Inventor · disambiguated record
Mohammed Kasem
Also filed as: KASEM MOHAMMED
10 granted patents·2 pending applications·103 citations·filing 2001–2016
88Inventor score
Top patents by PatentIndex Score
12 records- 0186US8471381B2Complete power management system implemented in a single surface mount packageOWYANG KING·Filed 2006·Granted Jun 25, 2013·13 cites·22 claims
- 0282US7394150B2Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleysSILICONIX INC·Filed 2004·Granted Jul 1, 2008·35 cites·17 claims
- 0382US7238551B2Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleysSILICONIX INC·Filed 2004·Granted Jul 3, 2007·37 cites·18 claims
- 0475US8928138B2Complete power management system implemented in a single surface mount packageOWYANG KING·Filed 2010·Granted Jan 6, 2015·3 cites·19 claims
- 0565US6858471B1Semiconductor substrate with trenches for reducing substrate resistanceVISHAY SILICONIX·Filed 2002·Granted Feb 22, 2005·11 cites·38 claims
- 0662US9306056B2Semiconductor device with trench-like feed-throughsPATTANAYAK DEVA·Filed 2009·Granted Apr 5, 2016·2 cites·21 claims
- 0759US9093359B2Complete power management system implemented in a single surface mount packageOWYANG KING·Filed 2006·Granted Jul 28, 2015·1 cites·21 claims
- 0851US2015331438A1Complete power management system implemented in a single surface mount packageVISHAY SILICONIX·Filed 2015·Application pending·0 cites
- 0947US10032901B2Semiconductor device with trench-like feed-throughsVISHAY SILICONIX·Filed 2016·Granted Jul 24, 2018·0 cites·15 claims
- 1046US9040356B2Semiconductor including cup-shaped leadframe packaging techniquesCHANG MIKE·Filed 2009·Granted May 26, 2015·0 cites·24 claims
- 1140US6414362B1Power semiconductor deviceSILICONX TAIWAN LTD·Filed 2001·Granted Jul 2, 2002·1 cites·1 claims
- 1233US2001052641A1Power semiconductor deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →