Inventor · disambiguated record

Ju Hoon Yoon

Also filed as: YOON JU HOON

32 granted patents·5 pending applications·753 citations·filing 1996–2025

97Inventor score

Technology areasH10W

Files withAMKOR TECHNOLOGY INC23 AMKOR TECH SINGAPORE HOLDING PTE LTD11 ANAM SEMICONDUCTOR INC2 DARVEAUX ROBERT FRANCIS1

Top patents by PatentIndex Score

37 records

0197US7898093B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 1, 2011·50 cites·8 claims
0296US5866939ALead end grid array semiconductor packageANAM SEMICONDUCTOR INC·Filed 1996·Granted Feb 2, 1999·358 cites·56 claims
0395US9831282B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 28, 2017·9 cites·20 claims
0495US8476748B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2012·Granted Jul 2, 2013·15 cites·20 claims
0594US9431447B2Package of finger print sensor and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 30, 2016·8 cites·20 claims
0693US9627368B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 18, 2017·11 cites·19 claims
0793US9129873B2Package of finger print sensor and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 8, 2015·10 cites·20 claims
0892US10304890B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·5 cites·22 claims
0992US8847372B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 30, 2014·8 cites·20 claims
1091US8368194B1Exposed die overmolded flip chip packageAMKOR TECHNOLOGY INC·Filed 2012·Granted Feb 5, 2013·8 cites·17 claims
1190US10692918B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Jun 23, 2020·3 cites·20 claims
1290US8541260B1Exposed die overmolded flip chip package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 24, 2013·7 cites·20 claims
1389US12230661B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Feb 18, 2025·0 cites·20 claims
1489US6150709AGrid array type lead frame having lead ends in different planesANAM SEMICONDUCTOR INC·Filed 1998·Granted Nov 21, 2000·100 cites·34 claims
1589US2025349817A1Semiconductor device using emc wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
1682US2025022784A1Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
1781US11961867B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
1881US10388643B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 20, 2019·2 cites·20 claims
1980US2025160031A1Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
2079US8207022B1Exposed die overmolded flip chip package methodDARVEAUX ROBERT FRANCIS·Filed 2011·Granted Jun 26, 2012·3 cites·20 claims
2178US10177117B2Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structureAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 8, 2019·3 cites·12 claims
2278US6479887B1Circuit pattern tape for wafer-scale production of chip size semiconductor packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Nov 12, 2002·59 cites·28 claims
2377US6589801B1Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniquesAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 8, 2003·55 cites·37 claims
2476US12362343B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 15, 2025·0 cites·25 claims
2576US12107035B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
2674US11362128B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
2774US2025155105A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
2873US10090230B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2014·Granted Oct 2, 2018·2 cites·21 claims
2972US12237239B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
3065US6428641B1Method for laminating circuit pattern tape on semiconductor waferAMKOR TECHNOLOGY INC·Filed 1999·Granted Aug 6, 2002·36 cites·40 claims
3164US11183493B2Semiconductor device using EMC wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Nov 23, 2021·0 cites·13 claims
3259US11430723B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2018·Granted Aug 30, 2022·0 cites·21 claims
3359US9627348B2Laser assisted bonding for semiconductor die interconnectionsAMKOR TECHNOLOGY INC·Filed 2015·Granted Apr 18, 2017·1 cites·17 claims
3458US11205602B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 21, 2021·0 cites·20 claims
3554US10062626B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Aug 28, 2018·0 cites·25 claims
3639US9633966B2Stacked semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Apr 25, 2017·0 cites·20 claims
3734US2017200686A1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →