Inventor · disambiguated record
Kun-Ju Li
Also filed as: LI KUN · LI KUN-JU
37 granted patents·16 pending applications·57 citations·filing 2014–2024
96Inventor score
Top patents by PatentIndex Score
53 records- 0193US11211471B1Method of manufacturing a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 28, 2021·6 cites·7 claims
- 0291US10535817B1Method of manufacturing embedded magnetoresistive random access memoryUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 14, 2020·8 cites·16 claims
- 0389US9773682B1Method of planarizing substrate surfaceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 26, 2017·5 cites·7 claims
- 0486US11257711B1Fabricating method of transistors without dishing occurred during CMP processUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 22, 2022·2 cites·15 claims
- 0586US9887158B1Conductive structure having an entrenched high resistive layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 6, 2018·5 cites·11 claims
- 0685US10916694B2Magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 9, 2021·2 cites·5 claims
- 0784US9905430B1Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 27, 2018·4 cites·16 claims
- 0883US12471498B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Nov 11, 2025·0 cites·5 claims
- 0983US2025008743A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1082US10722998B2Wafer polishing pad and using method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 28, 2020·1 cites·4 claims
- 1181US9875909B1Method for planarizing material layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 23, 2018·3 cites·18 claims
- 1280US12127413B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 22, 2024·0 cites·9 claims
- 1379US9966263B1Method of fabricating fin structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 8, 2018·3 cites·16 claims
- 1479US9384996B2Method for manufacturing semiconductor device and device manufactured by the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 5, 2016·4 cites·21 claims
- 1577US11778922B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 3, 2023·0 cites·13 claims
- 1677US10804461B1Manufacturing method of memory deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 13, 2020·3 cites·12 claims
- 1777US10446745B1Method of manufacturing magnetoresistive random access memory cellUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 15, 2019·4 cites·12 claims
- 1876US9735015B1Fabricating method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 15, 2017·2 cites·19 claims
- 1975US11737370B2Magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 22, 2023·0 cites·5 claims
- 2075US11706993B2Method of manufacturing magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 18, 2023·0 cites·6 claims
- 2174US9502303B2Method for manufacturing semiconductor device with a barrier layer having overhung portionsUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·2 cites·19 claims
- 2270US11004897B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 11, 2021·0 cites·7 claims
- 2366US11621296B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 4, 2023·0 cites·9 claims
- 2466US9673053B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 6, 2017·1 cites·3 claims
- 2566US9443726B1Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 13, 2016·1 cites·20 claims
- 2666US2024170299A1Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2764US12494456B2Semiconductor assembly and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 9, 2025·0 cites·9 claims
- 2862US9466484B1Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 11, 2016·1 cites·20 claims
- 2961US2025183037A1Methods for enabling chemical mechanical polishing and bonding of aluminum-containing materialsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3058US11923205B2Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 5, 2024·0 cites·7 claims
- 3158US10103034B2Method of planarizing substrate surfaceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·6 claims
- 3258US10049887B2Method of planarizing substrate surfaceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 14, 2018·0 cites·7 claims
- 3358US2025105166A1Semiconductor structure and alignment method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3457US2025166997A1Edge structure of semiconductor wafer and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3556US2025079357A1Methods and structures for high strength asymmetric dielectric in hybrid bondingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3656US2025079312A1Methods and structures for high strength dielectric in hybrid bondingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3755US10290723B2Semiconductor device with metal gateUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 14, 2019·0 cites·7 claims
- 3853US10192826B2Conductive layout structure including high resistive layerUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 29, 2019·0 cites·8 claims
- 3953US2025169368A1Method for forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 4052US10008581B2Semiconductor device having metal gate with nitrogen rich portion and titanium rich portionUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 26, 2018·0 cites·7 claims
- 4150US11482666B2Method for fabricating a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 4248US9299600B2Method for repairing an oxide layer and method for manufacturing a semiconductor structure applying the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Mar 29, 2016·0 cites·16 claims
- 4348US2024071988A1Method for manufacturing semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 4447US2016351674A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 4546US9466535B2Method of forming target patternsUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 11, 2016·0 cites·19 claims
- 4645US11145602B2Alignment mark structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 12, 2021·0 cites·13 claims
- 4744US2016013100A1Via structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4843US2015214114A1Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 4940US9972498B2Method of fabricating a gate cap layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 15, 2018·0 cites·13 claims
- 5036US2020185597A1Memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →