Inventor · disambiguated record
Kyung-Moon Kim
Also filed as: KIM KYUNG-MOON
18 granted patents·4 pending applications·160 citations·filing 2001–2020
94Inventor score
Top patents by PatentIndex Score
22 records- 0191US6940178B2Self-coplanarity bumping shape for flip chipCHIPPAC INC·Filed 2002·Granted Sep 6, 2005·51 cites·13 claims
- 0289US9748157B1Integrated circuit packaging system with joint assembly and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2013·Granted Aug 29, 2017·10 cites·20 claims
- 0387US10678527B2Apparatus and method for managing applicationSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 9, 2020·5 cites·20 claims
- 0485US7736950B2Flip chip interconnectionSTATS CHIPPAC LTD·Filed 2006·Granted Jun 15, 2010·15 cites·33 claims
- 0584US6737295B2Chip scale package with flip chip interconnectCHIPPAC INC·Filed 2002·Granted May 18, 2004·34 cites·14 claims
- 0683US9299650B1Integrated circuit packaging system with single metal layer interposer and method of manufacture thereofCHI HEEJO·Filed 2013·Granted Mar 29, 2016·6 cites·20 claims
- 0780US9865554B2Integrated circuit packaging system with under bump metallization and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2015·Granted Jan 9, 2018·3 cites·12 claims
- 0879US8604624B2Flip chip interconnection system having solder position control mechanismKIM OH HAN·Filed 2008·Granted Dec 10, 2013·9 cites·5 claims
- 0979US7407877B2Self-coplanarity bumping shape for flip-chipCHIPPAC INC·Filed 2005·Granted Aug 5, 2008·7 cites·20 claims
- 1078US9412624B1Integrated circuit packaging system with substrate and method of manufacture thereofCUONG DAO NGUYEN PHU·Filed 2014·Granted Aug 9, 2016·6 cites·20 claims
- 1178US8951834B1Methods of forming solder balls in semiconductor packagesKIM KYUNG MOON·Filed 2013·Granted Feb 10, 2015·6 cites·19 claims
- 1269US9202793B1Integrated circuit packaging system with under bump metallization and method of manufacture thereofSHIM IL KWON·Filed 2013·Granted Dec 1, 2015·2 cites·10 claims
- 1365US8119450B2Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spotsAHMAD NAZIR·Filed 2009·Granted Feb 21, 2012·2 cites·18 claims
- 1465US7211901B2Self-coplanarity bumping shape for flip chipCHIPPAC INC·Filed 2005·Granted May 1, 2007·2 cites·9 claims
- 1561US8124520B2Integrated circuit mount system with solder mask padKIM KYUNGOE·Filed 2006·Granted Feb 28, 2012·2 cites·20 claims
- 1660US11256496B2Apparatus and method for managing applicationSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·18 claims
- 1751US2006255474A1Packaging structure and methodCHIPPAC INC·Filed 2006·Application pending·0 cites
- 1850US9312150B2Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip packageAHMAD NAZIR·Filed 2011·Granted Apr 12, 2016·0 cites·15 claims
- 1949US10109587B1Integrated circuit packaging system with substrate and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Oct 23, 2018·0 cites·20 claims
- 2049US2012217635A9Packaging Structure and MethodAHMAD NAZIR·Filed 2011·Application pending·0 cites
- 2141US2004222440A1Chip scale package with flip chip interconnectCHIPPAC INC·Filed 2004·Application pending·0 cites
- 2239US2002014702A1Packaging structure and methodFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →