Inventor · disambiguated record
Jurgen Weichart
Also filed as: WEICHART JUERGEN · WEICHART JURGEN · WEICHART JÜRGEN
22 granted patents·14 pending applications·83 citations·filing 2002–2023
94Inventor score
Files withEVATEC AG19OC OERLIKON BALZERS AG4KADLEC STANISLAV3OERLIKON ADVANCED TECHNOLOGIES AG3WEICHART JUERGEN2
Top patents by PatentIndex Score
36 records- 0193US10388559B2Apparatus for depositing a layer on a substrate in a processing gasEVATEC AG·Filed 2016·Granted Aug 20, 2019·13 cites·15 claims
- 0292US9355824B2Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS)KADLEC STANISLAV·Filed 2007·Granted May 31, 2016·17 cites·16 claims
- 0386US8435389B2RF substrate bias with high power impulse magnetron sputtering (HIPIMS)KADLEC STANISLAV·Filed 2007·Granted May 7, 2013·7 cites·5 claims
- 0482US10403522B2Chamber for degassing substratesEVATEC AG·Filed 2018·Granted Sep 3, 2019·2 cites·24 claims
- 0581US10692707B2RF substrate bias with high power impulse magnetron sputtering (HIPIMS)OC OERLIKON BALZERS AG·Filed 2013·Granted Jun 23, 2020·3 cites·12 claims
- 0680US9587306B2Method for producing a directional layer by cathode sputtering, and device for implementing the methodROHRMANN HARTMUT·Filed 2008·Granted Mar 7, 2017·12 cites·15 claims
- 0779US9611537B2Target shapingKADLEC STANISLAV·Filed 2011·Granted Apr 4, 2017·2 cites·10 claims
- 0877US11776825B2Chamber for degassing substratesEVATEC AG·Filed 2016·Granted Oct 3, 2023·2 cites·33 claims
- 0977US11217434B2RF capacitive coupled dual frequency etch reactorEVATEC AG·Filed 2017·Granted Jan 4, 2022·2 cites·33 claims
- 1076US10580671B2Chamber for degassing substratesEVATEC AG·Filed 2019·Granted Mar 3, 2020·1 cites·20 claims
- 1171US8268142B2RF sputtering arrangementWEICHART JUERGEN·Filed 2009·Granted Sep 18, 2012·3 cites·19 claims
- 1271US2023395402A1Chamber for degassing substratesEVATEC AG·Filed 2023·Application pending·0 cites
- 1370US9934992B2Chamber for degassing substratesEVATEC AG·Filed 2015·Granted Apr 3, 2018·1 cites·24 claims
- 1467US9490166B2Apparatus and method for depositing a layer onto a substrateRIESCHL SVEN UWE·Filed 2011·Granted Nov 8, 2016·3 cites·16 claims
- 1564US7736462B2Installation for processing a substrateOC OERLIKON BALZERS AG·Filed 2004·Granted Jun 15, 2010·9 cites·32 claims
- 1662US8475634B2Application of HIPIMS to through silicon via metallization in three-dimensional wafer packagingWEICHART JURGEN·Filed 2008·Granted Jul 2, 2013·2 cites·20 claims
- 1761US8613828B2Procedure and device for the production of a plasmaWEICHART JUERGEN·Filed 2008·Granted Dec 24, 2013·2 cites·8 claims
- 1858US11211234B2Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS)EVATEC AG·Filed 2016·Granted Dec 28, 2021·0 cites·8 claims
- 1955US2009252892A1Processing chamberOC OERLIKON BALZERS AG·Filed 2009·Application pending·0 cites
- 2055US2016108515A1Method for filling vias and substrate-via filling vacuum processing systemEVATEC ADVANCED TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 2154US11469085B2Vacuum plasma workpiece treatment apparatusEVATEC AG·Filed 2017·Granted Oct 11, 2022·0 cites·32 claims
- 2254US2015114826A1Pvd apparatus for directional material deposition, methods and workpieceOERLIKON ADVANCED TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 2353US11742187B2RF capacitive coupled etch reactorEVATEC AG·Filed 2017·Granted Aug 29, 2023·0 cites·34 claims
- 2453US2014349011A1Processing chamberOERLIKON ADVANCED TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 2552US2022396864A1Vacuum process treatment chamber and method of treating a substrate by means of a vacuum treatment processEVATEC AG·Filed 2020·Application pending·0 cites
- 2651US2015184284A1Method of coating by pulsed bipolar sputteringOERLIKON ADVANCED TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 2748US2020230643A1Permeation-barrierEVATEC AG·Filed 2018·Application pending·0 cites
- 2848US2020216955A1Permeation-barrierEVATEC AG·Filed 2018·Application pending·0 cites
- 2945US2017175247A1Sputtering source arrangement, sputtering system and method of manufacturing metal-coated plate-shaped substratesEVATEC AG·Filed 2014·Application pending·0 cites
- 3044US7476301B2Procedure and device for the production of a plasmaOC OERLIKON BALZERS AG·Filed 2002·Granted Jan 13, 2009·2 cites·15 claims
- 3137US2021348274A1Plasma enhanced atomic layer deposition (peald) apparatusEVATEC AG·Filed 2019·Application pending·0 cites
- 3237US2021202282A1Method and apparatus for treating a substrateEVATEC AG·Filed 2018·Application pending·0 cites
- 3336US11145495B2Vacuum treatment chamber and method of manufacturing a vacuum treated plate-shaped substrateEVATEC AG·Filed 2017·Granted Oct 12, 2021·0 cites·20 claims
- 3436US8778144B2Method for manufacturing magnetron coated substrates and magnetron sputter sourceWEICHART JURGEN·Filed 2004·Granted Jul 15, 2014·0 cites·10 claims
- 3535US2021319984A1Method and aparatus for low particle plasma etchingEVATEC AG·Filed 2019·Application pending·0 cites
- 3626US2018261473A1Apparatus and method especially for degassing of substratesEVATEC AG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →