Inventor · disambiguated record
Kambhampati Ramakrishna
Also filed as: RAMAKRISHNA KAMBHAMPATI
32 granted patents·1 pending application·1,722 citations·filing 1996–2012
98Inventor score
Files withSTATS CHIPPAC LTD13ST ASSEMBLY TEST SERVICES LTD6RAMAKRISHNA KAMBHAMPATI5AMKOR TECHNOLOGY INC3SHIM IL KWON2
Top patents by PatentIndex Score
33 records- 0199US7364945B2Method of mounting an integrated circuit package in an encapsulant cavitySTATS CHIPPAC LTD·Filed 2006·Granted Apr 29, 2008·100 cites·13 claims
- 0299US6861288B2Stacked semiconductor packages and method for the fabrication thereofST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Mar 1, 2005·308 cites·8 claims
- 0398US7429787B2Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sidesSTATS CHIPPAC LTD·Filed 2006·Granted Sep 30, 2008·88 cites·17 claims
- 0498US7372141B2Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sidesSTATS CHIPPAC LTD·Filed 2006·Granted May 13, 2008·109 cites·24 claims
- 0598US6531784B1Semiconductor package with spacer stripsAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·299 cites·37 claims
- 0697US8309397B2Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereofSHIM IL KWON·Filed 2011·Granted Nov 13, 2012·26 cites·10 claims
- 0797US7399658B2Pre-molded leadframe and method thereforSTATS CHIPPAC LTD·Filed 2006·Granted Jul 15, 2008·80 cites·20 claims
- 0897US6472758B1Semiconductor package including stacked semiconductor dies and bond wiresAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 29, 2002·193 cites·27 claims
- 0996US7795078B2Leadframe package for MEMS microphone assemblySTATS CHIPPAC LTD·Filed 2009·Granted Sep 14, 2010·40 cites·19 claims
- 1096US7309913B2Stacked semiconductor packagesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 18, 2007·94 cites·8 claims
- 1196US6650019B2Method of making a semiconductor package including stacked semiconductor diesAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 18, 2003·123 cites·27 claims
- 1295US7550828B2Leadframe package for MEMS microphone assemblySTATS CHIPPAC INC·Filed 2007·Granted Jun 23, 2009·30 cites·19 claims
- 1391US8021924B2Encapsulant cavity integrated circuit package system and method of fabrication thereofSTATS CHIPPAC LTD·Filed 2010·Granted Sep 20, 2011·9 cites·12 claims
- 1491US7855100B2Integrated circuit package system with an encapsulant cavity and method of fabrication thereofSTATS CHIPPAC LTD·Filed 2008·Granted Dec 21, 2010·15 cites·16 claims
- 1589US8395251B2Integrated circuit package to package stacking systemSHIM IL KWON·Filed 2006·Granted Mar 12, 2013·18 cites·14 claims
- 1687US7790504B2Integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Sep 7, 2010·14 cites·20 claims
- 1787US6927479B2Method of manufacturing a semiconductor package for a die larger than a die padST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Aug 9, 2005·37 cites·8 claims
- 1884US6841858B2Leadframe for die stacking applications and related die stacking conceptsST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Jan 11, 2005·36 cites·84 claims
- 1983US7622800B2Stacked semiconductor packages and method thereforSTATS CHIPPAC LTD·Filed 2007·Granted Nov 24, 2009·9 cites·20 claims
- 2079US6627990B1Thermally enhanced stacked die packageST ASSEMBLY TEST SERVICE LTD·Filed 2003·Granted Sep 30, 2003·33 cites·56 claims
- 2175US7242091B2Stacked semiconductor packages and method thereforSTATS CHIPPAC LTD·Filed 2005·Granted Jul 10, 2007·5 cites·20 claims
- 2272US8178982B2Dual molded multi-chip package systemRAMAKRISHNA KAMBHAMPATI·Filed 2006·Granted May 15, 2012·3 cites·20 claims
- 2371US8106496B2Semiconductor packaging system with stacking and method of manufacturing thereofRAMAKRISHNA KAMBHAMPATI·Filed 2007·Granted Jan 31, 2012·5 cites·26 claims
- 2470US8031475B2Integrated circuit package system with flexible substrate and mounded packageSTATS CHIPPAC LTD·Filed 2008·Granted Oct 4, 2011·3 cites·20 claims
- 2568US7595551B2Semiconductor package for a large dieST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Sep 29, 2009·3 cites·10 claims
- 2667US8050047B2Integrated circuit package system with flexible substrate and recessed packageSTATS CHIPPAC LTD·Filed 2008·Granted Nov 1, 2011·3 cites·20 claims
- 2754US7091469B2Packaging for optoelectronic devicesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Aug 15, 2006·6 cites·20 claims
- 2853US7863730B2Array-molded package heat spreader and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jan 4, 2011·5 cites·20 claims
- 2953US5877551ASemiconductor package having a ground or power ring and a metal substrateOLIN CORP·Filed 1996·Granted Mar 2, 1999·23 cites·9 claims
- 3052US8211753B2Leadframe-based mold array package heat spreader and fabrication method thereforRAMAKRISHNA KAMBHAMPATI·Filed 2004·Granted Jul 3, 2012·5 cites·11 claims
- 3151US8558399B2Dual molded multi-chip package systemRAMAKRISHNA KAMBHAMPATI·Filed 2012·Granted Oct 15, 2013·0 cites·10 claims
- 3249US8581375B2Leadframe-based mold array package heat spreader and fabrication method thereforRAMAKRISHNA KAMBHAMPATI·Filed 2012·Granted Nov 12, 2013·0 cites·11 claims
- 3341US2007093000A1Pre-molded leadframe and method thereforSTATS CHIPPAC LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →