Inventor · disambiguated record
Mark D. Smith
Also filed as: SMITH MARK · SMITH MARK D · SMITH MARK DAVIS
27 granted patents·5 pending applications·142 citations·filing 2006–2025
96Inventor score
Top patents by PatentIndex Score
32 records- 0198US11782411B2System and method for mitigating overlay distortion patterns caused by a wafer bonding toolKLA CORP·Filed 2022·Granted Oct 10, 2023·5 cites·15 claims
- 0297US10095122B1Systems and methods for fabricating metrology targets with sub-resolution featuresKLA TENCOR CORP·Filed 2016·Granted Oct 9, 2018·18 cites·18 claims
- 0394US12164277B2System and method for mitigating overlay distortion patterns caused by a wafer bonding toolKLA CORP·Filed 2023·Granted Dec 10, 2024·1 cites·18 claims
- 0493US11829077B2System and method for determining post bonding overlayKLA CORP·Filed 2021·Granted Nov 28, 2023·3 cites·19 claims
- 0593US9733576B2Model for accurate photoresist profile predictionKLA TENCOR CORP·Filed 2014·Granted Aug 15, 2017·8 cites·20 claims
- 0691US12197137B2System and method for determining post bonding overlayKLA CORP·Filed 2023·Granted Jan 14, 2025·1 cites·21 claims
- 0791US11164768B2Process-induced displacement characterization during semiconductor productionKLA TENCOR CORP·Filed 2018·Granted Nov 2, 2021·6 cites·34 claims
- 0891US10024654B2Method and system for determining in-plane distortions in a substrateKLA TENCOR CORP·Filed 2016·Granted Jul 17, 2018·11 cites·24 claims
- 0989US10475712B2System and method for process-induced distortion prediction during wafer depositionKLA TENCOR CORP·Filed 2017·Granted Nov 12, 2019·5 cites·23 claims
- 1089US10018919B2System and method for fabricating metrology targets oriented with an angle rotated with respect to device featuresKLA TENCOR CORP·Filed 2016·Granted Jul 10, 2018·4 cites·23 claims
- 1187US11682570B2Process-induced displacement characterization during semiconductor productionKLA CORP·Filed 2021·Granted Jun 20, 2023·1 cites·27 claims
- 1287US10496781B2Metrology recipe generation using predicted metrology imagesKLA TENCOR CORP·Filed 2017·Granted Dec 3, 2019·6 cites·42 claims
- 1387US7528953B2Target acquisition and overlay metrology based on two diffracted orders imagingKLA TENCOR TECH CORP·Filed 2006·Granted May 5, 2009·10 cites·30 claims
- 1486US7925486B2Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layoutKLA TENCOR TECH CORP·Filed 2007·Granted Apr 12, 2011·16 cites·18 claims
- 1584US8589827B2Photoresist simulationBIAFORE JOHN J·Filed 2010·Granted Nov 19, 2013·13 cites·9 claims
- 1682US10007191B2Method for computer modeling and simulation of negative-tone-developable photoresistsKLA TENCOR CORP·Filed 2016·Granted Jun 26, 2018·3 cites·34 claims
- 1781US10579768B2Process compatibility improvement by fill factor modulationKLA TENCOR CORP·Filed 2016·Granted Mar 3, 2020·3 cites·5 claims
- 1881US2025103019A1System and method for mitigating overlay distortion patterns caused by a wafer bonding toolKLA CORP·Filed 2024·Application pending·0 cites
- 1979US12117347B2Metrology target design for tilted device designsKLA CORP·Filed 2016·Granted Oct 15, 2024·2 cites·40 claims
- 2079US10209627B2Systems and methods for focus-sensitive metrology targetsKLA TENCOR CORP·Filed 2017·Granted Feb 19, 2019·2 cites·35 claims
- 2178US10444639B2Layer-to-layer feedforward overlay control with alignment correctionsKLA TENCOR CORP·Filed 2017·Granted Oct 15, 2019·4 cites·39 claims
- 2278US10216096B2Process-sensitive metrology systems and methodsKLA TENCOR CORP·Filed 2016·Granted Feb 26, 2019·2 cites·19 claims
- 2376US10685165B2Metrology using overlay and yield critical patternsKLA TENCOR CORP·Filed 2016·Granted Jun 16, 2020·2 cites·6 claims
- 2476US8428762B2Spin coating modelingGRAVES JOHN S·Filed 2010·Granted Apr 23, 2013·9 cites·10 claims
- 2576US2025035489A1Metrology target design for tilted device designsKLA CORP·Filed 2024·Application pending·0 cites
- 2674US10030965B2Model-based hot spot monitoringKLA TENCOR CORP·Filed 2016·Granted Jul 24, 2018·2 cites·20 claims
- 2774US9679116B2Photoresist simulationKLA TENCOR CORP·Filed 2013·Granted Jun 13, 2017·3 cites·9 claims
- 2869US2025251669A1System and method for determining post bonding overlayKLA CORP·Filed 2025·Application pending·0 cites
- 2967US10340165B2Systems and methods for automated multi-zone detection and modelingKLA TENCOR CORP·Filed 2017·Granted Jul 2, 2019·2 cites·34 claims
- 3065US2023030116A1System and method for optimizing through silicon via overlayKLA CORP·Filed 2022·Application pending·0 cites
- 3158US2023032406A1System and method for detecting particle contamination on a bonding toolKLA CORP·Filed 2022·Application pending·0 cites
- 3250US11221561B2System and method for wafer-by-wafer overlay feedforward and lot-to-lot feedback controlKLA CORP·Filed 2020·Granted Jan 11, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →