Inventor · disambiguated record
Kallol Bera
Also filed as: BERA KALLOL
78 granted patents·44 pending applications·1,723 citations·filing 2002–2024
99Inventor score
Files withAPPLIED MATERIALS INC81BERA KALLOL9BUCHBERGER JR DOUGLAS A6COLLINS KENNETH S6BRILLHART PAUL LUKAS5
Top patents by PatentIndex Score
122 records- 0198US9653267B2Temperature controlled chamber linerCARDUCCI JAMES D·Filed 2012·Granted May 16, 2017·319 cites·20 claims
- 0298US9068265B2Gas distribution plate with discrete protective elementsLUBOMIRSKY DMITRY·Filed 2012·Granted Jun 30, 2015·75 cites·20 claims
- 0398US8512509B2Plasma reactor gas distribution plate with radially distributed path splitting manifoldBERA KALLOL·Filed 2007·Granted Aug 20, 2013·217 cites·14 claims
- 0498US8231799B2Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zoneBERA KALLOL·Filed 2006·Granted Jul 31, 2012·557 cites·18 claims
- 0596US8092639B2Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changesBUCHBERGER JR DOUGLAS A·Filed 2010·Granted Jan 10, 2012·20 cites·7 claims
- 0696US8012304B2Plasma reactor with a multiple zone thermal control feed forward control apparatusAPPLIED MATERIALS INC·Filed 2006·Granted Sep 6, 2011·27 cites·11 claims
- 0796US7968469B2Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformityAPPLIED MATERIALS INC·Filed 2007·Granted Jun 28, 2011·46 cites·26 claims
- 0894US8608852B2Temperature controlled plasma processing chamber component with zone dependent thermal efficienciesMAHADESWARASWAMY CHETAN·Filed 2011·Granted Dec 17, 2013·25 cites·13 claims
- 0994US8608900B2Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changesBUCHBERGER JR DOUGLAS A·Filed 2006·Granted Dec 17, 2013·18 cites·20 claims
- 1093US11114284B2Plasma reactor with electrode array in ceilingAPPLIED MATERIALS INC·Filed 2017·Granted Sep 7, 2021·4 cites·18 claims
- 1193US9336997B2RF multi-feed structure to improve plasma uniformityAPPLIED MATERIALS INC·Filed 2014·Granted May 10, 2016·12 cites·20 claims
- 1293US8329586B2Method of processing a workpiece in a plasma reactor using feed forward thermal controlBUCHBERGER JR DOUGLAS A·Filed 2010·Granted Dec 11, 2012·11 cites·18 claims
- 1393US8221580B2Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loopsBUCHBERGER JR DOUGLAS A·Filed 2006·Granted Jul 17, 2012·14 cites·18 claims
- 1492US8980044B2Plasma reactor with a multiple zone thermal control feed forward control apparatusBRILLHART PAUL LUKAS·Filed 2010·Granted Mar 17, 2015·10 cites·19 claims
- 1592US8337660B2Capacitively coupled plasma reactor having very agile wafer temperature controlBUCHBERGER JR DOUGLAS A·Filed 2010·Granted Dec 25, 2012·12 cites·13 claims
- 1692US8021521B2Method for agile workpiece temperature control in a plasma reactor using a thermal modelAPPLIED MATERIALS INC·Filed 2006·Granted Sep 20, 2011·13 cites·19 claims
- 1791US11189502B2Showerhead with interlaced gas feed and removal and methods of useAPPLIED MATERIALS INC·Filed 2019·Granted Nov 30, 2021·5 cites·20 claims
- 1891US10763085B2Shaped electrodes for improved plasma exposure from vertical plasma sourceAPPLIED MATERIALS INC·Filed 2018·Granted Sep 1, 2020·5 cites·20 claims
- 1991US9711330B2RF multi-feed structure to improve plasma uniformityAPPLIED MATERIALS INC·Filed 2016·Granted Jul 18, 2017·6 cites·20 claims
- 2091US8313578B2Etching chamber having flow equalizer and lower linerCARDUCCI JAMES D·Filed 2009·Granted Nov 20, 2012·13 cites·13 claims
- 2191US8157951B2Capacitively coupled plasma reactor having very agile wafer temperature controlBUCHBERGER JR DOUGLAS A·Filed 2006·Granted Apr 17, 2012·18 cites·16 claims
- 2291US7988872B2Method of operating a capacitively coupled plasma reactor with dual temperature control loopsAPPLIED MATERIALS INC·Filed 2006·Granted Aug 2, 2011·19 cites·20 claims
- 2391US7585384B2Apparatus and method to confine plasma and reduce flow resistance in a plasma reactorAPPLIED MATERIALS INC·Filed 2008·Granted Sep 8, 2009·10 cites·11 claims
- 2490US12020965B2Magnetic holding structures for plasma processing applicationsAPPLIED MATERIALS INC·Filed 2020·Granted Jun 25, 2024·2 cites·10 claims
- 2590US10879042B2Symmetric plasma source to generate pie shaped treatmentAPPLIED MATERIALS INC·Filed 2017·Granted Dec 29, 2020·5 cites·16 claims
- 2690US8034180B2Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactorAPPLIED MATERIALS INC·Filed 2006·Granted Oct 11, 2011·14 cites·6 claims
- 2790US7879731B2Improving plasma process uniformity across a wafer by apportioning power among plural VHF sourcesAPPLIED MATERIALS INC·Filed 2007·Granted Feb 1, 2011·13 cites·28 claims
- 2890US7777599B2Methods and apparatus for controlling characteristics of a plasmaAPPLIED MATERIALS INC·Filed 2007·Granted Aug 17, 2010·12 cites·33 claims
- 2990US7431859B2Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulationAPPLIED MATERIALS INC·Filed 2006·Granted Oct 7, 2008·18 cites·16 claims
- 3089US10510515B2Processing tool with electrically switched electrode assemblyAPPLIED MATERIALS INC·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 3189US8647438B2Annular baffleHOFFMAN DANIEL J·Filed 2008·Granted Feb 11, 2014·11 cites·10 claims
- 3289US8092638B2Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distributionBRILLHART PAUL LUKAS·Filed 2006·Granted Jan 10, 2012·15 cites·9 claims
- 3389US7540971B2Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas contentAPPLIED MATERIALS INC·Filed 2006·Granted Jun 2, 2009·16 cites·19 claims
- 3488US9696097B2Multi-substrate thermal management apparatusAPPLIED MATERIALS INC·Filed 2014·Granted Jul 4, 2017·8 cites·18 claims
- 3588US8076247B2Plasma process uniformity across a wafer by controlling RF phase between opposing electrodesCOLLINS KENNETH S·Filed 2007·Granted Dec 13, 2011·11 cites·20 claims
- 3688US7754997B2Apparatus and method to confine plasma and reduce flow resistance in a plasmaAPPLIED MATERIALS INC·Filed 2007·Granted Jul 13, 2010·8 cites·5 claims
- 3787US9267742B2Apparatus for controlling the temperature uniformity of a substrateBERA KALLOL·Filed 2010·Granted Feb 23, 2016·5 cites·19 claims
- 3887US8546267B2Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal controlBRILLHART PAUL LUKAS·Filed 2010·Granted Oct 1, 2013·5 cites·7 claims
- 3987US7674353B2Apparatus to confine plasma and to enhance flow conductanceAPPLIED MATERIALS INC·Filed 2006·Granted Mar 9, 2010·8 cites·20 claims
- 4087US7541292B2Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zonesAPPLIED MATERIALS INC·Filed 2006·Granted Jun 2, 2009·12 cites·21 claims
- 4186US11081317B2Modular high-frequency sourceAPPLIED MATERIALS INC·Filed 2018·Granted Aug 3, 2021·3 cites·19 claims
- 4286US7988815B2Plasma reactor with reduced electrical skew using electrical bypass elementsAPPLIED MATERIALS INC·Filed 2007·Granted Aug 2, 2011·11 cites·19 claims
- 4385US11959174B2Shunt door for magnets in plasma process chamberAPPLIED MATERIALS INC·Filed 2020·Granted Apr 16, 2024·1 cites·20 claims
- 4485US10903056B2Plasma source for rotating susceptorAPPLIED MATERIALS INC·Filed 2018·Granted Jan 26, 2021·3 cites·19 claims
- 4584US7618516B2Method and apparatus to confine plasma and to enhance flow conductanceAPPLIED MATERIALS INC·Filed 2006·Granted Nov 17, 2009·6 cites·19 claims
- 4683US10685864B2Contour pocket and hybrid susceptor for wafer uniformityAPPLIED MATERIALS INC·Filed 2017·Granted Jun 16, 2020·2 cites·12 claims
- 4783US7972469B2Plasma processing apparatusAPPLIED MATERIALS INC·Filed 2007·Granted Jul 5, 2011·7 cites·23 claims
- 4882US8822876B2Multi-zoned plasma processing electrostatic chuck with improved temperature uniformityTAVASSOLI HAMID·Filed 2011·Granted Sep 2, 2014·5 cites·20 claims
- 4982US8801893B2Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactorBRILLHART PAUL LUKAS·Filed 2010·Granted Aug 12, 2014·5 cites·16 claims
- 5082US8080479B2Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonatorCOLLINS KENNETH S·Filed 2007·Granted Dec 20, 2011·6 cites·20 claims
Showing the top 50 of 122 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →