 cites·8 claims
- 0855US2013243941A1Method of manufacturing coreless substrate having filled via padSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0950US2007146980A1Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1049US2008110669A1Printed circuit board having embedded resistors and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1149US2014174798A1Metal core substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1249US2013313004A1Package substrateSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1348US2009073670A1Multilayered printed circuit board and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1447US2014144693A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1546US6656378B2Piezoelectric ceramic composition reducing leakage current and piezoelectric device using the sameCERA CO LTD S·Filed 2002·Granted Dec 2, 2003·2 cites·9 claims
- 1646US2009084494A1Substrate manufacturing methodSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1745US2009038837A1Multilayered printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1845US2011097553A1Trench substrate and method of fabricating the sameHONG JONG KUK·Filed 2009·Application pending·0 cites
- 1944US6683014B2Piezoelectric ceramic composition and piezoelectric ceramic device using the sameCERA CO LTD S·Filed 2002·Granted Jan 27, 2004·1 cites·2 claims
- 2043US7284317B2Method of producing printed circuit board with embedded resistorSAMSUNG ELECTRO MECH·Filed 2004·Granted Oct 23, 2007·1 cites·16 claims
- 2143US2006115770A1Printed circuit board including embedded capacitor and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 2237US2013119540A1Semiconductor package and method for manufacturing the sameHONG JONG KUK·Filed 2012·Application pending·0 cites
- 2336US2006014327A1Method of fabricating PCB including embedded passive chipSAMSUNG ELECTRO MECH·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →