Electroplating chamber using jet array to enable high mass-transfer

Abstract

Exemplary electroplating systems may include a vessel. The systems may include a head that is configured to hold a substrate. The head may be positionable within an interior of the vessel. The systems may include a spray jet array disposed within the interior of the vessel. The spray jet array may include a plate defining a plurality of apertures through a thickness of the plate. The systems may include at least one fluid pump that is fluidly coupled with an inlet end of each of the plurality of apertures.

What is claimed is: 
     
         1 . An electroplating system, comprising:
 a vessel;   a head that is configured to hold a substrate, the head being positionable within an interior of the vessel;   a spray jet array disposed within the interior of the vessel, the spray jet array comprising a plate defining a plurality of apertures through a thickness of the plate; and   at least one fluid pump that is fluidly coupled with an inlet end of each of the plurality of apertures.   
     
     
         2 . The electroplating system of  claim 1 , wherein:
 the head is rotatable within the vessel; and   a center of rotation of the head is offset from a center of the spray jet array.   
     
     
         3 . The electroplating system of  claim 1 , wherein:
 the head is rotatable within the vessel; and   one or both of the head and the spray jet array is laterally translatable within the vessel.   
     
     
         4 . The electroplating system of  claim 1 , wherein:
 the plate comprises a plurality of tubes that extend upward from a top surface of the plate toward a bottom surface of the head; and   each of the plurality of tubes is aligned with and partially defines one of the plurality of apertures.   
     
     
         5 . The electroplating system of  claim 1 , wherein:
 the plate comprises a first plate;   the plurality of apertures comprise a first plurality of apertures and a second plurality of apertures;   the spray jet array comprises a second plate coupled with the first plate on a bottom side of the first plate;   an outlet end of each of the first plurality of apertures and each of the second plurality of apertures extends through a top surface of the first plate;   an inlet end of each of the first plurality of apertures extends through a bottom surface of the first plate; and   an inlet end of each of the second plurality of apertures extends through a bottom surface of the second plate.   
     
     
         6 . The electroplating system of  claim 5 , wherein:
 the first plurality of apertures and the second plurality of apertures are arranged about the first plate in an alternating fashion.   
     
     
         7 . The electroplating system of  claim 5 , wherein:
 a plurality of tubes extend between the first plate and the second plate;   each of the plurality of tubes is aligned with and partially defines one of the second plurality of apertures;   a plenum is defined between the first plate and the second plate;   the plenum extends about an exterior of each of the plurality of tubes; and   the at least one fluid pump is fluidly coupled with the first plurality of apertures via the plenum and is fluidly coupled with the second plurality of apertures via the bottom surface of the second plate.   
     
     
         8 . The electroplating system of  claim 1 , wherein:
 a diameter of each of the plurality of apertures is no greater than 1 mm.   
     
     
         9 . The electroplating system of  claim 1 , wherein:
 the plate defines a plurality of drain tubes.   
     
     
         10 . The electroplating system of  claim 1 , wherein:
 a pitch to diameter ratio of a substantial percentage of the plurality of apertures is at least 8; and   a ratio of a gap between the plate and the substrate and a pitch of the plurality of apertures is at least 1.   
     
     
         11 . An electroplating system, comprising:
 a vessel;   a head that is configured to hold a substrate, the head being positionable within an interior of the vessel;   a spray jet array disposed within the interior of the vessel, the spray jet array comprising a plate defining a plurality of apertures through a thickness of the plate;   at least one fluid pump that is fluidly coupled with an inlet end of each of the plurality of apertures; and   a power source that is configured to supply a current to an interior of the vessel.   
     
     
         12 . The electroplating system of  claim 11 , wherein:
 the plurality of apertures comprise a first plurality of apertures forming a first fluid channel and a second plurality of apertures forming a second fluid channel;   the at least one fluid pump is operable to control a flow of fluid to the first plurality of apertures and the second plurality of apertures independently; and   the power source is operable to deliver current to both the first plurality of apertures and the second plurality of apertures.   
     
     
         13 . The electroplating system of  claim 12 , wherein:
 the power source is operable to independently control an amount of current delivered to the first plurality of apertures and the second plurality of apertures.   
     
     
         14 . The electroplating system of  claim 11 , wherein:
 an average pitch of the plurality of apertures is no greater than 12 mm.   
     
     
         15 . The electroplating system of  claim 14 , wherein:
 when the head is in the plating position, outlet ends of each of the plurality of apertures are within 25 mm of a bottom end of the head.   
     
     
         16 . A method of plating a substrate, comprising:
 submerging a substrate within a liquid electrolyte disposed within a vessel;   spraying the substrate with a plurality of jets of the liquid electrolyte, wherein a flow rate defining each jet of the plurality of jets is at least 0.02 gallons per minute; and   conducting ionic current through the liquid electrolyte.   
     
     
         17 . The method of plating a substrate of  claim 16 , wherein:
 the plurality of jets are generated by flowing a volume of the liquid electrolyte through a plurality of apertures defined by a plate of a spray jet array.   
     
     
         18 . The method of plating a substrate of  claim 17 , wherein:
 the plate comprises a plurality of tubes that extend upward from a top surface of the plate toward the substrate; and   each of the plurality of tubes is aligned with and partially defines one of the plurality of apertures.   
     
     
         19 . The method of plating a substrate of  claim 17 , wherein:
 the plurality of apertures comprise a first plurality of apertures forming a first fluid channel and a second plurality of apertures forming a second fluid channel.   
     
     
         20 . The method of plating a substrate of  claim 19 , wherein:
 spraying the substrate comprises:
 spraying the substrate with jets formed through only the first plurality of apertures; 
 ceasing to spray the substrate with jets formed through the first plurality of apertures; and 
 spraying the substrate with jets formed through only the second plurality of apertures.