Inventor · disambiguated record
Matthew Sendelbach
Also filed as: SENDELBACH MATTHEW · SENDELBACH MATTHEW J
26 granted patents·6 pending applications·261 citations·filing 1997–2024
95Inventor score
Top patents by PatentIndex Score
32 records- 0192US7286247B2Assessment and optimization for metrology instrument including uncertainty of total measurement uncertaintyIBM·Filed 2005·Granted Oct 23, 2007·22 cites·30 claims
- 0286US10876959B2Method and system for optical characterization of patterned samplesNOVA MEASURING INSTR LTD·Filed 2018·Granted Dec 29, 2020·2 cites·3 claims
- 0386US10664638B1Measuring complex structures in semiconductor fabricationGLOBALFOUNDRIES INC·Filed 2018·Granted May 26, 2020·7 cites·23 claims
- 0484US11885737B2Method and system for optical characterization of patterned samplesNOVA LTD·Filed 2020·Granted Jan 30, 2024·1 cites·8 claims
- 0584US2024337590A1Method and system for optical characterization of patterned samplesNOVA LTD·Filed 2024·Application pending·0 cites
- 0681US9330985B2Automated hybrid metrology for semiconductor device fabricationVAID ALOK·Filed 2012·Granted May 3, 2016·11 cites·19 claims
- 0781US5880007APlanarization of a non-conformal device layer in semiconductor fabricationSIEMENS AG·Filed 1997·Granted Mar 9, 1999·59 cites·1 claims
- 0880US10209206B2Method and system for determining strain distribution in a sampleNOVA MEASURING INSTR LTD·Filed 2014·Granted Feb 19, 2019·6 cites·14 claims
- 0980US5811357AProcess of etching an oxide layerIBM·Filed 1997·Granted Sep 22, 1998·57 cites·13 claims
- 1074US11710616B2TEM-based metrology method and systemNOVA LTD·Filed 2022·Granted Jul 25, 2023·0 cites·22 claims
- 1173US7265850B2Fortified, compensated and uncompensated process-sensitive scatterometry targetsIBM·Filed 2003·Granted Sep 4, 2007·13 cites·13 claims
- 1272US11300948B2Process control of semiconductor fabrication based on spectra quality metricsGLOBALFOUNDRIES INC·Filed 2019·Granted Apr 12, 2022·1 cites·20 claims
- 1369US11450541B2Metrology method and systemNOVA LTD·Filed 2018·Granted Sep 20, 2022·1 cites·19 claims
- 1467US11309162B2TEM-based metrology method and systemNOVA LTD·Filed 2021·Granted Apr 19, 2022·0 cites·5 claims
- 1566US10302414B2Scatterometry method and systemNOVA MEASURING INSTR LTD·Filed 2015·Granted May 28, 2019·2 cites·8 claims
- 1664US7453583B2Assessment and optimization for metrology instrument including uncertainty of total measurement uncertaintyIBM·Filed 2007·Granted Nov 18, 2008·2 cites·25 claims
- 1764US2023074398A1Metrology method and systemNOVA LTD·Filed 2022·Application pending·0 cites
- 1863US2015316468A1Method and system for optical characterization of patterned samplesNOVA MEASURING INSTR LTD·Filed 2014·Application pending·0 cites
- 1962US6001740APlanarization of a non-conformal device layer in semiconductor fabricationSIEMENS AG·Filed 1998·Granted Dec 14, 1999·24 cites·19 claims
- 2060US6361402B1Method for planarizing photoresistIBM·Filed 1999·Granted Mar 26, 2002·26 cites·22 claims
- 2159US8157978B2Etching system and method for forming multiple porous semiconductor regions with different optical and structural properties on a single semiconductor waferSENDELBACH MATTHEW J·Filed 2009·Granted Apr 17, 2012·2 cites·11 claims
- 2254US10916404B2TEM-based metrology method and systemNOVA MEASURING INSTR LTD·Filed 2018·Granted Feb 9, 2021·0 cites·14 claims
- 2353US7760360B2Monitoring a photolithographic process using a scatterometry targetIBM·Filed 2007·Granted Jul 20, 2010·0 cites·9 claims
- 2452US7107177B2Combining multiple reference measurement collections into a weighted reference measurement collectionIBM·Filed 2005·Granted Sep 12, 2006·1 cites·20 claims
- 2551US7791723B2Optical measurement using fixed polarizerIBM·Filed 2008·Granted Sep 7, 2010·0 cites·18 claims
- 2649US6066566AHigh selectivity collar oxide etch processesIBM·Filed 1998·Granted May 23, 2000·12 cites·20 claims
- 2746US11295969B2Hybridization for characterization and metrologyIBM·Filed 2018·Granted Apr 5, 2022·0 cites·17 claims
- 2844US5976982AMethods for protecting device components from chemical mechanical polish induced defectsSIEMENS AG·Filed 1997·Granted Nov 2, 1999·12 cites·19 claims
- 2942US2017018069A1Hybrid metrology techniqueGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
- 3036US10222710B2Method and system for planning metrology measurementsNOVA MEASURING INSTR LTD·Filed 2015·Granted Mar 5, 2019·0 cites·15 claims
- 3136US2020279783A1Process control of semiconductor fabrication based on linkage between different fabrication stepsGLOBALFOUNDRIES INC·Filed 2019·Application pending·0 cites
- 3231US2013203188A1Hybrid metrology for semiconductor devicesVAID ALOK·Filed 2012·Application pending·0 cites
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