Inventor · disambiguated record
Min Suk Suh
Also filed as: SUH MIN SUK
31 granted patents·10 pending applications·567 citations·filing 2001–2024
97Inventor score
Top patents by PatentIndex Score
41 records- 0199US7598617B2Stack package utilizing through vias and re-distribution linesHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Oct 6, 2009·72 cites·9 claims
- 0299US7525186B2Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Apr 28, 2009·262 cites·5 claims
- 0395US7795139B2Method for manufacturing semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 14, 2010·47 cites·18 claims
- 0491US8299592B2Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modulesSUH MIN SUK·Filed 2009·Granted Oct 30, 2012·22 cites·20 claims
- 0591US7859115B2Semiconductor package for improving characteristics for transmitting signals and powerHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Dec 28, 2010·21 cites·11 claims
- 0690US8018043B2Semiconductor package having side walls and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 13, 2011·13 cites·9 claims
- 0789US8232654B2Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the sameSUH MIN SUK·Filed 2011·Granted Jul 31, 2012·10 cites·14 claims
- 0888US8319327B2Semiconductor package with stacked chips and method for manufacturing the sameSUH MIN SUK·Filed 2011·Granted Nov 27, 2012·10 cites·18 claims
- 0987US8159065B2Semiconductor package having an internal cooling systemSUH MIN SUK·Filed 2009·Granted Apr 17, 2012·14 cites·10 claims
- 1086US7507637B2Method of manufacturing wafer level stack packageHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Mar 24, 2009·16 cites·5 claims
- 1184US7871925B2Stack package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Jan 18, 2011·10 cites·7 claims
- 1282US8358016B2Semiconductor package having an internal cooling systemHYNIX SEMICONDUCTOR INC·Filed 2012·Granted Jan 22, 2013·5 cites·17 claims
- 1381US7446405B2Wafer level chip scale package (WLCSP) with high reliability against thermal stressHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Nov 4, 2008·9 cites·5 claims
- 1477US7911065B2Semiconductor package having a stacked wafer level package and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Mar 22, 2011·6 cites·7 claims
- 1576US7973414B2Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Jul 5, 2011·6 cites·14 claims
- 1674US6574052B2Optical pick-up actuatorLG ELECTRONICS INC·Filed 2001·Granted Jun 3, 2003·9 cites·13 claims
- 1772US8847377B2Stacked wafer level package having a reduced sizeKIM JONG HOON·Filed 2012·Granted Sep 30, 2014·3 cites·11 claims
- 1871US7834463B2Stack package having pattern die redistributionHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Nov 16, 2010·5 cites·6 claims
- 1970US8395245B2Semiconductor package moduleKIM JONG HOON·Filed 2007·Granted Mar 12, 2013·4 cites·18 claims
- 2069US8049341B2Semiconductor package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Nov 1, 2011·3 cites·4 claims
- 2169US6801483B2Optical pickup actuator performable tilting operationLG ELECTRONICS INC·Filed 2001·Granted Oct 5, 2004·7 cites·13 claims
- 2269US6714364B2Optical pick-up actuatorLG ELECTRONICS INC·Filed 2001·Granted Mar 30, 2004·7 cites·13 claims
- 2368US8203217B2Semiconductor package having a stacked wafer level package and method for fabricating the sameSUH MIN SUK·Filed 2011·Granted Jun 19, 2012·2 cites·8 claims
- 2468US8097933B2Flexible semiconductor package and method for fabricating the sameSUH MIN SUK·Filed 2009·Granted Jan 17, 2012·3 cites·10 claims
- 2564US2025096064A1Wafer level chip scale package structure and method of manufacturing wafer level chip scale packageACCELETA CORP·Filed 2024·Application pending·0 cites
- 2663US8202762B2Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the sameKIM SUNG MIN·Filed 2011·Granted Jun 19, 2012·1 cites·10 claims
- 2757US8698283B2Substrate for semiconductor package and semiconductor package having the sameSK HYNIX INC·Filed 2012·Granted Apr 15, 2014·0 cites·10 claims
- 2856US8299582B2Substrate for semiconductor package and semiconductor package having the sameSUH MIN SUK·Filed 2008·Granted Oct 30, 2012·0 cites·19 claims
- 2953US7732931B2Semiconductor package and method for manufacturing the same for decreasing number of processesHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Jun 8, 2010·0 cites·9 claims
- 3052US2009166836A1Stacked wafer level package having a reduced sizeKIM JONG HOON·Filed 2008·Application pending·0 cites
- 3152US2009298229A1Flip chip package and method for manufacturing the sameKIM SEONG CHEOL·Filed 2009·Application pending·0 cites
- 3251US2012299199A1Stacked wafer level package having a reduced sizeKIM JONG HOON·Filed 2012·Application pending·0 cites
- 3350US8361838B2Semiconductor package and method for manufacturing the same via holes in semiconductor chip for plurality stack chipsHYNIX SEMICONDUCTOR INC·Filed 2011·Granted Jan 29, 2013·0 cites·11 claims
- 3449US8524530B2Flexible semiconductor package and method for fabricating the sameSUH MIN SUK·Filed 2011·Granted Sep 3, 2013·0 cites·4 claims
- 3549US2008308949A1Flip chip package and method for manufacturing the sameKIM SEONG CHEOL·Filed 2007·Application pending·0 cites
- 3649US2008157357A1Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the sameKIM SUNG MIN·Filed 2007·Application pending·0 cites
- 3749US2011233795A1Stacked wafer level package having a reduced sizeHYNIX SEMICONDUCTOR INC·Filed 2011·Application pending·0 cites
- 3848US2011287584A1Semiconductor package having side walls and method for manufacturing the sameSUH MIN SUK·Filed 2011·Application pending·0 cites
- 3947US7923294B2Semiconductor package and method for manufacturing the same for decreasing number of processesHYNIX SEMICONDUCTOR INC·Filed 2010·Granted Apr 12, 2011·0 cites·7 claims
- 4039US2003112719A1Optical pickup actuatorLG ELECTRONICS INC·Filed 2002·Application pending·0 cites
- 4138US2011309358A1Semiconductor chip with fine pitch leads for normal testing of sameKIM JONG HOON·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Min Suk Suh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →