Inventor · disambiguated record
Kurt Peter Wachtler
Also filed as: WACHTLER KURT · WACHTLER KURT P · WACHTLER KURT PETER
38 granted patents·10 pending applications·951 citations·filing 1992–2021
98Inventor score
Top patents by PatentIndex Score
48 records- 0198US7390700B2Packaged system of semiconductor chips having a semiconductor interposerTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 24, 2008·69 cites·6 claims
- 0298US6473274B1Symmetrical microactuator structure for use in mass data storage devices, or the likeTEXAS INSTRUMENTS INC·Filed 2000·Granted Oct 29, 2002·212 cites·24 claims
- 0397US6707124B2HID land grid array packaged device having electrical and optical interconnectsTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 16, 2004·199 cites·25 claims
- 0496US6686225B2Method of separating semiconductor dies from a waferTEXAS INSTRUMENTS INC·Filed 2001·Granted Feb 3, 2004·107 cites·16 claims
- 0595US9896330B2Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 20, 2018·12 cites·20 claims
- 0695US8957525B23D semiconductor interposer for heterogeneous integration of standard memory and split-architecture processorTEXAS INSTRUMENTS INC·Filed 2012·Granted Feb 17, 2015·27 cites·13 claims
- 0793US12176298B2Floating die packageTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 24, 2024·2 cites·27 claims
- 0893US6274391B1HDI land grid array packaged device having electrical and optical interconnectsTEXAS INSTRUMENTS INC·Filed 1992·Granted Aug 14, 2001·143 cites·34 claims
- 0991US8133761B2Packaged system of semiconductor chips having a semiconductor interposerGERBER MARK A·Filed 2009·Granted Mar 13, 2012·19 cites·2 claims
- 1090US7573139B2Packed system of semiconductor chips having a semiconductor interposerTEXAS INSTRUMENTS INC·Filed 2008·Granted Aug 11, 2009·16 cites·4 claims
- 1189US10574184B2Stacked-die bulk acoustic wave oscillator packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 25, 2020·4 cites·24 claims
- 1288US10861796B2Floating die packageTEXAS INSTRUMENTS INC·Filed 2016·Granted Dec 8, 2020·4 cites·8 claims
- 1388US10233074B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 19, 2019·4 cites·17 claims
- 1488US7569918B2Semiconductor package-on-package system including integrated passive componentsTEXAS INSTRUMENTS INC·Filed 2006·Granted Aug 4, 2009·14 cites·16 claims
- 1587US7928550B2Flexible interposer for stacking semiconductor chips and connecting same to substrateTEXAS INSTRUMENTS INC·Filed 2007·Granted Apr 19, 2011·12 cites·12 claims
- 1682US11498831B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 15, 2022·1 cites·7 claims
- 1782US10723616B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 28, 2020·2 cites·19 claims
- 1879US10544039B2Methods for depositing a measured amount of a species in a sealed cavityTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 28, 2020·2 cites·20 claims
- 1979US7872841B2In package ESD protections of IC using a thin film polymerTEXAS INSTRUMENTS INC·Filed 2008·Granted Jan 18, 2011·8 cites·20 claims
- 2072US11387782B2Stacked-die bulk acoustic wave oscillator packageTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 12, 2022·0 cites·24 claims
- 2171US6504685B1Microelectricalmechanical device immobilization and sealingTEXAS INSTRUMENTS INC·Filed 2000·Granted Jan 7, 2003·8 cites·16 claims
- 2270US11538717B2Electronic package for integrated circuits and related methodsTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 27, 2022·0 cites·14 claims
- 2369US10892712B2Stacked-die bulk acoustic wave oscillator packageTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 12, 2021·0 cites·24 claims
- 2469US8288849B2Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprintWACHTLER KURT·Filed 2010·Granted Oct 16, 2012·3 cites·12 claims
- 2569US6374481B1Method for making microactuator for use in mass data storage devicesTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 23, 2002·7 cites·10 claims
- 2668US8030137B2Flexible interposer for stacking semiconductor chips and connecting same to substrateTEXAS INSTRUMENTS INC·Filed 2011·Granted Oct 4, 2011·1 cites·17 claims
- 2768US6655002B1Microactuator for use in mass data storage devices, or the like, and method for making sameTEXAS INSTRUMENTS INC·Filed 2000·Granted Dec 2, 2003·15 cites·17 claims
- 2867US8823168B2Die underfill structure and methodWACHTLER KURT PETER·Filed 2012·Granted Sep 2, 2014·3 cites·9 claims
- 2967US6541352B2Semiconductor die with contoured bottom surface and method for making sameTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 1, 2003·22 cites·12 claims
- 3059US8430969B2Method for exposing and cleaning insulating coats from metal contact surfacesGERBER MARK A·Filed 2010·Granted Apr 30, 2013·1 cites·9 claims
- 3158US8309388B2MEMS package having formed metal lidWACHTLER KURT P·Filed 2008·Granted Nov 13, 2012·2 cites·9 claims
- 3257US5628662AMethod of fabricating a color field emission flat panel display tetrodeTEXAS INSTRUMENTS INC·Filed 1995·Granted May 13, 1997·15 cites·34 claims
- 3356US2021005537A1Sintered Metal Flip Chip JointsTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 3455US2008315387A1Semiconductor Package-on-Package System Including Integrated Passive ComponentsTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 3554US10861741B2Electronic package for integrated circuits and related methodsTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 8, 2020·0 cites·17 claims
- 3653US6071801AMethod and apparatus for the attachment of particles to a substrateTEXAS INSTRUMENTS INC·Filed 1999·Granted Jun 6, 2000·17 cites·9 claims
- 3750US2011075306A1Local integration of non-linear sheet i integrated circuit packages for esd/eos protectionTEXAS INSTRUMENTS INC·Filed 2010·Application pending·0 cites
- 3847US2010084755A1Semiconductor Chip Package System Vertical InterconnectGERBER MARK ALLEN·Filed 2008·Application pending·0 cites
- 3946US11538767B2Integrated circuit package with partitioning based on environmental sensitivityTEXAS INSTRUMENTS INC·Filed 2018·Granted Dec 27, 2022·0 cites·11 claims
- 4046US9312253B2Heterogeneous integration of memory and split-architecture processorTEXAS INSTRUMENTS INC·Filed 2015·Granted Apr 12, 2016·0 cites·13 claims
- 4146US8597978B2Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprintWACHTLER KURT·Filed 2012·Granted Dec 3, 2013·0 cites·5 claims
- 4245US2008258286A1High Input/Output, Low Profile Package-On-Package Semiconductor SystemTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 4343US2017309549A1Sintered Metal Flip Chip JointsTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
- 4443US2008258285A1Simplified Substrates for Semiconductor Devices in Package-on-Package ProductsTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 4541US2007170571A1Low profile semiconductor system having a partial-cavity substrateGERBER MARK A·Filed 2006·Application pending·0 cites
- 4641US2004129451A1Method of separating semiconductor dies from a waferFiled 2003·Application pending·0 cites
- 4739US8338229B1Stackable plasma cleaned via package and methodBANCOD LUDOVICO E·Filed 2010·Granted Dec 25, 2012·0 cites·15 claims
- 4831US2002093766A1"shrink wrap" conformal coating of a chip-on-suspension in a hard disk drive systemFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →