Inventor · disambiguated record
Masayuki Asai
Also filed as: ASAI MASAYUKI
28 granted patents·5 pending applications·312 citations·filing 1992–2024
96Inventor score
Files withHITACHI INT ELECTRIC INC17KOKUSAI ELECTRIC CORP4ASAI MASAYUKI3MIYA HIRONOBU3MIZUNO NORIKAZU2
Top patents by PatentIndex Score
33 records- 0193US7779785B2Production method for semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2006·Granted Aug 24, 2010·21 cites·3 claims
- 0292US11705325B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jul 18, 2023·1 cites·21 claims
- 0392US8227346B2Method of producing semiconductor deviceMIYA HIRONOBU·Filed 2011·Granted Jul 24, 2012·12 cites·10 claims
- 0490US8039404B2Production method for semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2010·Granted Oct 18, 2011·9 cites·3 claims
- 0587US6884738B2Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2003·Granted Apr 26, 2005·50 cites·20 claims
- 0685US7767594B2Semiconductor device producing methodHITACHI INT ELECTRIC INC·Filed 2007·Granted Aug 3, 2010·9 cites·15 claims
- 0785US6425175B1Method of manufacturing a statorDENSO CORP·Filed 2000·Granted Jul 30, 2002·37 cites·7 claims
- 0884US8105957B2Method of producing semiconductor deviceMIYA HIRONOBU·Filed 2009·Granted Jan 31, 2012·7 cites·12 claims
- 0983US7796397B2Electronic components assembly and method for producing samePANASONIC CORP·Filed 2007·Granted Sep 14, 2010·13 cites·8 claims
- 1083US2025022702A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1182US6787481B2Method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2003·Granted Sep 7, 2004·29 cites·17 claims
- 1281US12142476B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 12, 2024·0 cites·21 claims
- 1381US9895727B2Method of manufacturing semiconductor device, method of cleaning interior of process chamber, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Feb 20, 2018·3 cites·21 claims
- 1477US9593422B2Substrate processing apparatus and semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 14, 2017·2 cites·8 claims
- 1575US8168549B2Method of manufacturing semiconductor device and substrate processing apparatusASAI MASAYUKI·Filed 2010·Granted May 1, 2012·4 cites·2 claims
- 1673US8535479B2Manufacturing method of semiconductor device, and semiconductor deviceMIZUNO NORIKAZU·Filed 2011·Granted Sep 17, 2013·2 cites·10 claims
- 1773US8093159B2Manufacturing method of semiconductor device, and semiconductor deviceMIZUNO NORIKAZU·Filed 2008·Granted Jan 10, 2012·3 cites·30 claims
- 1870US6825126B2Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2003·Granted Nov 30, 2004·11 cites·20 claims
- 1969US11527401B2Method of processing substate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 2069US7531467B2Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2005·Granted May 12, 2009·3 cites·3 claims
- 2161US9175395B2Substrate processing apparatus and semiconductor device manufacturing methodASAI MASAYUKI·Filed 2011·Granted Nov 3, 2015·1 cites·10 claims
- 2257US2009277382A1Semiconductor manufacturing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 2351US9963785B2Substrate processing apparatus and semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2015·Granted May 8, 2018·0 cites·8 claims
- 2451US5495430AProcess time estimating apparatusTOYODA CHUO KENKYUSHO KK·Filed 1992·Granted Feb 27, 1996·92 cites·21 claims
- 2547US7524766B2Method for manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2003·Granted Apr 28, 2009·3 cites·3 claims
- 2646US2009004877A1Substrate processing apparatus and semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 2745US9145606B2Method of manufacturing semiconductor device, cleaning method, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2012·Granted Sep 29, 2015·0 cites·19 claims
- 2845US8058184B2Semiconductor device producing methodMIYA HIRONOBU·Filed 2010·Granted Nov 15, 2011·0 cites·2 claims
- 2945US2002197828A1Method and apparatus for manufacturing a semiconductor device and processing a substrateHITACHI INT ELECTRIC INC·Filed 2002·Application pending·0 cites
- 3043US2009130331A1Method of Forming Thin Film and Method of Manufacturing Semiconductor DeviceHITACHI INT ELECTRIC INC·Filed 2006·Application pending·0 cites
- 3141US9545736B2Mold and die metallic material, air-permeable member for mold and die use, and method for manufacturing the sameASAI MASAYUKI·Filed 2012·Granted Jan 17, 2017·0 cites·15 claims
- 3239US9502233B2Method for manufacturing semiconductor device, method for processing substrate, substrate processing device and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Nov 22, 2016·0 cites·16 claims
- 3330US8129443B2Polymerizable composition, cured object obtained therefrom, and composite materialORI TATSUYA·Filed 2001·Granted Mar 6, 2012·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →