Inventor · disambiguated record
Lizhong Sun
Also filed as: SUN LIZHONG
61 granted patents·30 pending applications·1,841 citations·filing 1997–2023
99Inventor score
Files withAPPLIED MATERIALS INC71AGERE SYSTEMS INC4SILICON LAB INC4AGERE SYST GUARDIAN CORP2RODEL INC2
Top patents by PatentIndex Score
91 records- 0198US6776693B2Method and apparatus for face-up substrate polishingAPPLIED MATERIALS INC·Filed 2002·Granted Aug 17, 2004·101 cites·46 claims
- 0298US6278332B1Charge pump for low-voltage, low-jitter phase locked loopsAGERE SYST GUARDIAN CORP·Filed 2000·Granted Aug 21, 2001·112 cites·18 claims
- 0397US6379223B1Method and apparatus for electrochemical-mechanical planarizationAPPLIED MATERIALS INC·Filed 1999·Granted Apr 30, 2002·230 cites·5 claims
- 0496US9116409B1Electrochromic devices with Si, Sn, SiO2 and SnO2 doped anodesAPPLIED MATERIALS INC·Filed 2013·Granted Aug 25, 2015·43 cites·20 claims
- 0596US7422516B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 9, 2008·42 cites·18 claims
- 0696US7278911B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Oct 9, 2007·33 cites·18 claims
- 0796US6899804B2Electrolyte composition and treatment for electrolytic chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted May 31, 2005·77 cites·37 claims
- 0896US6739951B2Method and apparatus for electrochemical-mechanical planarizationAPPLIED MATERIALS INC·Filed 2002·Granted May 25, 2004·83 cites·26 claims
- 0996US6524167B1Method and composition for the selective removal of residual materials and barrier materials during substrate planarizationAPPLIED MATERIALS INC·Filed 2000·Granted Feb 25, 2003·72 cites·20 claims
- 1095US6962524B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Nov 8, 2005·80 cites·32 claims
- 1195US6552618B2VCO gain self-calibration for low voltage phase lock-loop applicationsAGERE SYSTEMS INC·Filed 2000·Granted Apr 22, 2003·70 cites·19 claims
- 1295US6541384B1Method of initiating cooper CMP processAPPLIED MATERIALS INC·Filed 2000·Granted Apr 1, 2003·54 cites·13 claims
- 1394US9356316B2Pinhole-free solid state electrolytes with high ionic conductivityAPPLIED MATERIALS INC·Filed 2013·Granted May 31, 2016·18 cites·25 claims
- 1493US12029129B2Method and apparatus for tuning film properties during thin film depositionAPPLIED MATERIALS INC·Filed 2021·Granted Jul 2, 2024·2 cites·20 claims
- 1593US6299741B1Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatusAPPLIED MATERIALS INC·Filed 1999·Granted Oct 9, 2001·110 cites·10 claims
- 1692US6863797B2Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMPAPPLIED MATERIALS INC·Filed 2002·Granted Mar 8, 2005·45 cites·41 claims
- 1792US6504437B1Low-noise, fast-lock phase-lock loop with “gearshifting” controlAGERE SYSTEMS INC·Filed 2001·Granted Jan 7, 2003·53 cites·15 claims
- 1891US6709316B1Method and apparatus for two-step barrier layer polishingAPPLIED MATERIALS INC·Filed 2000·Granted Mar 23, 2004·64 cites·55 claims
- 1991US6592742B2Electrochemically assisted chemical polishAPPLIED MATERIALS INC·Filed 2001·Granted Jul 15, 2003·31 cites·20 claims
- 2089US6451697B1Method for abrasive-free metal CMP in passivation domainAPPLIED MATERIALS INC·Filed 2000·Granted Sep 17, 2002·38 cites·15 claims
- 2188US6669538B2Pad cleaning for a CMP systemAPPLIED MATERIALS INC·Filed 2000·Granted Dec 30, 2003·32 cites·7 claims
- 2286US6946884B2Fractional-N baseband frequency synthesizer in bluetooth applicationsAGERE SYSTEMS INC·Filed 2002·Granted Sep 20, 2005·33 cites·13 claims
- 2386US6653242B1Solution to metal re-deposition during substrate planarizationAPPLIED MATERIALS INC·Filed 2000·Granted Nov 25, 2003·33 cites·22 claims
- 2485US10547040B2Energy storage device having an interlayer between electrode and electrolyte layerAPPLIED MATERIALS INC·Filed 2016·Granted Jan 28, 2020·2 cites·10 claims
- 2585US7113009B2Programmable frequency dividerSILICON LAB INC·Filed 2004·Granted Sep 26, 2006·28 cites·26 claims
- 2685US6613200B2Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platformAPPLIED MATERIALS INC·Filed 2001·Granted Sep 2, 2003·33 cites·31 claims
- 2783US9375825B2Polishing pad conditioning system including suctionAPPLIED MATERIALS INC·Filed 2014·Granted Jun 28, 2016·4 cites·12 claims
- 2883US6396357B1Low voltage differential voltage-controlled ring oscillatorAGERE SYST GUARDIAN CORP·Filed 2000·Granted May 28, 2002·29 cites·12 claims
- 2982US7220322B1Cu CMP polishing pad cleaningAPPLIED MATERIALS INC·Filed 2000·Granted May 22, 2007·21 cites·7 claims
- 3081US7104869B2Barrier removal at low polish pressureAPPLIED MATERIALS INC·Filed 2002·Granted Sep 12, 2006·26 cites·24 claims
- 3180US7022608B2Method and composition for the removal of residual materials during substrate planarizationAPPLIED MATERIALS INC·Filed 2003·Granted Apr 4, 2006·10 cites·35 claims
- 3280US6821881B2Method for chemical mechanical polishing of semiconductor substratesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·17 cites·6 claims
- 3379US6858540B2Selective removal of tantalum-containing barrier layer during metal CMPAPPLIED MATERIALS INC·Filed 2002·Granted Feb 22, 2005·21 cites·34 claims
- 3478US6075419AHigh speed wide tuning range multi-phase output ring oscillatorPMC SIERRA LTD·Filed 1999·Granted Jun 13, 2000·30 cites·20 claims
- 3577US6074546AMethod for photoelectrochemical polishing of silicon wafersRODEL INC·Filed 1997·Granted Jun 13, 2000·46 cites·4 claims
- 3676US7551009B2High-speed divider with reduced power consumptionSILICON LAB INC·Filed 2007·Granted Jun 23, 2009·8 cites·24 claims
- 3775US7460267B2Green printing ink for color filter applicationsAPPLIED MATERIALS INC·Filed 2005·Granted Dec 2, 2008·2 cites·23 claims
- 3874US6677239B2Methods and compositions for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Jan 13, 2004·16 cites·33 claims
- 3973US7037174B2Methods for reducing delamination during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted May 2, 2006·15 cites·31 claims
- 4072US6991526B2Control of removal profile in electrochemically assisted CMPAPPLIED MATERIALS INC·Filed 2002·Granted Jan 31, 2006·14 cites·14 claims
- 4171US7384534B2Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMPAPPLIED MATERIALS INC·Filed 2005·Granted Jun 10, 2008·2 cites·16 claims
- 4269US7244168B2Methods for reducing delamination during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Jul 17, 2007·3 cites·20 claims
- 4368US7405601B2High-speed divider with pulse-width controlSILICON LAB INC·Filed 2007·Granted Jul 29, 2008·6 cites·29 claims
- 4466US7187216B2Phase selectable divider circuitSILICON LAB INC·Filed 2004·Granted Mar 6, 2007·12 cites·51 claims
- 4565US9765426B1Lithium containing composite metallic sputtering targetsAPPLIED MATERIALS INC·Filed 2013·Granted Sep 19, 2017·1 cites·19 claims
- 4663US7012025B2Tantalum removal during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Mar 14, 2006·8 cites·3 claims
- 4762US12404577B2Method and apparatus for deposition of piezo-electric materialsAPPLIED MATERIALS INC·Filed 2019·Granted Sep 2, 2025·0 cites·8 claims
- 4862US7471123B2Fractional-N baseband frequency synthesizer in bluetooth applicationsAGERE SYSTEMS INC·Filed 2005·Granted Dec 30, 2008·4 cites·20 claims
- 4961US11072852B2Pre-conditioned chamber componentsAPPLIED MATERIALS INC·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 5060US6319370B1Apparatus for photoelectrochemical polishing of silicon wafersRODEL INC·Filed 2000·Granted Nov 20, 2001·6 cites·1 claims
Showing the top 50 of 91 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →