Inventor · disambiguated record
Lily Pang
Also filed as: PANG LILY · PANG LILY L
19 granted patents·3 pending applications·1,110 citations·filing 1998–2012
96Inventor score
Top patents by PatentIndex Score
22 records- 0197US6450117B1Directing a flow of gas in a substrate processing chamberAPPLIED MATERIALS INC·Filed 2000·Granted Sep 17, 2002·572 cites·61 claims
- 0293US6143078AGas distribution system for a CVD processing chamberAPPLIED MATERIALS INC·Filed 1998·Granted Nov 7, 2000·147 cites·29 claims
- 0391US6486081B1Gas distribution system for a CVD processing chamberAPPLIED MATERIALS INC·Filed 1999·Granted Nov 26, 2002·124 cites·51 claims
- 0488US6517634B2Chemical vapor deposition chamber lid assemblyAPPLIED MATERIALS INC·Filed 2001·Granted Feb 11, 2003·36 cites·33 claims
- 0588US6364958B1Plasma assisted semiconductor substrate processing chamber having a plurality of ground path bridgesAPPLIED MATERIALS INC·Filed 2000·Granted Apr 2, 2002·43 cites·18 claims
- 0687US7223323B2Multi-chemistry plating systemAPPLIED MATERIALS INC·Filed 2003·Granted May 29, 2007·44 cites·1 claims
- 0786US8183132B2Methods for fabricating group III nitride structures with a cluster toolNIJHAWAN SANDEEP·Filed 2010·Granted May 22, 2012·12 cites·23 claims
- 0886US7497026B2Method and system for detection of wafer centering in a track lithography toolSOKUDO CO LTD·Filed 2007·Granted Mar 3, 2009·14 cites·18 claims
- 0984US8491720B2HVPE precursor source hardwareISHIKAWA TETSUYA·Filed 2009·Granted Jul 23, 2013·4 cites·20 claims
- 1084US6572708B2Semiconductor wafer support lift-pin assemblyAPPLIED MATERIALS INC·Filed 2001·Granted Jun 3, 2003·27 cites·27 claims
- 1183US8568529B2HVPE chamber hardwareISHIKAWA TETSUYA·Filed 2009·Granted Oct 29, 2013·4 cites·11 claims
- 1282US7285195B2Electric field reducing thrust plateAPPLIED MATERIALS INC·Filed 2004·Granted Oct 23, 2007·25 cites·20 claims
- 1379US6958098B2Semiconductor wafer support lift-pin assemblyAPPLIED MATERIALS INC·Filed 2003·Granted Oct 25, 2005·18 cites·20 claims
- 1475US6363624B1Apparatus for cleaning a semiconductor process chamberAPPLIED MATERIALS INC·Filed 2000·Granted Apr 2, 2002·20 cites·34 claims
- 1573US7691755B2Plasma immersion ion implantation with highly uniform chamber seasoning process for a toroidal source reactorAPPLIED MATERIALS INC·Filed 2007·Granted Apr 6, 2010·4 cites·16 claims
- 1669US8317970B2Ceiling electrode with process gas dispersers housing plural inductive RF power applicators extending into the plasmaLAI CANFENG·Filed 2008·Granted Nov 27, 2012·3 cites·9 claims
- 1769US7520939B2Integrated bevel clean chamberAPPLIED MATERIALS INC·Filed 2004·Granted Apr 21, 2009·12 cites·8 claims
- 1854US9303318B2Multiple complementary gas distribution assembliesAPPLIED MATERIALS INC·Filed 2012·Granted Apr 5, 2016·0 cites·19 claims
- 1948US2006102467A1Current collimation for thin seed and direct platingHERCHEN HARALD·Filed 2004·Application pending·0 cites
- 2037US2011064545A1Substrate transfer mechanism with preheating featuresAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 2135US2004206373A1Spin rinse dry cellAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 2233USD664172SDome assembly for a deposition chamberISHIKAWA TETSUYA·Filed 2009·Granted Jul 24, 2012·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →