Inventor · disambiguated record
Kevin P. Dockery
Also filed as: DOCKERY KEVIN · DOCKERY KEVIN P
22 granted patents·4 pending applications·85 citations·filing 1998–2025
93Inventor score
Top patents by PatentIndex Score
26 records- 0195US9631122B1Tungsten-processing slurry with cationic surfactantCABOT MICROELECTRONICS CORP·Filed 2015·Granted Apr 25, 2017·19 cites·23 claims
- 0285US10676647B1Composition for tungsten CMPCABOT MICROELECTRONICS CORP·Filed 2018·Granted Jun 9, 2020·2 cites·29 claims
- 0383US10066126B2Tungsten processing slurry with catalystCABOT MICROELECTRONICS CORP·Filed 2016·Granted Sep 4, 2018·5 cites·18 claims
- 0482US10647887B2Tungsten buff polishing compositions with improved topographyCABOT MICROELECTRONICS CORP·Filed 2018·Granted May 12, 2020·2 cites·36 claims
- 0582US8419176B2Aqueous compositions with improved silicon corrosion characteristicsDOCKERY KEVIN P·Filed 2009·Granted Apr 16, 2013·7 cites·14 claims
- 0682US6843560B2Ink jet printing methodEASTMAN KODAK CO·Filed 2002·Granted Jan 18, 2005·20 cites·20 claims
- 0781US8906252B1CMP compositions selective for oxide and nitride with high removal rate and low defectivityCABOT MICROELECTRONICS CORP·Filed 2013·Granted Dec 9, 2014·4 cites·23 claims
- 0880US7368624B2Synthesis for polycyclic aromatic hydrocarbon compoundsEASTMAN KODAK CO·Filed 2004·Granted May 6, 2008·10 cites·32 claims
- 0973US9771496B2Tungsten-processing slurry with cationic surfactant and cyclodextrinCABOT MICROELECTRONICS CORP·Filed 2015·Granted Sep 26, 2017·1 cites·22 claims
- 1072US9422455B2CMP compositions exhibiting reduced dishing in STI wafer polishingCABOT MICROELECTRONICS CORP·Filed 2014·Granted Aug 23, 2016·3 cites·21 claims
- 1172US8485654B2Aqueous inkjet printing fluid compositionsSOWINSKI ALLAN F·Filed 2010·Granted Jul 16, 2013·1 cites·18 claims
- 1271US8459787B2Aqueous inkjet printing fluid compositionsSOWINSKI ALLAN F·Filed 2010·Granted Jun 11, 2013·1 cites·20 claims
- 1370US9165489B2CMP compositions selective for oxide over polysilicon and nitride with high removal rate and low defectivityCABOT MICROELECTRONICS CORP·Filed 2014·Granted Oct 20, 2015·2 cites·21 claims
- 1468US11043151B2Surface treated abrasive particles for tungsten buff applicationsCABOT MICROELECTRONICS CORP·Filed 2017·Granted Jun 22, 2021·1 cites·19 claims
- 1567US2025354033A1Highly modified colloidal silica tungsten cmp compositionENTEGRIS INC·Filed 2025·Application pending·0 cites
- 1666US6132944APhotographic element containing high dye-yield couplersEASTMAN KODAK CO·Filed 1999·Granted Oct 17, 2000·5 cites·30 claims
- 1760US2025304842A1Composition for bimetallic cmpENTEGRIS INC·Filed 2025·Application pending·0 cites
- 1858US12428580B2CMP composition including an anionic abrasiveCMC MAT INC·Filed 2022·Granted Sep 30, 2025·0 cites·28 claims
- 1955US11492514B2Derivatized polyamino acidsCMC MAT INC·Filed 2020·Granted Nov 8, 2022·0 cites·29 claims
- 2054US11725116B2CMP composition including a novel abrasiveCMC MAT INC·Filed 2021·Granted Aug 15, 2023·0 cites·32 claims
- 2145US2006052421A1Conjugation agentEASTMAN KODAK CO·Filed 2004·Application pending·0 cites
- 2243US10640679B2CMP compositions selective for oxide and nitride with improved dishing and pattern selectivityCABOT MICROELECTRONICS CORP·Filed 2017·Granted May 5, 2020·0 cites·23 claims
- 2342US7153896B2Element for protein microarraysEASTMAN KODAK CO·Filed 2003·Granted Dec 26, 2006·1 cites·10 claims
- 2441US12473457B2Composition for tungsten CMPCABOT MICROELECTRONICS CORP·Filed 2018·Granted Nov 18, 2025·0 cites·10 claims
- 2541US2009065478A1Measuring etching rates using low coherence interferometryDOCKERY KEVIN P·Filed 2007·Application pending·0 cites
- 2640US6120981APhotographic element containing sulfon amido compounds that boost dye formation from photographic couplersEASTMAN KODAK CO·Filed 1998·Granted Sep 19, 2000·1 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →