Inventor · disambiguated record
Low Siu Waf
Also filed as: WAF LOW S · WAF LOW SIU
35 granted patents·1 pending application·1,609 citations·filing 2001–2019
98Inventor score
Top patents by PatentIndex Score
36 records- 0199US6611052B2Wafer level stackable semiconductor packageMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·261 cites·39 claims
- 0299US6582992B2Stackable semiconductor package and wafer level fabrication methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 24, 2003·283 cites·19 claims
- 0397US6949407B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 27, 2005·42 cites·18 claims
- 0497US6727116B2Semiconductor devices including peripherally located bond pads, assemblies, packages, and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 27, 2004·149 cites·25 claims
- 0596US6855572B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 15, 2005·96 cites·41 claims
- 0695US7358154B2Method for fabricating packaged dieMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 15, 2008·30 cites·24 claims
- 0795US6750547B2Multi-substrate microelectronic packages and methods for manufactureMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 15, 2004·101 cites·47 claims
- 0895US6747348B2Apparatus and method for leadless packaging of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 8, 2004·73 cites·43 claims
- 0995US6743696B2Apparatus and method for leadless packaging of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 1, 2004·79 cites·8 claims
- 1094US7285850B2Support elements for semiconductor devices with peripherally located bond padsMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 23, 2007·26 cites·27 claims
- 1194US7115984B2Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 3, 2006·67 cites·10 claims
- 1294US6894386B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted May 17, 2005·69 cites·30 claims
- 1393US8065792B2Method for packaging circuitsCHIA YONG POO·Filed 2010·Granted Nov 29, 2011·13 cites·18 claims
- 1493US6818977B2Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 16, 2004·60 cites·43 claims
- 1591US6836009B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·51 cites·53 claims
- 1688US7528477B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted May 5, 2009·10 cites·22 claims
- 1787US8555495B2Method for packaging circuitsCHIA YONG POO·Filed 2011·Granted Oct 15, 2013·6 cites·20 claims
- 1887US6790706B2Apparatus and method for leadless packaging of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 14, 2004·33 cites·20 claims
- 1986US7712211B2Method for packaging circuits and packaged circuitsMICRON TECHNOLOGY INC·Filed 2003·Granted May 11, 2010·26 cites·25 claims
- 2086US7679179B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 16, 2010·8 cites·19 claims
- 2185US9484225B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2013·Granted Nov 1, 2016·4 cites·7 claims
- 2285US8008126B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 30, 2011·7 cites·14 claims
- 2384US6841418B2Multi-substrate microelectronic packages and methods for manufactureMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 11, 2005·32 cites·49 claims
- 2483US7195957B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 27, 2007·25 cites·6 claims
- 2577US8138617B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2004·Granted Mar 20, 2012·19 cites·15 claims
- 2675US7226809B2Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 5, 2007·15 cites·48 claims
- 2770US7276387B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 2, 2007·2 cites·19 claims
- 2866US6836008B2Semiconductor packages with leadframe grid arrays and componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·10 cites·52 claims
- 2965US7170161B2In-process semiconductor packages with leadframe grid arraysMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·2 cites·20 claims
- 3064US10811278B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 20, 2020·0 cites·13 claims
- 3164US6787894B2Apparatus and method for leadless packaging of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 7, 2004·8 cites·18 claims
- 3259US8115306B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2010·Granted Feb 14, 2012·1 cites·20 claims
- 3358US10453704B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 22, 2019·0 cites·14 claims
- 3451US2007120247A1Semiconductor packages having leadframe-based connection arraysYU CHAN M·Filed 2007·Application pending·0 cites
- 3546US6967127B2Methods for making semiconductor packages with leadframe grid arraysMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 22, 2005·1 cites·19 claims
- 3645US8637973B2Packaged microelectronic components with terminals exposed through encapsulantKOON ENG MEOW·Filed 2007·Granted Jan 28, 2014·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →