Inventor · disambiguated record
John L. Klocke
Also filed as: KLOCKE JOHN · KLOCKE JOHN L · KLOCKE JOHN LEE
40 granted patents·21 pending applications·158 citations·filing 2000–2025
97Inventor score
Files withAPPLIED MATERIALS INC34SEMITOOL INC19BASKARAN RAJESH4KLOCKE JOHN L1VARIAN SEMICONDUCTOR EQUIPMENT ASS INC1
Top patents by PatentIndex Score
61 records- 0193US12116686B2Parameter adjustment model for semiconductor processing chambersAPPLIED MATERIALS INC·Filed 2022·Granted Oct 15, 2024·2 cites·17 claims
- 0293US11634830B2Electrochemical depositions of nanotwin copper materialsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 25, 2023·2 cites·17 claims
- 0390US10546762B2Drying high aspect ratio featuresAPPLIED MATERIALS INC·Filed 2017·Granted Jan 28, 2020·6 cites·20 claims
- 0487US8500968B2Deplating contacts in an electrochemical plating apparatusWOODRUFF DANIEL J·Filed 2010·Granted Aug 6, 2013·7 cites·15 claims
- 0586US7351315B2Chambers, systems, and methods for electrochemically processing microfeature workpiecesSEMITOOL INC·Filed 2003·Granted Apr 1, 2008·20 cites·26 claims
- 0686US7147765B2Apparatus and method for deposition of an electrophoretic emulsionSEMITOOL INC·Filed 2002·Granted Dec 12, 2006·16 cites·25 claims
- 0784US11982008B2Electroplating systemAPPLIED MATERIALS INC·Filed 2023·Granted May 14, 2024·0 cites·5 claims
- 0884US8961771B2Electrolytic process using cation permeable barrierBASKARAN RAJESH·Filed 2012·Granted Feb 24, 2015·2 cites·15 claims
- 0984US8236159B2Electrolytic process using cation permeable barrierBASKARAN RAJESH·Filed 2006·Granted Aug 7, 2012·3 cites·38 claims
- 1084US6527925B1Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2000·Granted Mar 4, 2003·23 cites·32 claims
- 1183US7628898B2Method and system for idle state operationSEMITOOL INC·Filed 2005·Granted Dec 8, 2009·3 cites·7 claims
- 1282US7351314B2Chambers, systems, and methods for electrochemically processing microfeature workpiecesSEMITOOL INC·Filed 2003·Granted Apr 1, 2008·16 cites·23 claims
- 1381US10240248B2Adaptive electric field shielding in an electroplating processor using agitator geometry and motion controlAPPLIED MATERIALS INC·Filed 2016·Granted Mar 26, 2019·1 cites·9 claims
- 1481US6911127B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted Jun 28, 2005·17 cites·42 claims
- 1580US11578422B2Electroplating systemAPPLIED MATERIALS INC·Filed 2022·Granted Feb 14, 2023·0 cites·17 claims
- 1679US7585398B2Chambers, systems, and methods for electrochemically processing microfeature workpiecesSEMITOOL INC·Filed 2004·Granted Sep 8, 2009·11 cites·9 claims
- 1778US10002771B1Methods for chemical mechanical polishing (CMP) processing with ozoneAPPLIED MATERIALS INC·Filed 2017·Granted Jun 19, 2018·3 cites·20 claims
- 1877US10227707B2Inert anode electroplating processor and replenisherAPPLIED MATERIALS INC·Filed 2015·Granted Mar 12, 2019·1 cites·9 claims
- 1977US7169280B2Apparatus and method for deposition of an electrophoretic emulsionSEMITOOL INC·Filed 2002·Granted Jan 30, 2007·7 cites·18 claims
- 2076US12404597B2Electrochemical depositions of nanotwin copper materialsAPPLIED MATERIALS INC·Filed 2023·Granted Sep 2, 2025·0 cites·18 claims
- 2175US2025347020A1Electroplating co-planarity improvement by die shieldingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2275US2025051951A1Plating and deplating currents for material co-planarity in semiconductor plating processesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2373US12209325B2Nanofiltration for wafer rinsingAPPLIED MATERIALS INC·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 2473US11268208B2Electroplating systemAPPLIED MATERIALS INC·Filed 2020·Granted Mar 8, 2022·0 cites·15 claims
- 2569US10354875B1Techniques for improved removal of sacrificial maskVARIAN SEMICONDUCTOR EQUIPMENT ASS INC·Filed 2018·Granted Jul 16, 2019·1 cites·18 claims
- 2669US7794573B2Systems and methods for electrochemically processing microfeature workpiecesSEMITOOL INC·Filed 2005·Granted Sep 14, 2010·3 cites·15 claims
- 2768US12469720B2Electroplating wetting chamber with reduced bubble entrapmentAPPLIED MATERIALS INC·Filed 2023·Granted Nov 11, 2025·0 cites·16 claims
- 2868US2014209472A1Electrolytic process using cation permeable barrierAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 2967US12146235B2Plating and deplating currents for material co-planarity in semiconductor plating processesAPPLIED MATERIALS INC·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 3067US9234293B2Electrolytic copper process using anion permeable barrierAPPLIED MATERIALS INC·Filed 2014·Granted Jan 12, 2016·1 cites·12 claims
- 3167US2025116028A1Electroplating chamber using jet array to enable high mass-transferAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3265US12344955B2Electroplating co-planarity improvement by die shieldingAPPLIED MATERIALS INC·Filed 2021·Granted Jul 1, 2025·0 cites·20 claims
- 3365US2007175759A1Apparatus and method for deposition of an electrophoretic emulsionSEMITOOL INC·Filed 2006·Application pending·0 cites
- 3465US2025198041A1Controlled ph rinse to limit cross-contamination in electroplating bathsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3564US12188144B2Wafer immersion in semiconductor processing chambersAPPLIED MATERIALS INC·Filed 2022·Granted Jan 7, 2025·0 cites·16 claims
- 3661US8123926B2Electrolytic copper process using anion permeable barrierBASKARAN RAJESH·Filed 2006·Granted Feb 28, 2012·1 cites·48 claims
- 3760US11973034B2Nanotwin copper materials in semiconductor devicesAPPLIED MATERIALS INC·Filed 2021·Granted Apr 30, 2024·0 cites·19 claims
- 3860US7150816B2Apparatus and method for deposition of an electrophoretic emulsionSEMITOOL INC·Filed 2002·Granted Dec 19, 2006·1 cites·23 claims
- 3960US6939448B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted Sep 6, 2005·6 cites·29 claims
- 4058US7048841B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted May 23, 2006·5 cites·5 claims
- 4157US2024413011A1Automated dial-in of electroplating process parameters based on wafer results from ex-situ metrologyAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4256US2024254645A1Low temperature hybrid bonding metallizationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4355US11901225B2Diffusion layers in metal interconnectsAPPLIED MATERIALS INC·Filed 2021·Granted Feb 13, 2024·0 cites·14 claims
- 4450US2006163072A1Electrolytic process using anion permeable barrierSEMITOOL INC·Filed 2005·Application pending·0 cites
- 4549US2006144712A1Systems and methods for electrochemically processing microfeature workpiecesKLOCKE JOHN L·Filed 2005·Application pending·0 cites
- 4648US10191379B2Removing photoresist from a waferAPPLIED MATERIALS INC·Filed 2017·Granted Jan 29, 2019·0 cites·13 claims
- 4748US8852417B2Electrolytic process using anion permeable barrierBASKARAN RAJESH·Filed 2012·Granted Oct 7, 2014·0 cites·25 claims
- 4848US2006157355A1Electrolytic process using anion permeable barrierSEMITOOL INC·Filed 2005·Application pending·0 cites
- 4947US10971354B2Drying high aspect ratio featuresAPPLIED MATERIALS INC·Filed 2017·Granted Apr 6, 2021·0 cites·20 claims
- 5047US10840104B2Controlled etch of nitride featuresAPPLIED MATERIALS INC·Filed 2018·Granted Nov 17, 2020·0 cites·19 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →