Inventor · disambiguated record
Ku-Feng Yang
Also filed as: YANG KU-FENG
91 granted patents·55 pending applications·1,622 citations·filing 2006–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD106TAIWAN SEMICONDUCTOR MFG20YANG KU-FENG8WU WENG-JIN4LIN JING-CHENG2
Top patents by PatentIndex Score
146 records- 0198US9425126B2Dummy structure for chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·883 cites·20 claims
- 0298US8803316B2TSV structures and methods for forming the sameLIN YUNG-CHI·Filed 2011·Granted Aug 12, 2014·381 cites·20 claims
- 0396US8338939B2TSV formation processes using TSV-last approachLIN JING-CHENG·Filed 2010·Granted Dec 25, 2012·22 cites·20 claims
- 0495US9847255B2TSV formation processes using TSV-last approachTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 19, 2017·9 cites·20 claims
- 0594US8119500B2Wafer bondingYANG KU-FENG·Filed 2007·Granted Feb 21, 2012·29 cites·18 claims
- 0694US8053277B2Three-dimensional integrated circuits with protection layersTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 8, 2011·27 cites·19 claims
- 0793US11101240B2Isolation bonding film for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·7 cites·20 claims
- 0893US8956966B2TSV structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 17, 2015·11 cites·20 claims
- 0991US12132079B2Bonding and isolation techniques for stacked transistor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·1 cites·20 claims
- 1091US8691664B2Backside process for a substrateYANG KU-FENG·Filed 2010·Granted Apr 8, 2014·14 cites·20 claims
- 1191US7955895B2Structure and method for stacked wafer fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jun 7, 2011·21 cites·10 claims
- 1290US8580682B2Cost-effective TSV formationYANG KU-FENG·Filed 2010·Granted Nov 12, 2013·11 cites·18 claims
- 1389US8673775B2Methods of forming semiconductor structuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 18, 2014·8 cites·17 claims
- 1489US8629042B2Method for stacking semiconductor diesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 14, 2014·7 cites·20 claims
- 1589US7812459B2Three-dimensional integrated circuits with protection layersTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Oct 12, 2010·21 cites·12 claims
- 1688US12366004B2Apparatus and method for wafer pre-wettingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 1788US9633929B2TSV formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 25, 2017·5 cites·19 claims
- 1888US9583465B1Three dimensional integrated circuit structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·6 cites·18 claims
- 1988US9449898B2Semiconductor device having backside interconnect structure through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·6 cites·20 claims
- 2087US12131954B1Selective epitaxy process for the formation of CFET local interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·1 cites·20 claims
- 2187US9786580B2Self-alignment for redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 10, 2017·8 cites·17 claims
- 2287US9293418B2Backside through vias in a bonded structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 22, 2016·7 cites·20 claims
- 2387US9252110B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 2, 2016·6 cites·20 claims
- 2486US10340205B2Through substrate vias with improved connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 2, 2019·3 cites·20 claims
- 2586US10163709B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·4 cites·20 claims
- 2686US8803322B2Through substrate via structures and methods of forming the sameYANG KU-FENG·Filed 2011·Granted Aug 12, 2014·7 cites·20 claims
- 2786US7989318B2Method for stacking semiconductor diesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Aug 2, 2011·10 cites·20 claims
- 2885US10510641B2Semiconductor device having backside interconnect structure on through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·3 cites·18 claims
- 2985US2025266325A1Semiconductor Device Having Backside Interconnect Structure on Through Substrate ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3084US12322680B2Semiconductor device having backside interconnect structure on through substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 3184US11296011B2Through-substrate vias with improved connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 5, 2022·2 cites·20 claims
- 3284US9601410B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 21, 2017·4 cites·20 claims
- 3384US8405225B2Three-dimensional integrated circuits with protection layersYU CHEN-HUA·Filed 2012·Granted Mar 26, 2013·9 cites·20 claims
- 3483US9263382B2Through substrate via structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·5 cites·20 claims
- 3583US9006101B2Interconnect structure and methodCHEN HSIN-YU·Filed 2012·Granted Apr 14, 2015·6 cites·19 claims
- 3683US2025305176A1Apparatus and method for wafer pre-wettingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3782US12362315B2Heterogeneous dielectric bonding schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 3882US9293366B2Through-substrate vias with improved connectionsLIN JING-CHENG·Filed 2010·Granted Mar 22, 2016·4 cites·18 claims
- 3982US8500182B2Vacuum wafer carriers for strengthening thin wafersYANG KU-FENG·Filed 2010·Granted Aug 6, 2013·5 cites·15 claims
- 4081US10510604B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 4181US9754831B2Dummy structure for chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·3 cites·20 claims
- 4281US8252682B2Method for thinning a waferYANG KU-FENG·Filed 2010·Granted Aug 28, 2012·8 cites·27 claims
- 4381US2025357394A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4480US12132016B2Bonding structures of integrated circuit devices and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 4580US12087732B2Isolation bonding film for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 4680US9704783B2Through substrate vias with improved connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 11, 2017·2 cites·20 claims
- 4780US7951647B2Performing die-to-wafer stacking by filling gaps between diesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted May 31, 2011·9 cites·20 claims
- 4880US2024387449A1Heterogeneous dielectric bonding schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4980US2025359280A1Bottom-up metal gate for stacked device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5079US11585005B2Apparatus and method for wafer pre-wettingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
Showing the top 50 of 146 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →