Inventor · disambiguated record
Ming-Yen Chiu
Also filed as: CHIU MING-YEN
41 granted patents·4 pending applications·254 citations·filing 2006–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD37TOUCH MICRO SYSTEM TECH3CHIU MING-YEN2TAIWAN SEMICONDUCTOR MFG2HARN YU-CHYI1
Top patents by PatentIndex Score
45 records- 0198US9837359B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·43 cites·6 claims
- 0298US9196586B2Semiconductor package including an embedded surface mount device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 24, 2015·52 cites·20 claims
- 0395US10068844B2Integrated fan-out structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 4, 2018·13 cites·20 claims
- 0495US9922895B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·8 cites·20 claims
- 0595US8174124B2Dummy pattern in wafer backside routingCHIU MING-YEN·Filed 2010·Granted May 8, 2012·47 cites·20 claims
- 0693US10276506B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·7 cites·20 claims
- 0793US9754928B2SMD, IPD, and/or wire mount in a packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 5, 2017·10 cites·19 claims
- 0892US11322419B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 0992US10163861B2Semiconductor package for thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·6 cites·20 claims
- 1091US11362037B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·2 cites·20 claims
- 1190US9449947B2Semiconductor package for thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·7 cites·20 claims
- 1289US11417569B2Package structure having integrated circuit component with conductive terminals of different dimensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 16, 2022·5 cites·20 claims
- 1388US10770402B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·3 cites·20 claims
- 1488US10756038B1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·4 cites·20 claims
- 1588US10163745B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·3 cites·20 claims
- 1687US10037961B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·6 cites·20 claims
- 1786US10109589B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 23, 2018·3 cites·20 claims
- 1886US8368180B2Scribe line metal structureTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Feb 5, 2013·10 cites·18 claims
- 1986US2025279325A1Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2085US10068867B2Post-passivation interconnect structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 4, 2018·4 cites·20 claims
- 2182US11804475B2Semiconductor package for thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 31, 2023·0 cites·20 claims
- 2281US10636757B2Integrated circuit component package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 28, 2020·3 cites·19 claims
- 2380US11901303B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2479US11854993B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2579US2024363415A1Integrated circuit component and package structure having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2678US12334406B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 2776US10811389B2Semiconductor package for thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·1 cites·20 claims
- 2876US10790235B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·1 cites·20 claims
- 2975US12074066B2Integrated circuit component with conductive terminals of different dimensions and package structure having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 3075US10170430B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·1 cites·20 claims
- 3173US11594520B2Semiconductor package for thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 28, 2023·0 cites·20 claims
- 3273US11282796B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 3372US8786054B2Structure for integrated circuit alignmentHARN YU-CHYI·Filed 2009·Granted Jul 22, 2014·4 cites·20 claims
- 3469US7598125B2Method for wafer level packaging and fabricating cap structuresTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Oct 6, 2009·5 cites·13 claims
- 3565US10879201B2Semiconductor package for wafer level packaging and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 29, 2020·0 cites·20 claims
- 3665US2021118804A1Package structure with bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Application pending·0 cites
- 3764US10734299B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 3863US10879185B2Package structure with bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
- 3962US9941216B2Conductive pattern and integrated fan-out package having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·1 cites·17 claims
- 4062US7393774B2Method of fabricating microconnectorsTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Jul 1, 2008·1 cites·11 claims
- 4160US7510947B2Method for wafer level packaging and fabricating cap structuresTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Mar 31, 2009·2 cites·25 claims
- 4255US9461020B2Semiconductor package including an embedded surface mount device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·0 cites·20 claims
- 4354US10515899B2Package structure with bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 24, 2019·0 cites·20 claims
- 4449US9818711B2Post-passivation interconnect structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 14, 2017·0 cites·20 claims
- 4541US2008200023A1Method of fabricating micro connectorsCHIU MING-YEN·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →