Inventor · disambiguated record
Jun Young Yang
Also filed as: YANG JUN · YANG JUN Y · YANG JUN-YOUNG
21 granted patents·10 pending applications·990 citations·filing 2000–2024
96Inventor score
Files withADVANCED SEMICONDUCTOR ENG13AMKOR TECHNOLOGY INC9SAMOO ARCHITECTS&ENGINEERS CO LTD2YANG JUN YOUNG2CORNING RES & DEV CORP1
Top patents by PatentIndex Score
31 records- 0197US7045396B2Stackable semiconductor package and method for manufacturing sameAMKOR TECHNOLOGY INC·Filed 2003·Granted May 16, 2006·174 cites·19 claims
- 0297US6730544B1Stackable semiconductor package and method for manufacturing sameAMKOR TECHNOLOGY INC·Filed 2000·Granted May 4, 2004·217 cites·21 claims
- 0396US7700411B2Semiconductor device package and manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Apr 20, 2010·88 cites·10 claims
- 0496US7633170B2Semiconductor device package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Dec 15, 2009·71 cites·16 claims
- 0593US6605866B1Stackable semiconductor package and method for manufacturing sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Aug 12, 2003·86 cites·25 claims
- 0692US7656047B2Semiconductor device package and manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Feb 2, 2010·49 cites·6 claims
- 0792US7166917B2Semiconductor package having passive component disposed between semiconductor device and substrateADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jan 23, 2007·33 cites·18 claims
- 0891US9236356B2Semiconductor package with grounding and shielding layersADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jan 12, 2016·22 cites·17 claims
- 0990US11719891B2Method of making a lensed connector with photosensitive glassCORNING RES & DEV CORP·Filed 2021·Granted Aug 8, 2023·2 cites·12 claims
- 1085US7439098B2Semiconductor package for encapsulating multiple dies and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Oct 21, 2008·21 cites·20 claims
- 1184US7833837B2Chip scale package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Nov 16, 2010·12 cites·17 claims
- 1284US7146011B2Steering of directional sound beamsUNIV NANYANG·Filed 2004·Granted Dec 5, 2006·53 cites·11 claims
- 1383US6879034B1Semiconductor package including low temperature co-fired ceramic substrateAMKOR TECHNOLOGY INC·Filed 2003·Granted Apr 12, 2005·38 cites·20 claims
- 1480US6639308B1Near chip size semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 28, 2003·26 cites·7 claims
- 1579US6469258B1Circuit board for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 22, 2002·35 cites·44 claims
- 1674US6646290B1Optical structure having an optical diode and a sensor in separate apertures inside double insulating layersAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 11, 2003·12 cites·20 claims
- 1773US6995448B2Semiconductor package including passive elements and method of manufactureAMKOR TECHNOLOGY INC·Filed 2002·Granted Feb 7, 2006·33 cites·13 claims
- 1868US8625814B2Earphone antenna of a portable terminalYANG JUN YOUNG·Filed 2011·Granted Jan 7, 2014·4 cites·10 claims
- 1967US7146106B2Optic semiconductor module and manufacturing methodAMKOR TECHNOLOGY INC·Filed 2002·Granted Dec 5, 2006·14 cites·17 claims
- 2063US2025314126A1Louver apparatus with independent top and bottom, and drawer-type building envelope structure using sameSAMOO ARCHITECTS&ENGINEERS CO LTD·Filed 2024·Application pending·0 cites
- 2163US2025314064A1Method for changing building envelope functionSAMOO ARCHITECTS&ENGINEERS CO LTD·Filed 2024·Application pending·0 cites
- 2245US2008174013A1Semiconductor device package and manufacturing method thereofYANG JUN YOUNG·Filed 2008·Application pending·0 cites
- 2344US2007272727A1Die pick and place toolADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 2443US2006170096A1Chip scale package and method for manufacturing the sameYANG JUN Y·Filed 2005·Application pending·0 cites
- 2542US2007257348A1Multiple chip package module and method of fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 2641US2007013038A1Semiconductor package having pre-plated leads and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 2737US2006016973A1Multi-chip image sensor package moduleADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 2836US2006216868A1Package structure and fabrication thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 2935US8882953B2Method for fabricating cliché, and method for forming thin film pattern by using the sameKOOK YUN-HO·Filed 2010·Granted Nov 11, 2014·0 cites·9 claims
- 3034US8154111B2Near chip size semiconductor packageCROWLEY SEAN TIMOTHY·Filed 2003·Granted Apr 10, 2012·0 cites·18 claims
- 3132US2005258518A1Image sensor package module with a leadless leadframe between chipsADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →