Inventor · disambiguated record
Ming Ying
Also filed as: YING MING · YING MING HUA
22 granted patents·1 pending application·435 citations·filing 2004–2023
95Inventor score
Top patents by PatentIndex Score
23 records- 0197US7598606B2Integrated circuit package system with die and package combinationSTATS CHIPPAC LTD·Filed 2005·Granted Oct 6, 2009·87 cites·13 claims
- 0295US10052066B2Appendage mountable electronic devices conformable to surfacesUNIV ILLINOIS·Filed 2016·Granted Aug 21, 2018·14 cites·20 claims
- 0395US7005325B2Semiconductor package with passive device integrationST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·99 cites·10 claims
- 0494US10357201B2Appendage mountable electronic devices conformable to surfacesUNIV ILLINOIS·Filed 2018·Granted Jul 23, 2019·14 cites·20 claims
- 0594US9554484B2Appendage mountable electronic devices conformable to surfacesUNIV ILLINOIS·Filed 2013·Granted Jan 24, 2017·131 cites·34 claims
- 0690US12466766B2Laser bonding of glass to thin metal foilCORNING INC·Filed 2022·Granted Nov 11, 2025·1 cites·18 claims
- 0788US7960816B2Semiconductor package with passive device integrationST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Jun 14, 2011·15 cites·12 claims
- 0886US7388280B2Package stacking lead frame systemSTATS CHIPPAC LTD·Filed 2005·Granted Jun 17, 2008·15 cites·20 claims
- 0984US8102040B2Integrated circuit package system with die and package combinationCHOW SENG GUAN·Filed 2009·Granted Jan 24, 2012·10 cites·17 claims
- 1081US7598599B2Semiconductor package system with substrate having different bondable heights at lead finger tipsSTATS CHIPPAC LTD·Filed 2006·Granted Oct 6, 2009·10 cites·18 claims
- 1179US11799970B1Technologies for cloud-hybrid remote browser isolationWHIST TECH INC·Filed 2023·Granted Oct 24, 2023·5 cites·18 claims
- 1277US7986032B2Semiconductor package system with substrate having different bondable heights at lead finger tipsSTATS CHIPPAC LTD·Filed 2009·Granted Jul 26, 2011·7 cites·18 claims
- 1376US11346984B2Liquid lensesCORNING INC·Filed 2018·Granted May 31, 2022·2 cites·20 claims
- 1470US7064430B2Stacked die packaging and fabrication methodSTATS CHIPPAC LTD·Filed 2004·Granted Jun 20, 2006·16 cites·16 claims
- 1562US9321995B2Stem cell culture medium and its applications as well as a stem cell culture methodSHANGHAI 10TH PEOPLES HOSPITAL·Filed 2013·Granted Apr 26, 2016·2 cites·12 claims
- 1659US7968377B2Integrated circuit protruding pad package systemSTATS CHIPPAC LTD·Filed 2005·Granted Jun 28, 2011·1 cites·4 claims
- 1757US11852560B2Devices with liquid lenses and test methods and assemblies for testing devices with liquid lensesCORNING INC·Filed 2019·Granted Dec 26, 2023·0 cites·18 claims
- 1857US9481915B2Method of screening drugs that promote LOXL1 expressionSHANGHAI TENTH PEOPLE'S HOSPITAL·Filed 2012·Granted Nov 1, 2016·1 cites·12 claims
- 1956US8180427B2Apparatus and method for non-invasively sensing pulse rate and blood flow anomaliesPHUA CHEE TECK·Filed 2006·Granted May 15, 2012·5 cites·33 claims
- 2054US12124103B2Liquid lensCORNING INC·Filed 2019·Granted Oct 22, 2024·0 cites·20 claims
- 2150US11992894B2Method of separating a liquid lens from an array of liquid lensesCORNING INC·Filed 2019·Granted May 28, 2024·0 cites·15 claims
- 2250US8587098B2Integrated circuit protruding pad package system and method for manufacturing thereofCHOW SENG GUAN·Filed 2011·Granted Nov 19, 2013·0 cites·12 claims
- 2338US2022035079A1Variable volume liquid lensesCORNING INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →