Inventor · disambiguated record
Masood Murtuza
Also filed as: MURTUZA MASOOD
41 granted patents·10 pending applications·675 citations·filing 1995–2025
98Inventor score
Files withTEXAS INSTRUMENTS INC25OCTAVO SYSTEMS LLC19DUNNE RAJIV3BONIFIELD THOMAS D1EDWARDS DARVIN R1
Top patents by PatentIndex Score
51 records- 0197US8017439B2Dual carrier for joining IC die or wafers to TSV wafersTEXAS INSTRUMENTS INC·Filed 2010·Granted Sep 13, 2011·26 cites·20 claims
- 0296US7057284B2Fine pitch low-cost flip chip substrateTEXAS INSTRUMENTS INC·Filed 2004·Granted Jun 6, 2006·92 cites·10 claims
- 0396US6888255B2Built-up bump pad structure and method for sameTEXAS INSTRUMENTS INC·Filed 2003·Granted May 3, 2005·144 cites·10 claims
- 0495US6849944B2Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die padTEXAS INSTRUMENTS INC·Filed 2003·Granted Feb 1, 2005·107 cites·37 claims
- 0592US7915080B2Bonding IC die to TSV wafersTEXAS INSTRUMENTS INC·Filed 2009·Granted Mar 29, 2011·30 cites·16 claims
- 0690US11157676B2Method for routing bond wires in system in a package (SiP) devicesOCTAVO SYSTEMS LLC·Filed 2017·Granted Oct 26, 2021·11 cites·20 claims
- 0790US8178976B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2009·Granted May 15, 2012·18 cites·14 claims
- 0888US12001363B2Secure enclave system-in-packageOCTAVO SYSTEMS LLC·Filed 2021·Granted Jun 4, 2024·2 cites·18 claims
- 0986US6869831B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 22, 2005·35 cites·12 claims
- 1084US10204890B2Substrate for system in package (SIP) devicesOCTAVO SYSTEMS LLC·Filed 2015·Granted Feb 12, 2019·4 cites·10 claims
- 1184US6396136B2Ball grid package with multiple power/ground planesTEXAS INSTRUMENTS INC·Filed 1999·Granted May 28, 2002·87 cites·2 claims
- 1282US10714430B2EMI shield for molded packagesOCTAVO SYSTEMS LLC·Filed 2018·Granted Jul 14, 2020·3 cites·10 claims
- 1382US8154134B2Packaged electronic devices with face-up die having TSV connection to leads and die padBONIFIELD THOMAS D·Filed 2009·Granted Apr 10, 2012·15 cites·14 claims
- 1479US8431481B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2012·Granted Apr 30, 2013·4 cites·11 claims
- 1577US7635914B2Multi layer low cost cavity substrate fabrication for pop packagesTEXAS INSTRUMENTS INC·Filed 2007·Granted Dec 22, 2009·8 cites·13 claims
- 1676US11171126B2Configurable substrate and systemsOCTAVO SYSTEMS LLC·Filed 2016·Granted Nov 9, 2021·3 cites·7 claims
- 1776US7790597B2Solder cap application process on copper bump using solder powder filmTEXAS INSTRUMENTS INC·Filed 2008·Granted Sep 7, 2010·7 cites·11 claims
- 1876US7319275B2Adhesion by plasma conditioning of semiconductor chipTEXAS INSTRUMENTS INC·Filed 2005·Granted Jan 15, 2008·5 cites·10 claims
- 1973US12243794B2System in a package modificationsOCTAVO SYSTEMS LLC·Filed 2023·Granted Mar 4, 2025·0 cites·19 claims
- 2073US6900534B2Direct attach chip scale packageTEXAS INSTRUMENTS INC·Filed 2001·Granted May 31, 2005·17 cites·11 claims
- 2173US2025266266A1Molded packages in a molded deviceOCTAVO SYSTEMS LLC·Filed 2025·Application pending·0 cites
- 2270US8716068B2Method for contacting agglomerate terminals of semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2013·Granted May 6, 2014·2 cites·17 claims
- 2366US8039309B2Systems and methods for post-circuitization assemblyTEXAS INSTRUMENTS INC·Filed 2008·Granted Oct 18, 2011·3 cites·20 claims
- 2466US7883936B2Multi layer low cost cavity substrate fabrication for PoP packagesTEXAS INSTRUMENTS INC·Filed 2009·Granted Feb 8, 2011·3 cites·7 claims
- 2565US5586010ALow stress ball grid array packageTEXAS INSTRUMENTS INC·Filed 1995·Granted Dec 17, 1996·34 cites·16 claims
- 2664US6717276B2Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assemblyTEXAS INSTRUMENTS INC·Filed 2002·Granted Apr 6, 2004·10 cites·20 claims
- 2763US2025218798A1Methods and devices for processing singulated substratesOCTAVO SYSTEMS LLC·Filed 2024·Application pending·0 cites
- 2861US7445960B2Adhesion by plasma conditioning of semiconductor chipTEXAS INSTRUMENTS INC·Filed 2007·Granted Nov 4, 2008·1 cites·10 claims
- 2960US11869823B2System in a package modificationsOCTAVO SYSTEMS LLC·Filed 2020·Granted Jan 9, 2024·0 cites·13 claims
- 3060US11302648B2EMI shield for molded packagesOCTAVO SYSTEMS LLC·Filed 2020·Granted Apr 12, 2022·0 cites·17 claims
- 3160US7276401B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2006·Granted Oct 2, 2007·1 cites·10 claims
- 3260US7271494B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 18, 2007·1 cites·6 claims
- 3358US10867979B2Circuit mounting structure and lead frame for system in package (SIP) devicesOCTAVO SYSTEMS LLC·Filed 2018·Granted Dec 15, 2020·0 cites·15 claims
- 3456US8643165B2Semiconductor device having agglomerate terminalsEDWARDS DARVIN R·Filed 2012·Granted Feb 4, 2014·1 cites·2 claims
- 3556US2022028704A1Molded packages in a molded deviceOCTAVO SYSTEMS LLC·Filed 2019·Application pending·0 cites
- 3655US2025216440A1Reliability testing using functional devicesOCTAVO SYSTEMS LLC·Filed 2023·Application pending·0 cites
- 3752US8436475B2IC device having low resistance TSV comprising ground connectionDUNNE RAJIV·Filed 2012·Granted May 7, 2013·0 cites·10 claims
- 3852US7323405B2Fine pitch low cost flip chip substrateTEXAS INSTRUMENTS INC·Filed 2006·Granted Jan 29, 2008·0 cites·11 claims
- 3951US2024266243A1System in a package (sip) thermal managementOCTAVO SYSTEMS LLC·Filed 2022·Application pending·0 cites
- 4049US11257803B2System in a package connectorsOCTAVO SYSTEMS LLC·Filed 2019·Granted Feb 22, 2022·0 cites·18 claims
- 4146US2009297879A1Structure and Method for Reliable Solder JointsTEXAS INSTRUMENTS INC·Filed 2009·Application pending·0 cites
- 4245US11211369B2Service module for SIP devicesOCTAVO SYSTEMS LLC·Filed 2019·Granted Dec 28, 2021·0 cites·9 claims
- 4345US2005140025A1Direct attach chip scale packageFiled 2005·Application pending·0 cites
- 4444US7642649B2Support structure for low-k dielectricsTEXAS INSTRUMENTS INC·Filed 2003·Granted Jan 5, 2010·1 cites·18 claims
- 4543US2014367838A1Leadframe with lead of varying thicknessTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 4641US11610844B2High performance module for SiPOCTAVO SYSTEMS LLC·Filed 2018·Granted Mar 21, 2023·0 cites·16 claims
- 4740US11502030B2System and method of assembling a systemOCTAVO SYSTEMS LLC·Filed 2017·Granted Nov 15, 2022·0 cites·14 claims
- 4840US2004217486A1Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assemblyFiled 2004·Application pending·0 cites
- 4938US2017221871A1Systems and methods for manufacturing electronic devicesOCTAVO SYSTEMS LLC·Filed 2017·Application pending·0 cites
- 5034US9354138B2Fixture for test circuit board reliability testingTEXAS INSTRUMENTS INC·Filed 2013·Granted May 31, 2016·0 cites·12 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →