Inventor · disambiguated record
Lumin Li
Also filed as: LI LUMIN
36 granted patents·5 pending applications·1,443 citations·filing 1995–2020
98Inventor score
Top patents by PatentIndex Score
41 records- 0198US6527911B1Configurable plasma volume etch chamberLAM RES CORP·Filed 2001·Granted Mar 4, 2003·218 cites·31 claims
- 0297US11594400B2Multi zone gas injection upper electrode systemLAM RES CORP·Filed 2020·Granted Feb 28, 2023·6 cites·11 claims
- 0397US6178919B1Perforated plasma confinement ring in plasma reactorsLAM RES CORP·Filed 1998·Granted Jan 30, 2001·208 cites·34 claims
- 0495US8080760B2Apparatuses for adjusting electrode gap in capacitively-coupled RF plasma reactorDHINDSA RAJINDER·Filed 2010·Granted Dec 20, 2011·30 cites·15 claims
- 0595US7749353B2High aspect ratio etch using modulation of RF powers of various frequenciesLAM RES CORP·Filed 2006·Granted Jul 6, 2010·30 cites·16 claims
- 0695US7732728B2Apparatuses for adjusting electrode gap in capacitively-coupled RF plasma reactorLAM RES CORP·Filed 2007·Granted Jun 8, 2010·52 cites·13 claims
- 0795US7525787B2Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating sameLAM RES CORP·Filed 2005·Granted Apr 28, 2009·29 cites·32 claims
- 0895US6833325B2Method for plasma etching performance enhancementLAM RES CORP·Filed 2002·Granted Dec 21, 2004·70 cites·20 claims
- 0994US7977390B2Method for plasma etching performance enhancementLAM RES CORP·Filed 2006·Granted Jul 12, 2011·29 cites·18 claims
- 1094US6984288B2Plasma processor in plasma confinement region within a vacuum chamberLAM RES CORP·Filed 2001·Granted Jan 10, 2006·52 cites·28 claims
- 1193US6106663ASemiconductor process chamber electrodeLAM RES CORP·Filed 1998·Granted Aug 22, 2000·71 cites·19 claims
- 1293US5656123ADual-frequency capacitively-coupled plasma reactor for materials processingVARIAN ASSOCIATES·Filed 1995·Granted Aug 12, 1997·156 cites·8 claims
- 1392US6746961B2Plasma etching of dielectric layer with etch profile controlLAM RES CORP·Filed 2001·Granted Jun 8, 2004·61 cites·20 claims
- 1491US8674255B1Apparatus and method for controlling etch uniformityLENZ ERIC·Filed 2005·Granted Mar 18, 2014·23 cites·18 claims
- 1589US7683289B2Apparatus and method for controlling plasma density profileLAM RES CORP·Filed 2005·Granted Mar 23, 2010·31 cites·12 claims
- 1688US6090304AMethods for selective plasma etchLAM RES CORP·Filed 1997·Granted Jul 18, 2000·104 cites·6 claims
- 1787US8393873B2Air compressor with shut-off mechanismHILL SEAN D·Filed 2011·Granted Mar 12, 2013·9 cites·18 claims
- 1887US8299390B2Apparatus and method for controlling plasma density profileDHINDSA RAJINDER·Filed 2010·Granted Oct 30, 2012·13 cites·13 claims
- 1987US6716303B1Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating sameLAM RES CORP·Filed 2000·Granted Apr 6, 2004·20 cites·21 claims
- 2087US6506685B2Perforated plasma confinement ring in plasma reactorsLAM RES CORP·Filed 2000·Granted Jan 14, 2003·64 cites·18 claims
- 2185US8961145B2Air compressor with shut-off mechanismBLACK & DECKER INC·Filed 2013·Granted Feb 24, 2015·4 cites·4 claims
- 2285US7874807B2Air compressor with shut-off mechanismBLACK & DECKER INC·Filed 2007·Granted Jan 25, 2011·7 cites·11 claims
- 2384US7405521B2Multiple frequency plasma processor method and apparatusLAM RES CORP·Filed 2003·Granted Jul 29, 2008·35 cites·45 claims
- 2483US7144521B2High aspect ratio etch using modulation of RF powers of various frequenciesLAM RES CORP·Filed 2003·Granted Dec 5, 2006·24 cites·15 claims
- 2582US9111724B2Apparatus and method for controlling plasma potentialKEIL DOUGLAS·Filed 2010·Granted Aug 18, 2015·5 cites·18 claims
- 2680US8114246B2Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating sameNI TUQIANG·Filed 2006·Granted Feb 14, 2012·4 cites·20 claims
- 2780US8000082B2Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating sameLAM RES CORP·Filed 2009·Granted Aug 16, 2011·5 cites·19 claims
- 2880US5716485AElectrode designs for controlling uniformity profiles in plasma processing reactorsVARIAN ASSOCIATES·Filed 1995·Granted Feb 10, 1998·38 cites·32 claims
- 2974US7977242B2Double mask self-aligned double patterning technology (SADPT) processLAM RES CORP·Filed 2009·Granted Jul 12, 2011·4 cites·18 claims
- 3074US7838086B2Magnetic enhancement for mechanical confinement of plasmaLAM RES CORP·Filed 2008·Granted Nov 23, 2010·3 cites·7 claims
- 3174US7169695B2Method for forming a dual damascene structureLAM RES CORP·Filed 2003·Granted Jan 30, 2007·16 cites·14 claims
- 3267US7455748B2Magnetic enhancement for mechanical confinement of plasmaLAM RES CORP·Filed 2003·Granted Nov 25, 2008·9 cites·17 claims
- 3363US10622195B2Multi zone gas injection upper electrode systemBISE RYAN·Filed 2012·Granted Apr 14, 2020·2 cites·11 claims
- 3454US2008006205A1Apparatus and Method for Controlling Plasma PotentialKEIL DOUGLAS·Filed 2006·Application pending·0 cites
- 3553US7632375B2Electrically enhancing the confinement of plasmaLAM RES CORP·Filed 2004·Granted Dec 15, 2009·11 cites·50 claims
- 3650US9263240B2Dual zone temperature control of upper electrodesMARAKHTANOV ALEXEI·Filed 2012·Granted Feb 16, 2016·0 cites·10 claims
- 3746US7105102B2Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating sameLAM RES CORP·Filed 2004·Granted Sep 12, 2006·0 cites·7 claims
- 3845US2004173159A1Semiconductor process chamber electrodeLAM RES CORP·Filed 2004·Application pending·0 cites
- 3944US2005037624A1Method for plasma etching performance enhancementLAM RES CORP·Filed 2004·Application pending·0 cites
- 4043US2007002562A1Emergency radio, light and power supplyVANWAMBEKE WESTON J·Filed 2006·Application pending·0 cites
- 4141US2007181530A1Reducing line edge roughnessLAM RES CORP·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →