Inventor · disambiguated record
Kenneth S. Bahl
Also filed as: BAHL KENNETH · BAHL KENNETH S
24 granted patents·3 pending applications·51 citations·filing 2014–2023
93Inventor score
Top patents by PatentIndex Score
27 records- 0196US9706650B1Catalytic laminate apparatus and methodSIERRA CIRCUITS INC·Filed 2016·Granted Jul 11, 2017·15 cites·25 claims
- 0291US9922951B1Integrated circuit wafer integration with catalytic laminate or adhesiveSIERRA CIRCUITS INC·Filed 2016·Granted Mar 20, 2018·7 cites·20 claims
- 0389US11638354B2Process for fabrication of a printed circuit board using a semi-additive process and removable backing foilCATLAM LLC·Filed 2020·Granted Apr 25, 2023·2 cites·16 claims
- 0489US10849233B2Process for forming traces on a catalytic laminateSIERRA CIRCUITS INC·Filed 2017·Granted Nov 24, 2020·5 cites·22 claims
- 0585US9398703B2Via in a printed circuit boardKARAVAKIS KONSTANTINE·Filed 2014·Granted Jul 19, 2016·6 cites·9 claims
- 0685US9380700B2Method for forming traces of a printed circuit boardKARAVAKIS KONSTANTINE·Filed 2014·Granted Jun 28, 2016·9 cites·19 claims
- 0781US10765012B2Process for printed circuit boards using backing foilSIERRA CIRCUITS INC·Filed 2017·Granted Sep 1, 2020·2 cites·20 claims
- 0879US12513827B2Semi-additive process for catalytic printed circuit boardsCATLAM LLC·Filed 2023·Granted Dec 30, 2025·0 cites·8 claims
- 0976US9942981B2Circuit board apparatus and methodSIERRA CIRCUITS INC·Filed 2017·Granted Apr 10, 2018·1 cites·32 claims
- 1075US11406024B2Multi-layer circuit board with traces thicker than a circuit boardCATLAM LLC·Filed 2021·Granted Aug 2, 2022·0 cites·18 claims
- 1175US9631279B2Methods for forming embedded tracesBAHL KENNETH S·Filed 2014·Granted Apr 25, 2017·2 cites·20 claims
- 1274US11039540B2Multi-layer circuit board with traces thicker than a circuit board layerCATLAM LLC·Filed 2019·Granted Jun 15, 2021·0 cites·18 claims
- 1372US11477893B2Catalytic laminate with conductive traces formed during laminationCATLAM LLC·Filed 2020·Granted Oct 18, 2022·0 cites·18 claims
- 1472US10349520B2Multi-layer circuit board using interposer layer and conductive pasteSIERRA CIRCUITS INC·Filed 2017·Granted Jul 9, 2019·1 cites·18 claims
- 1571US10959329B2Circuit board using non-catalytic laminate with catalytic adhesive overlayCATLAM LLC·Filed 2020·Granted Mar 23, 2021·0 cites·29 claims
- 1670US10827624B2Catalytic laminate with conductive traces formed during laminationSIERRA CIRCUITS INC·Filed 2018·Granted Nov 3, 2020·0 cites·24 claims
- 1767US11653453B2Electroless and electrolytic deposition process for forming traces on a catalytic laminateCATLAM LLC·Filed 2020·Granted May 16, 2023·0 cites·21 claims
- 1866US9674967B2Via in a printed circuit boardSIERRA CIRCUITS INC·Filed 2016·Granted Jun 6, 2017·1 cites·9 claims
- 1964US10806029B2Catalytic circuit board with traces and viasCATLAM LLC·Filed 2019·Granted Oct 13, 2020·0 cites·29 claims
- 2061US10765003B2Method for making a multi-layer circuit board using conductive paste with interposer layerCATLAM LLC·Filed 2019·Granted Sep 1, 2020·0 cites·21 claims
- 2161US10306756B2Circuit board with catalytic adhesiveSIERRA CIRCUITS INC·Filed 2018·Granted May 28, 2019·0 cites·32 claims
- 2251US10685931B2Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesiveCATLAM LLC·Filed 2018·Granted Jun 16, 2020·0 cites·17 claims
- 2351US2023096301A1Circuit Board Traces in Channels using Electroless and Electroplated DepositionsCATLAM LLC·Filed 2021·Application pending·0 cites
- 2440US2020008306A1UV curable Catalytic Adhesive for Circuit Boards with Traces and ViasSIERRA CIRCUITS INC·Filed 2018·Application pending·0 cites
- 2539US9706667B2Via in a printed circuit boardSIERRA CIRCUITS INC·Filed 2016·Granted Jul 11, 2017·0 cites·12 claims
- 2638US2016278206A1Printed circuit boardSIERRA CIRCUITS INC·Filed 2016·Application pending·0 cites
- 2737US10573610B2Method for wafer level packagingCATLAM LLC·Filed 2016·Granted Feb 25, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →