Inventor · disambiguated record
Kevin Kashefi
Also filed as: KASHEFI KEVIN
18 granted patents·33 pending applications·29 citations·filing 2013–2024
89Inventor score
Top patents by PatentIndex Score
51 records- 0195US11848229B2Selective blocking of metal surfaces using bifunctional self-assembled monolayersAPPLIED MATERIALS INC·Filed 2022·Granted Dec 19, 2023·3 cites·18 claims
- 0293US12211743B2Method of forming a metal liner for interconnect structuresAPPLIED MATERIALS INC·Filed 2021·Granted Jan 28, 2025·3 cites·17 claims
- 0391US9246092B1Tunneling barrier creation in MSM stack as a selector device for non-volatile memory applicationINTERMOLECULAR INC·Filed 2014·Granted Jan 26, 2016·8 cites·14 claims
- 0488US9224594B2Surface preparation with remote plasmaINTERMOLECULAR INC·Filed 2013·Granted Dec 29, 2015·9 cites·22 claims
- 0580US11380536B2Multi-step pre-clean for selective metal gap fillAPPLIED MATERIALS INC·Filed 2020·Granted Jul 5, 2022·1 cites·18 claims
- 0679US9196475B2Methods for fabricating integrated circuits including fluorine incorporationGLOBALFOUNDRIES INC·Filed 2014·Granted Nov 24, 2015·4 cites·18 claims
- 0774US2025112090A1Method Of Forming A Metal Liner For Interconnect StructuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0872US12094766B2Selective blocking of metal surfaces using bifunctional self-assembled monolayersAPPLIED MATERIALS INC·Filed 2022·Granted Sep 17, 2024·0 cites·14 claims
- 0966US11776806B2Multi-step pre-clean for selective metal gap fillAPPLIED MATERIALS INC·Filed 2022·Granted Oct 3, 2023·0 cites·17 claims
- 1066US9368721B1Diamond like carbon (DLC) as a thermal sink in a selector stack for non-volatile memory applicationINTERMOLECULAR INC·Filed 2014·Granted Jun 14, 2016·1 cites·18 claims
- 1166US2025277312A1Sacrificial liner for copper interconnectAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1263US12431387B2Self-assembled monolayer for selective depositionAPPLIED MATERIALS INC·Filed 2021·Granted Sep 30, 2025·0 cites·9 claims
- 1360US2025299926A1Biasable gas distribution plateAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1459US2024404803A1Microwave preclean apparatus and processing method for impurity removalAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1559US2025253192A1Barrier and liner treatment using dual radio frequency capacitive couple plasma for metal interconnectsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1658US12394619B2Metal oxide preclean for bottom-up gapfill in MEOL and BEOLAPPLIED MATERIALS INC·Filed 2023·Granted Aug 19, 2025·0 cites·13 claims
- 1758US2025259886A1Methods of manufacturing interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1857US2025062160A1Metal implantation to barrier or liner for interconnectAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1957US2025273454A1Microwave assisted passivation layer removalAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2057US2024258164A1Methods of forming interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2157US2024355675A1Methods of forming interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2257US2024332075A1Gradient metal liner for interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2356US11952655B2Electromagnet pulsing effect on PVD step coverageAPPLIED MATERIALS INC·Filed 2022·Granted Apr 9, 2024·0 cites·5 claims
- 2456US2024420966A1Copper reflow by surface modificationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2556US2024258103A1Plasma treatment of barrier and liner layersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2655US11955382B2Reverse selective etch stop layerAPPLIED MATERIALS INC·Filed 2020·Granted Apr 9, 2024·0 cites·18 claims
- 2755US2024420996A1Selective self-assembled monolayer (sam) removalAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2854US2024194605A1Post-treatment for removing residues from dielectric surfaceAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2954US2024420997A1Selective liner deposition for via resistance reductionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3054US2024258161A1Methods of forming interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3153US11967523B2Self-assembled monolayer for selective depositionAPPLIED MATERIALS INC·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
- 3253US2023253248A1Methods of forming metal liner for interconnect structuresAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3353US2014262749A1Methods of Plasma Surface Treatment in a PVD ChamberINTERMOLECULAR INC·Filed 2013·Application pending·0 cites
- 3452US9337238B1Photo-induced MSM stackINTERMOLECULAR INC·Filed 2014·Granted May 10, 2016·0 cites·20 claims
- 3552US2024339358A1Method of forming a metal liner for interconnect structuresAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3652US2015064361A1UV treatment for ALD film densificationINTERMOLECULAR INC·Filed 2013·Application pending·0 cites
- 3751US2024038541A1Methods for removing molybdenum oxides from substratesAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3850US2023187204A1Tungsten Fluoride Soak And Treatment For Tungsten Oxide RemovalAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3949US9312137B2Reduction of native oxides by annealing in reducing gas or plasmaINTERMOLECULAR INC·Filed 2013·Granted Apr 12, 2016·0 cites·20 claims
- 4049US2022275501A1Surface treatment for selective depositionAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 4148US9236261B2Deposition of titanium-aluminum layersGLOBALFOUNDRIES INC·Filed 2014·Granted Jan 12, 2016·0 cites·24 claims
- 4242US2015380309A1Metal-insulator-semiconductor (MIS) contact with controlled defect densityINTERMOLECULAR INC·Filed 2014·Application pending·0 cites
- 4341US2015093887A1Methods for removing a native oxide layer from germanium susbtrates in the fabrication of integrated circuitsiGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
- 4441US2016149129A1Using Metal Silicides as Electrodes for MSM Stack in Selector for Non-Volatile Memory ApplicationINTERMOLECULAR INC·Filed 2014·Application pending·0 cites
- 4541US2016148976A1Simultaneous Carbon and Nitrogen Doping of Si in MSM Stack as a Selector Device for Non-Volatile Memory ApplicationINTERMOLECULAR INC·Filed 2014·Application pending·0 cites
- 4640US2016141335A1Diamond Like Carbon (DLC) in a Semiconductor Stack as a Selector for Non-Volatile Memory ApplicationINTERMOLECULAR INC·Filed 2014·Application pending·0 cites
- 4740US2015140838A1Two Step Deposition of High-k Gate Dielectric MaterialsINTERMOLECULAR INC·Filed 2013·Application pending·0 cites
- 4839US2015093914A1Methods for depositing an aluminum oxide layer over germanium susbtrates in the fabrication of integrated circuitsIntermolecular·Filed 2013·Application pending·0 cites
- 4938US2015093889A1Methods for removing a native oxide layer from germanium susbtrates in the fabrication of integrated circuitsIntermolecular·Filed 2013·Application pending·0 cites
- 5035USD1103950SProcess chamber collimatorAPPLIED MATERIALS INC·Filed 2024·Granted Dec 2, 2025·0 cites·1 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →