Inventor · disambiguated record
Kooi Chi Ooi
Also filed as: OOI KOOI CHI
59 granted patents·23 pending applications·695 citations·filing 2005–2022
98Inventor score
Top patents by PatentIndex Score
82 records- 0198US7279795B2Stacked die semiconductor packageINTEL CORP·Filed 2005·Granted Oct 9, 2007·353 cites·15 claims
- 0297US10978434B2Systems in packages including wide-band phased-array antennas and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 13, 2021·5 cites·20 claims
- 0397US8198716B2Die backside wire bond technology for single or stacked die packagePERIAMAN SHANGGAR·Filed 2007·Granted Jun 12, 2012·92 cites·19 claims
- 0496US11282780B2Integrated bridge for die-to-die interconnectsINTEL CORP·Filed 2020·Granted Mar 22, 2022·3 cites·12 claims
- 0596US8987896B2High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming sameCHEAH BOK ENG·Filed 2010·Granted Mar 24, 2015·31 cites·3 claims
- 0696US7692278B2Stacked-die packages with silicon vias and surface activated bondingINTEL CORP·Filed 2006·Granted Apr 6, 2010·46 cites·9 claims
- 0794US10580761B2Systems in packages including wide-band phased-array antennas and methods of assembling sameINTEL CORP·Filed 2018·Granted Mar 3, 2020·9 cites·21 claims
- 0894US9136251B2Method to enable controlled side chip interconnection for 3D integrated packaging systemCHEAH BOK ENG·Filed 2012·Granted Sep 15, 2015·16 cites·30 claims
- 0993US10651127B2Ring-in-ring configurable-capacitance stiffeners and methods of assembling sameINTEL CORP·Filed 2017·Granted May 12, 2020·10 cites·7 claims
- 1092US10014710B2Foldable fabric-based packaging solutionINTEL CORP·Filed 2015·Granted Jul 3, 2018·5 cites·17 claims
- 1191US8044497B2Stacked die packageINTEL CORP·Filed 2007·Granted Oct 25, 2011·18 cites·20 claims
- 1290US9812425B2Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for sameINTEL CORP·Filed 2016·Granted Nov 7, 2017·5 cites·18 claims
- 1389US11527463B2Hybrid ball grid array package for high speed interconnectsINTEL CORP·Filed 2020·Granted Dec 13, 2022·2 cites·18 claims
- 1489US10394280B2Wearable electronic devices and components thereofINTEL CORP·Filed 2018·Granted Aug 27, 2019·6 cites·6 claims
- 1589US9478524B2Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for sameINTEL CORP·Filed 2015·Granted Oct 25, 2016·5 cites·7 claims
- 1689US8697495B2Stacked die packageCHEAH BOK ENG·Filed 2011·Granted Apr 15, 2014·9 cites·12 claims
- 1788US8281229B2Firmware verification using system memory error check logicCHEW YEN HSIANG·Filed 2008·Granted Oct 2, 2012·19 cites·20 claims
- 1887US9904321B2Wearable electronic devices and components thereofINTEL CORP·Filed 2014·Granted Feb 27, 2018·6 cites·10 claims
- 1985US10964677B2Electronic packages with stacked sitffeners and methods of assembling sameINTEL CORP·Filed 2017·Granted Mar 30, 2021·4 cites·16 claims
- 2081US11710029B2Methods and apparatus to improve data training of a machine learning model using a field programmable gate arrayINTEL CORP·Filed 2018·Granted Jul 25, 2023·4 cites·23 claims
- 2181US7400033B1Package on package design to improve functionality and efficiencyINTEL CORP·Filed 2006·Granted Jul 15, 2008·10 cites·15 claims
- 2280US9778688B2Flexible system-in-package solutions for wearable devicesINTEL CORP·Filed 2014·Granted Oct 3, 2017·5 cites·24 claims
- 2380US8110930B2Die backside metallization and surface activated bonding for stacked die packagesPERIAMAN SHANGGAR·Filed 2007·Granted Feb 7, 2012·10 cites·19 claims
- 2479US11030012B2Methods and apparatus for allocating a workload to an accelerator using machine learningINTEL CORP·Filed 2018·Granted Jun 8, 2021·2 cites·17 claims
- 2578US11164827B2Substrate with gradiated dielectric for reducing impedance mismatchINTEL CORP·Filed 2017·Granted Nov 2, 2021·2 cites·17 claims
- 2678US10950552B2Ring-in-ring configurable-capacitance stiffeners and methods of assembling sameINTEL CORP·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
- 2776US7773504B2Bandwidth allocation for network packet trafficINTEL CORP·Filed 2007·Granted Aug 10, 2010·6 cites·18 claims
- 2873US11195801B2Embedded reference layers for semiconductor package substratesINTEL CORP·Filed 2019·Granted Dec 7, 2021·1 cites·19 claims
- 2971US12002747B2Integrated bridge for die-to-die interconnectsINTEL CORP·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 3070US11676910B2Embedded reference layers for semiconductor package substratesINTEL CORP·Filed 2021·Granted Jun 13, 2023·0 cites·16 claims
- 3170US11584368B2Evaluating risk factors of proposed vehicle maneuvers using external and internal dataINTEL CORP·Filed 2018·Granted Feb 21, 2023·2 cites·20 claims
- 3270US10396038B2Flexible packaging architectureINTEL CORP·Filed 2014·Granted Aug 27, 2019·3 cites·11 claims
- 3368US11837458B2Substrate with gradiated dielectric for reducing impedance mismatchINTEL CORP·Filed 2021·Granted Dec 5, 2023·0 cites·18 claims
- 3468US9721878B2High density second level interconnection for bumpless build up layer (BBUL) packaging technologyCHEAH BOK ENG·Filed 2012·Granted Aug 1, 2017·2 cites·12 claims
- 3565US11586473B2Methods and apparatus for allocating a workload to an accelerator using machine learningINTEL CORP·Filed 2021·Granted Feb 21, 2023·0 cites·26 claims
- 3663US10403604B2Stacked package assembly with voltage reference planeINTEL CORP·Filed 2015·Granted Sep 3, 2019·1 cites·18 claims
- 3763US9646953B2Integrated circuit packaging techniques and configurations for small form-factor or wearable devicesINTEL CORP·Filed 2014·Granted May 9, 2017·1 cites·22 claims
- 3862US11887917B2Encapsulated vertical interconnects for high-speed applications and methods of assembling sameINTEL CORP·Filed 2021·Granted Jan 30, 2024·0 cites·14 claims
- 3957US12288740B2Semiconductor package with hybrid mold layersINTEL CORP·Filed 2021·Granted Apr 29, 2025·0 cites·20 claims
- 4057US11430764B2Overhang bridge interconnectINTEL CORP·Filed 2020·Granted Aug 30, 2022·0 cites·17 claims
- 4157US11342289B2Vertical power plane module for semiconductor packagesINTEL CORP·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 4256US2024222346A1Architectures for memory on integrated circuit device packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 4355US2024071856A1Electronic assembly having a cooling feature and methods of forming thereofINTEL CORP·Filed 2022·Application pending·0 cites
- 4455US2024145420A1Liquid metal shield for fine pitch interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 4555US2024234283A9Electronic package with integrated interconnect structureINTEL CORP·Filed 2022·Application pending·0 cites
- 4655US2024145365A1Electronic interconnect and method of forming the sameINTEL CORP·Filed 2022·Application pending·0 cites
- 4754US11508650B2Interposer for hybrid interconnect geometryINTEL CORP·Filed 2020·Granted Nov 22, 2022·0 cites·12 claims
- 4854US11049801B2Encapsulated vertical interconnects for high-speed applications and methods of assembling sameINTEL CORP·Filed 2019·Granted Jun 29, 2021·0 cites·21 claims
- 4954US2024006786A1Composite printed circuit boards and devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 5054US2023120513A1Foldable compression attached memory module (fcamm)INTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 82 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →