Inventor · disambiguated record
Konstantin Volodarsky
Also filed as: VOLODARSKY KONSTANTIN
23 granted patents·2 pending applications·869 citations·filing 1996–2004
97Inventor score
Top patents by PatentIndex Score
25 records- 0195US6478936B1Anode assembly for plating and planarizing a conductive layerNUTOOL INC·Filed 2000·Granted Nov 12, 2002·46 cites·53 claims
- 0295US5803799AWafer polishing headONTRAK SYSTEMS INC·Filed 1997·Granted Sep 8, 1998·154 cites·13 claims
- 0394US6352623B1Vertically configured chamber used for multiple processesNUTOOL INC·Filed 1999·Granted Mar 5, 2002·131 cites·66 claims
- 0493US5800248AControl of chemical-mechanical polishing rate across a substrate surfaceONTRAK SYSTEMS INC·Filed 1996·Granted Sep 1, 1998·133 cites·23 claims
- 0591US6612915B1Work piece carrier head for plating and polishingNUTOOL INC·Filed 1999·Granted Sep 2, 2003·74 cites·20 claims
- 0685US6939206B2Method and apparatus of sealing wafer backside for full-face electrochemical platingASM NUTOOL INC·Filed 2002·Granted Sep 6, 2005·33 cites·48 claims
- 0785US6468139B1Polishing apparatus and method with a refreshing polishing belt and loadable housingNUTOOL INC·Filed 2000·Granted Oct 22, 2002·26 cites·63 claims
- 0883US6464571B2Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided thereinNUTOOL INC·Filed 2001·Granted Oct 15, 2002·19 cites·51 claims
- 0983US5913714AMethod for dressing a polishing pad during polishing of a semiconductor waferONTRAK SYSTEMS INC·Filed 1998·Granted Jun 22, 1999·47 cites·1 claims
- 1083US5857899AWafer polishing head with pad dressing elementONTRAK SYSTEMS INC·Filed 1997·Granted Jan 12, 1999·49 cites·13 claims
- 1178US6988932B2Apparatus of sealing wafer backside for full-face processingASM NUTOOL INC·Filed 2004·Granted Jan 24, 2006·18 cites·27 claims
- 1278US6716084B2Carrier head for holding a wafer and allowing processing on a front face thereof to occurNUTOOL INC·Filed 2002·Granted Apr 6, 2004·20 cites·8 claims
- 1377US6454332B1Apparatus and methods for handling a substrateAPPLIED MATERIALS INC·Filed 1998·Granted Sep 24, 2002·51 cites·27 claims
- 1475US6855037B2Method of sealing wafer backside for full-face electrochemical platingASM NUTOOL INC·Filed 2001·Granted Feb 15, 2005·15 cites·38 claims
- 1571US7316602B2Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishingNOVELLUS SYSTEMS INC·Filed 2003·Granted Jan 8, 2008·6 cites·25 claims
- 1671US6773576B2Anode assembly for plating and planarizing a conductive layerNUTOOL INC·Filed 2002·Granted Aug 10, 2004·5 cites·19 claims
- 1766US6604988B2Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided thereinNUTOOL INC·Filed 2002·Granted Aug 12, 2003·8 cites·27 claims
- 1855US6533646B2Polishing head with removable subcarrierLAM RES CORP·Filed 2000·Granted Mar 18, 2003·5 cites·15 claims
- 1953US6932679B2Apparatus and method for loading a wafer in polishing systemASM NUTOOL INC·Filed 2002·Granted Aug 23, 2005·3 cites·24 claims
- 2053US6884334B2Vertically configured chamber used for multiple processesASM NUTOOL INC·Filed 2001·Granted Apr 26, 2005·3 cites·20 claims
- 2152US6969456B2Method of using vertically configured chamber used for multiple processesASM NUTOOL INC·Filed 2001·Granted Nov 29, 2005·2 cites·28 claims
- 2249US6425812B1Polishing head for chemical mechanical polishing using linear planarization technologyLAM RES CORP·Filed 1999·Granted Jul 30, 2002·13 cites·31 claims
- 2342US6244946B1Polishing head with removable subcarrierLAM RES CORP·Filed 1997·Granted Jun 12, 2001·8 cites·19 claims
- 2439US2005040049A1Anode assembly for plating and planarizing a conductive layerFiled 2004·Application pending·0 cites
- 2538US2002056646A1Vertically configured chamber used for multiple processesFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →