Inventor · disambiguated record
Naonori Akae
Also filed as: AKAE NAONORI
40 granted patents·12 pending applications·1,704 citations·filing 2006–2024
98Inventor score
Top patents by PatentIndex Score
52 records- 0198US9190264B2Method of manufacturing semiconductor device, method of processing substrate and non-transitory computer readable recording mediumYUASA KAZUHIRO·Filed 2012·Granted Nov 17, 2015·479 cites·19 claims
- 0298US8415258B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusAKAE NAONORI·Filed 2011·Granted Apr 9, 2013·480 cites·19 claims
- 0398US8076251B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusAKAE NAONORI·Filed 2010·Granted Dec 13, 2011·489 cites·17 claims
- 0493US8252701B2Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatusSASAJIMA RYOTA·Filed 2010·Granted Aug 28, 2012·16 cites·10 claims
- 0590US10081868B2Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Sep 25, 2018·6 cites·19 claims
- 0687USD725055SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Mar 24, 2015·36 cites·1 claims
- 0786USD739832SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Sep 29, 2015·34 cites·1 claims
- 0886US8925562B1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Jan 6, 2015·6 cites·13 claims
- 0984US10513775B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Dec 24, 2019·4 cites·14 claims
- 1084US8895455B2Method for manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Granted Nov 25, 2014·5 cites·12 claims
- 1184US8895457B2Method of manufacturing semiconductor device and substrate processing apparatusAKAE NAONORI·Filed 2011·Granted Nov 25, 2014·7 cites·20 claims
- 1284USD711843SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Aug 26, 2014·30 cites·1 claims
- 1384US8809204B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2012·Granted Aug 19, 2014·4 cites·25 claims
- 1483US8367557B2Method of forming an insulation film having low impurity concentrationsHITACHI KOKOSAI ELECTRIC INC·Filed 2009·Granted Feb 5, 2013·8 cites·15 claims
- 1583US8202809B2Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatusOTA YOSUKE·Filed 2010·Granted Jun 19, 2012·6 cites·16 claims
- 1681US8609551B2Method for manufacturing semiconductor device and substrate processing apparatusAKAE NAONORI·Filed 2008·Granted Dec 17, 2013·6 cites·24 claims
- 1780US9966251B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 8, 2018·2 cites·14 claims
- 1880US9966252B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 8, 2018·2 cites·15 claims
- 1980US8673790B2Method of manufacturing a semiconductor device, method of cleaning a process vessel, and substrate processing apparatusAKAE NAONORI·Filed 2011·Granted Mar 18, 2014·5 cites·17 claims
- 2079US9508546B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 29, 2016·3 cites·1 claims
- 2177US9425075B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Aug 23, 2016·3 cites·15 claims
- 2277US9401272B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jul 26, 2016·3 cites·17 claims
- 2377US9011601B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Granted Apr 21, 2015·2 cites·14 claims
- 2476US8901014B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus and non-transitory computer readable recording mediumOTA YOSUKE·Filed 2012·Granted Dec 2, 2014·3 cites·14 claims
- 2575USD719114SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Dec 9, 2014·19 cites·1 claims
- 2674US9039838B2Method of manufacturing semiconductor device and substrate processing apparatusSASAJIMA RYOTA·Filed 2012·Granted May 26, 2015·2 cites·10 claims
- 2771US9269566B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Feb 23, 2016·1 cites·15 claims
- 2870US11462401B2Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 4, 2022·2 cites·21 claims
- 2970US9685317B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Jun 20, 2017·2 cites·13 claims
- 3069US10513774B2Substrate processing apparatus and guide portionHITACHI INT ELECTRIC INC·Filed 2016·Granted Dec 24, 2019·1 cites·11 claims
- 3169US9905413B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Feb 27, 2018·1 cites·13 claims
- 3267USD720707SReaction tubeHITACHI INT ELECTRIC INC·Filed 2013·Granted Jan 6, 2015·14 cites·1 claims
- 3366US8524580B2Manufacturing method of semiconductor substrate and substrate processing apparatusAKAE NAONORI·Filed 2010·Granted Sep 3, 2013·2 cites·7 claims
- 3464USD773609SReturn nozzleHITACHI INT ELECTRIC INC·Filed 2015·Granted Dec 6, 2016·10 cites·1 claims
- 3559US9601326B2Method of manufacturing semiconductor device, including film having uniform thicknessHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 21, 2017·1 cites·15 claims
- 3659USD771772SReturn nozzleHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 15, 2016·8 cites·1 claims
- 3758US2024043993A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, cleaning method, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3858US2024222112A1Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3956US2023360904A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 4055US11377730B2Substrate processing apparatus and furnace opening coverKOKUSAI ELECTRIC CORP·Filed 2018·Granted Jul 5, 2022·0 cites·7 claims
- 4153US2018363137A1Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Application pending·0 cites
- 4251US2023295837A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4350US9096928B2Method of manufacturing semiconductor device and substrate processing apparatusSASAJIMA RYOTA·Filed 2011·Granted Aug 4, 2015·0 cites·14 claims
- 4447US2009117714A1Method of producing semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 4546US2008268644A1Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 4646US2017088948A1Substrate processing apparatus and furnace opening coverHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 4745US2009114146A1Method for Manufacturing Semiconductor Device and Substrate Processing ApparatusHITACHI INT ELECTRIC INC·Filed 2006·Application pending·0 cites
- 4845US2015031216A1Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 4940US9196473B2Method of manufacturing an oxynitride film for a semiconductor deviceOTA YOSUKE·Filed 2011·Granted Nov 24, 2015·0 cites·19 claims
- 5039USD771543SReturn nozzleHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 15, 2016·2 cites·1 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →